IT1247293B - Dispositivo transistore di potenza presentante una regione ultra-profonda, a maggior concentrazione - Google Patents
Dispositivo transistore di potenza presentante una regione ultra-profonda, a maggior concentrazioneInfo
- Publication number
- IT1247293B IT1247293B ITMI911121A ITMI911121A IT1247293B IT 1247293 B IT1247293 B IT 1247293B IT MI911121 A ITMI911121 A IT MI911121A IT MI911121 A ITMI911121 A IT MI911121A IT 1247293 B IT1247293 B IT 1247293B
- Authority
- IT
- Italy
- Prior art keywords
- region
- ultra
- greater concentration
- power transistor
- transistor device
- Prior art date
Links
- 230000000903 blocking effect Effects 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000009849 deactivation Effects 0.000 abstract 1
- 238000002513 implantation Methods 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/491—Vertical IGBTs having both emitter contacts and collector contacts in the same substrate side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/662—Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
Landscapes
- Thyristors (AREA)
- Bipolar Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Light Receiving Elements (AREA)
Abstract
Un dispositivo "IGBT" sfrutta la maggior concentrazione nella regione attiva fra basi distanziate, ad una profondità maggiore della profondità delle regioni di base. La dose di impiantagione, che rappresenta la sorgente della maggior concentrazione è pari, approssimativamente, a 3,5 x 10 alla 12 atomi/cm2 e viene pilotata per circa 10 ore, a 1175°C. La durata viene ridotta da una maggior dose di radiazione, per ridurre le perdite di commutazione senza ridurre la tensione di rottura, o aumentare la caduta di tensione diretta oltre i livelli precedenti. La regione di maggior concentrazione permette una riduzione nella spaziatura fra le basi e fornisce una regione con un basso guadagno bipolare localizzato, aumentando la corrente di bloccaggio. L'energia a valanga che il dispositivo può assorbire durante la disattivazione di un carico induttivo aumenta in misura significativa. La regione di conduzione viene formata prima delle regioni del corpo e della sorgente in un nuovo processo.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52117790A | 1990-05-09 | 1990-05-09 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITMI911121A0 ITMI911121A0 (it) | 1991-04-23 |
| ITMI911121A1 ITMI911121A1 (it) | 1992-10-23 |
| IT1247293B true IT1247293B (it) | 1994-12-12 |
Family
ID=24075680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITMI911121A IT1247293B (it) | 1990-05-09 | 1991-04-23 | Dispositivo transistore di potenza presentante una regione ultra-profonda, a maggior concentrazione |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5661314A (it) |
| JP (1) | JP3004077B2 (it) |
| KR (1) | KR950011019B1 (it) |
| AT (1) | AT404525B (it) |
| CA (1) | CA2042069A1 (it) |
| DE (1) | DE4114174A1 (it) |
| FR (1) | FR2662025A1 (it) |
| GB (1) | GB2243952B (it) |
| IT (1) | IT1247293B (it) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5766966A (en) * | 1996-02-09 | 1998-06-16 | International Rectifier Corporation | Power transistor device having ultra deep increased concentration region |
| DE19534388B4 (de) * | 1994-09-19 | 2009-03-19 | International Rectifier Corp., El Segundo | IGBT-Transistorbauteil |
| EP0735591B1 (en) | 1995-03-31 | 1999-09-08 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Improved DMOS device structure, and related manufacturing process |
| JP3581447B2 (ja) * | 1995-08-22 | 2004-10-27 | 三菱電機株式会社 | 高耐圧半導体装置 |
| US6008092A (en) * | 1996-02-12 | 1999-12-28 | International Rectifier Corporation | Short channel IGBT with improved forward voltage drop and improved switching power loss |
| US6040599A (en) * | 1996-03-12 | 2000-03-21 | Mitsubishi Denki Kabushiki Kaisha | Insulated trench semiconductor device with particular layer structure |
| US6043112A (en) * | 1996-07-25 | 2000-03-28 | International Rectifier Corp. | IGBT with reduced forward voltage drop and reduced switching loss |
| EP1895595B8 (en) * | 1996-10-18 | 2013-11-06 | Hitachi, Ltd. | Semiconductor device and electric power conversion apparatus therewith |
| DE19730759C1 (de) | 1997-07-17 | 1998-09-03 | Siemens Ag | Vertikaler Leistungs-MOSFET |
| US6072216A (en) * | 1998-05-01 | 2000-06-06 | Siliconix Incorporated | Vertical DMOS field effect transistor with conformal buried layer for reduced on-resistance |
| US6677626B1 (en) * | 1998-11-11 | 2004-01-13 | Fuji Electric Co., Ltd. | Semiconductor device with alternating conductivity type layer and method of manufacturing the same |
| EP1126527A4 (en) | 1999-04-09 | 2007-06-13 | Shindengen Electric Mfg | HIGH VOLTAGE SEMICONDUCTOR DEVICE |
| US6137139A (en) * | 1999-06-03 | 2000-10-24 | Intersil Corporation | Low voltage dual-well MOS device having high ruggedness, low on-resistance, and improved body diode reverse recovery |
| AU5475100A (en) * | 1999-06-09 | 2000-12-28 | International Rectifier Corporation | Dual epitaxial layer for high voltage vertical conduction power mosfet devices |
| JP4169879B2 (ja) | 1999-08-20 | 2008-10-22 | 新電元工業株式会社 | 高耐圧トランジスタ |
| US6246090B1 (en) | 2000-03-14 | 2001-06-12 | Intersil Corporation | Power trench transistor device source region formation using silicon spacer |
| US8314002B2 (en) * | 2000-05-05 | 2012-11-20 | International Rectifier Corporation | Semiconductor device having increased switching speed |
| US7485920B2 (en) * | 2000-06-14 | 2009-02-03 | International Rectifier Corporation | Process to create buried heavy metal at selected depth |
| US6781194B2 (en) * | 2001-04-11 | 2004-08-24 | Silicon Semiconductor Corporation | Vertical power devices having retrograded-doped transition regions and insulated trench-based electrodes therein |
| US6784486B2 (en) * | 2000-06-23 | 2004-08-31 | Silicon Semiconductor Corporation | Vertical power devices having retrograded-doped transition regions therein |
| US6333253B1 (en) * | 2000-08-24 | 2001-12-25 | Advanced Micro Devices, Inc. | Pattern-block flux deposition |
| US6635926B2 (en) | 2000-08-30 | 2003-10-21 | Shindengen Electric Manufacturing Co., Ltd. | Field effect transistor with high withstand voltage and low resistance |
| DE10193819D2 (de) * | 2000-09-15 | 2004-01-22 | Haecker Automation | Verfahren und Vorrichtung zum Aufbringen fluider Stoffe |
| JP3708014B2 (ja) * | 2000-10-20 | 2005-10-19 | 株式会社東芝 | 半導体装置 |
| GB2373634B (en) * | 2000-10-31 | 2004-12-08 | Fuji Electric Co Ltd | Semiconductor device |
| JP2002246595A (ja) * | 2001-02-19 | 2002-08-30 | Shindengen Electric Mfg Co Ltd | トランジスタ |
| JP4198469B2 (ja) * | 2001-04-11 | 2008-12-17 | シリコン・セミコンダクター・コーポレイション | パワーデバイスとその製造方法 |
| JP5023423B2 (ja) * | 2001-09-27 | 2012-09-12 | サンケン電気株式会社 | 縦型絶縁ゲート型電界効果トランジスタおよびその製造方法 |
| US6781203B2 (en) * | 2001-11-09 | 2004-08-24 | International Rectifier Corporation | MOSFET with reduced threshold voltage and on resistance and process for its manufacture |
| JP3973934B2 (ja) * | 2002-03-15 | 2007-09-12 | 株式会社東芝 | 高耐圧半導体装置 |
| DE10330571B8 (de) * | 2003-07-07 | 2007-03-08 | Infineon Technologies Ag | Vertikale Leistungshalbleiterbauelemente mit Injektionsdämpfungsmittel im Rand bereich und Herstellungsverfahren dafür |
| US7180152B2 (en) * | 2004-07-08 | 2007-02-20 | International Rectifier Corporation | Process for resurf diffusion for high voltage MOSFET |
| KR100722909B1 (ko) * | 2005-08-30 | 2007-05-30 | 닛산 지도우샤 가부시키가이샤 | 반도체 장치 |
| JP5116225B2 (ja) * | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| US7655977B2 (en) * | 2005-10-18 | 2010-02-02 | International Rectifier Corporation | Trench IGBT for highly capacitive loads |
| US7956419B2 (en) * | 2005-11-02 | 2011-06-07 | International Rectifier Corporation | Trench IGBT with depletion stop layer |
| WO2013140473A1 (ja) * | 2012-03-23 | 2013-09-26 | パナソニック株式会社 | 半導体素子 |
| JP6024751B2 (ja) * | 2012-07-18 | 2016-11-16 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2014030457A1 (ja) | 2012-08-22 | 2014-02-27 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US9263271B2 (en) * | 2012-10-25 | 2016-02-16 | Infineon Technologies Ag | Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device |
| US9530844B2 (en) | 2012-12-28 | 2016-12-27 | Cree, Inc. | Transistor structures having reduced electrical field at the gate oxide and methods for making same |
| US10115815B2 (en) | 2012-12-28 | 2018-10-30 | Cree, Inc. | Transistor structures having a deep recessed P+ junction and methods for making same |
| US9331197B2 (en) | 2013-08-08 | 2016-05-03 | Cree, Inc. | Vertical power transistor device |
| US10600903B2 (en) | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
| US10868169B2 (en) * | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
| CN104517837B (zh) * | 2013-09-29 | 2017-10-10 | 无锡华润上华科技有限公司 | 一种绝缘栅双极型晶体管的制造方法 |
| US20150263145A1 (en) * | 2014-03-14 | 2015-09-17 | Cree, Inc. | Igbt structure for wide band-gap semiconductor materials |
| US9337284B2 (en) * | 2014-04-07 | 2016-05-10 | Alpha And Omega Semiconductor Incorporated | Closed cell lateral MOSFET using silicide source and body regions |
| DE102014005879B4 (de) * | 2014-04-16 | 2021-12-16 | Infineon Technologies Ag | Vertikale Halbleitervorrichtung |
| US20150311325A1 (en) * | 2014-04-23 | 2015-10-29 | Cree, Inc. | Igbt structure on sic for high performance |
| JP6706786B2 (ja) * | 2015-10-30 | 2020-06-10 | 一般財団法人電力中央研究所 | エピタキシャルウェハの製造方法、エピタキシャルウェハ、半導体装置の製造方法及び半導体装置 |
| DE102016015475B3 (de) * | 2016-12-28 | 2018-01-11 | 3-5 Power Electronics GmbH | IGBT Halbleiterstruktur |
| US10615274B2 (en) | 2017-12-21 | 2020-04-07 | Cree, Inc. | Vertical semiconductor device with improved ruggedness |
| US11489069B2 (en) | 2017-12-21 | 2022-11-01 | Wolfspeed, Inc. | Vertical semiconductor device with improved ruggedness |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR569811A (fr) * | 1923-08-20 | 1924-04-18 | Suspension compensée pour véhicules à moteurs | |
| DE940699C (de) * | 1952-12-18 | 1956-03-22 | Kurt Koerber & Co K G | Vorrichtung zum Durchschneiden von Filterstaeben zur Herstellung von Filtermundstueckzigaretten |
| US4206540A (en) * | 1978-06-02 | 1980-06-10 | International Rectifier Corporation | Schottky device and method of manufacture using palladium and platinum intermetallic alloys and titanium barrier |
| DK157272C (da) * | 1978-10-13 | 1990-04-30 | Int Rectifier Corp | Mosfet med hoej effekt |
| JPS5553462A (en) * | 1978-10-13 | 1980-04-18 | Int Rectifier Corp | Mosfet element |
| US4364073A (en) * | 1980-03-25 | 1982-12-14 | Rca Corporation | Power MOSFET with an anode region |
| US4593302B1 (en) * | 1980-08-18 | 1998-02-03 | Int Rectifier Corp | Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide |
| US4398344A (en) * | 1982-03-08 | 1983-08-16 | International Rectifier Corporation | Method of manufacture of a schottky using platinum encapsulated between layers of palladium sintered into silicon surface |
| JPS59149058A (ja) * | 1983-02-15 | 1984-08-25 | Matsushita Electric Works Ltd | Mos型トランジスタ |
| JPS59167066A (ja) * | 1983-03-14 | 1984-09-20 | Nissan Motor Co Ltd | 縦形mosfet |
| JPS6010677A (ja) * | 1983-06-30 | 1985-01-19 | Nissan Motor Co Ltd | 縦型mosトランジスタ |
| JP2644989B2 (ja) * | 1984-05-09 | 1997-08-25 | 株式会社東芝 | 導電変調型mosfet |
| US4672407A (en) * | 1984-05-30 | 1987-06-09 | Kabushiki Kaisha Toshiba | Conductivity modulated MOSFET |
| JPS61150378A (ja) * | 1984-12-25 | 1986-07-09 | Toshiba Corp | 電界効果トランジスタ |
| EP0222326A2 (en) * | 1985-11-12 | 1987-05-20 | General Electric Company | Method of fabricating an improved insulated gate semiconductor device |
| JPS62115873A (ja) * | 1985-11-15 | 1987-05-27 | Matsushita Electronics Corp | 縦型mos電界効果トランジスタ |
| JPH0834221B2 (ja) * | 1986-03-21 | 1996-03-29 | 日本電装株式会社 | 電流検出機能付半導体装置 |
| JP2751926B2 (ja) * | 1986-12-22 | 1998-05-18 | 日産自動車株式会社 | 電導度変調形mosfet |
| JPS6449273A (en) * | 1987-08-19 | 1989-02-23 | Mitsubishi Electric Corp | Semiconductor device and its manufacture |
| JP2771172B2 (ja) * | 1988-04-01 | 1998-07-02 | 日本電気株式会社 | 縦型電界効果トランジスタ |
| JPH01287965A (ja) * | 1988-05-13 | 1989-11-20 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPH0237777A (ja) * | 1988-07-27 | 1990-02-07 | Nec Corp | 縦型電界効果トランジスタ |
| JPH0247874A (ja) * | 1988-08-10 | 1990-02-16 | Fuji Electric Co Ltd | Mos型半導体装置の製造方法 |
| US4925812A (en) * | 1989-09-21 | 1990-05-15 | International Rectifier Corporation | Platinum diffusion process |
-
1991
- 1991-04-23 IT ITMI911121A patent/IT1247293B/it active IP Right Grant
- 1991-04-30 DE DE4114174A patent/DE4114174A1/de not_active Ceased
- 1991-05-03 FR FR9105460A patent/FR2662025A1/fr not_active Withdrawn
- 1991-05-08 CA CA002042069A patent/CA2042069A1/en not_active Abandoned
- 1991-05-08 AT AT0095691A patent/AT404525B/de not_active IP Right Cessation
- 1991-05-09 GB GB9110071A patent/GB2243952B/en not_active Expired - Fee Related
- 1991-05-09 JP JP3104491A patent/JP3004077B2/ja not_active Expired - Lifetime
- 1991-05-09 KR KR91007564A patent/KR950011019B1/ko not_active Expired - Fee Related
-
1994
- 1994-09-30 US US08/316,112 patent/US5661314A/en not_active Expired - Lifetime
-
1997
- 1997-02-27 US US08/807,387 patent/US5904510A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ITMI911121A1 (it) | 1992-10-23 |
| FR2662025A1 (fr) | 1991-11-15 |
| AT404525B (de) | 1998-12-28 |
| US5661314A (en) | 1997-08-26 |
| JPH04229660A (ja) | 1992-08-19 |
| CA2042069A1 (en) | 1991-11-10 |
| JP3004077B2 (ja) | 2000-01-31 |
| DE4114174A1 (de) | 1991-11-14 |
| KR950011019B1 (en) | 1995-09-27 |
| ATA95691A (de) | 1998-04-15 |
| GB9110071D0 (en) | 1991-07-03 |
| US5904510A (en) | 1999-05-18 |
| KR910020923A (ko) | 1991-12-20 |
| GB2243952A (en) | 1991-11-13 |
| ITMI911121A0 (it) | 1991-04-23 |
| GB2243952B (en) | 1994-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted | ||
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970423 |