IT1296864B1 - Dospositivo di memoria a semiconduttore non volatile avente un elettrodo di porta fluttuante - Google Patents
Dospositivo di memoria a semiconduttore non volatile avente un elettrodo di porta fluttuanteInfo
- Publication number
- IT1296864B1 IT1296864B1 IT97MI002762A ITMI972762A IT1296864B1 IT 1296864 B1 IT1296864 B1 IT 1296864B1 IT 97MI002762 A IT97MI002762 A IT 97MI002762A IT MI972762 A ITMI972762 A IT MI972762A IT 1296864 B1 IT1296864 B1 IT 1296864B1
- Authority
- IT
- Italy
- Prior art keywords
- doser
- semiconductor memory
- volatile semiconductor
- floating door
- door electrode
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7883—Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9054906A JPH10256400A (ja) | 1997-03-10 | 1997-03-10 | 不揮発性半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI972762A1 ITMI972762A1 (it) | 1999-06-12 |
IT1296864B1 true IT1296864B1 (it) | 1999-08-02 |
Family
ID=12983656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT97MI002762A IT1296864B1 (it) | 1997-03-10 | 1997-12-12 | Dospositivo di memoria a semiconduttore non volatile avente un elettrodo di porta fluttuante |
Country Status (6)
Country | Link |
---|---|
US (1) | US5901084A (it) |
JP (1) | JPH10256400A (it) |
KR (1) | KR19980079362A (it) |
DE (1) | DE19752434C2 (it) |
IT (1) | IT1296864B1 (it) |
TW (1) | TW338193B (it) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
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US6965142B2 (en) * | 1995-03-07 | 2005-11-15 | Impinj, Inc. | Floating-gate semiconductor structures |
TW365001B (en) * | 1996-10-17 | 1999-07-21 | Hitachi Ltd | Non-volatile semiconductor memory apparatus and the operation method |
ITTO980557A1 (it) * | 1998-06-26 | 1999-12-26 | St Microelectronics Srl | Metodo di programmazione rapida per effetto tunnel di memorie a porta flottante |
JP2000150680A (ja) * | 1998-11-12 | 2000-05-30 | Fujitsu Ltd | 半導体記憶装置 |
KR20010008442A (ko) * | 1998-12-31 | 2001-02-05 | 김영환 | 반도체소자의 트랜지스터 형성방법 |
AU6918300A (en) * | 1999-09-24 | 2001-04-30 | Intel Corporation | A nonvolatile memory device with a high work function floating-gate and method of fabrication |
US6518618B1 (en) | 1999-12-03 | 2003-02-11 | Intel Corporation | Integrated memory cell and method of fabrication |
US6313486B1 (en) | 2000-06-15 | 2001-11-06 | Board Of Regents, The University Of Texas System | Floating gate transistor having buried strained silicon germanium channel layer |
US6313487B1 (en) | 2000-06-15 | 2001-11-06 | Board Of Regents, The University Of Texas System | Vertical channel floating gate transistor having silicon germanium channel layer |
US6664909B1 (en) | 2001-08-13 | 2003-12-16 | Impinj, Inc. | Method and apparatus for trimming high-resolution digital-to-analog converter |
JP4329293B2 (ja) * | 2002-01-10 | 2009-09-09 | ソニー株式会社 | 不揮発性半導体メモリ装置および電荷注入方法 |
KR100466187B1 (ko) * | 2002-05-17 | 2005-01-13 | 주식회사 하이닉스반도체 | 플래시 메모리 셀 |
US6950342B2 (en) * | 2002-07-05 | 2005-09-27 | Impinj, Inc. | Differential floating gate nonvolatile memories |
US7221596B2 (en) * | 2002-07-05 | 2007-05-22 | Impinj, Inc. | pFET nonvolatile memory |
US6760270B2 (en) * | 2002-09-30 | 2004-07-06 | Motorola, Inc. | Erase of a non-volatile memory |
US8691647B1 (en) * | 2002-10-07 | 2014-04-08 | Spansion Llc | Memory devices containing a high-K dielectric layer |
US6962851B2 (en) * | 2003-03-19 | 2005-11-08 | Promos Technologies, Inc. | Nonvolatile memories and methods of fabrication |
US6962852B2 (en) | 2003-03-19 | 2005-11-08 | Promos Technologies Inc. | Nonvolatile memories and methods of fabrication |
US6995060B2 (en) * | 2003-03-19 | 2006-02-07 | Promos Technologies Inc. | Fabrication of integrated circuit elements in structures with protruding features |
US6893921B2 (en) * | 2003-04-10 | 2005-05-17 | Mosel Vitelic, Inc. | Nonvolatile memories with a floating gate having an upward protrusion |
US6974739B2 (en) * | 2003-05-16 | 2005-12-13 | Promos Technologies Inc. | Fabrication of dielectric on a gate surface to insulate the gate from another element of an integrated circuit |
US6846712B2 (en) * | 2003-05-16 | 2005-01-25 | Promos Technologies Inc. | Fabrication of gate dielectric in nonvolatile memories having select, floating and control gates |
US7214585B2 (en) * | 2003-05-16 | 2007-05-08 | Promos Technologies Inc. | Methods of fabricating integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges |
US6902974B2 (en) * | 2003-05-16 | 2005-06-07 | Promos Technologies Inc. | Fabrication of conductive gates for nonvolatile memories from layers with protruding portions |
US7101757B2 (en) * | 2003-07-30 | 2006-09-05 | Promos Technologies, Inc. | Nonvolatile memory cells with buried channel transistors |
US7052947B2 (en) * | 2003-07-30 | 2006-05-30 | Promos Technologies Inc. | Fabrication of gate dielectric in nonvolatile memories in which a memory cell has multiple floating gates |
US7169667B2 (en) * | 2003-07-30 | 2007-01-30 | Promos Technologies Inc. | Nonvolatile memory cell with multiple floating gates formed after the select gate |
US6885044B2 (en) | 2003-07-30 | 2005-04-26 | Promos Technologies, Inc. | Arrays of nonvolatile memory cells wherein each cell has two conductive floating gates |
US7060565B2 (en) * | 2003-07-30 | 2006-06-13 | Promos Technologies Inc. | Fabrication of dielectric for a nonvolatile memory cell having multiple floating gates |
US6951782B2 (en) * | 2003-07-30 | 2005-10-04 | Promos Technologies, Inc. | Nonvolatile memory cell with multiple floating gates formed after the select gate and having upward protrusions |
TWI220252B (en) * | 2003-08-06 | 2004-08-11 | Ememory Technology Inc | Method for programming, erasing and reading a flash memory cell |
US7145370B2 (en) * | 2003-09-05 | 2006-12-05 | Impinj, Inc. | High-voltage switches in single-well CMOS processes |
US7088623B2 (en) * | 2003-10-16 | 2006-08-08 | United Microelectronics Corp. | Non-volatile memory technology suitable for flash and byte operation application |
US7238575B2 (en) * | 2004-03-10 | 2007-07-03 | Promos Technologies, Inc. | Fabrication of conductive lines interconnecting conductive gates in nonvolatile memories, and non-volatile memory structures |
US7148104B2 (en) * | 2004-03-10 | 2006-12-12 | Promos Technologies Inc. | Fabrication of conductive lines interconnecting first conductive gates in nonvolatile memories having second conductive gates provided by conductive gate lines, wherein the adjacent conductive gate lines for the adjacent columns are spaced from each other, and non-volatile memory structures |
US7177182B2 (en) * | 2004-03-30 | 2007-02-13 | Impinj, Inc. | Rewriteable electronic fuses |
US7388420B2 (en) * | 2004-03-30 | 2008-06-17 | Impinj, Inc. | Rewriteable electronic fuses |
US7242614B2 (en) * | 2004-03-30 | 2007-07-10 | Impinj, Inc. | Rewriteable electronic fuses |
US7283390B2 (en) * | 2004-04-21 | 2007-10-16 | Impinj, Inc. | Hybrid non-volatile memory |
US8111558B2 (en) * | 2004-05-05 | 2012-02-07 | Synopsys, Inc. | pFET nonvolatile memory |
US8896048B1 (en) * | 2004-06-04 | 2014-11-25 | Spansion Llc | Apparatus and method for source side implantation after spacer formation to reduce short channel effects in metal oxide semiconductor field effect transistors |
KR100647482B1 (ko) | 2004-09-16 | 2006-11-23 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
US8482052B2 (en) * | 2005-01-03 | 2013-07-09 | Macronix International Co., Ltd. | Silicon on insulator and thin film transistor bandgap engineered split gate memory |
US7257033B2 (en) * | 2005-03-17 | 2007-08-14 | Impinj, Inc. | Inverter non-volatile memory cell and array system |
US7679957B2 (en) * | 2005-03-31 | 2010-03-16 | Virage Logic Corporation | Redundant non-volatile memory cell |
JP2007053171A (ja) | 2005-08-16 | 2007-03-01 | Toshiba Corp | 不揮発性半導体メモリ装置 |
US8122307B1 (en) | 2006-08-15 | 2012-02-21 | Synopsys, Inc. | One time programmable memory test structures and methods |
JP2008270364A (ja) * | 2007-04-17 | 2008-11-06 | Toyota Motor Corp | 不揮発性半導体記憶素子 |
US7719896B1 (en) | 2007-04-24 | 2010-05-18 | Virage Logic Corporation | Configurable single bit/dual bits memory |
EP2068351A1 (en) * | 2007-12-03 | 2009-06-10 | INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM vzw (IMEC) | Floating gate non-volatile memory device and method for manufacturing same |
US7894261B1 (en) | 2008-05-22 | 2011-02-22 | Synopsys, Inc. | PFET nonvolatile memory |
US8125835B2 (en) * | 2008-09-22 | 2012-02-28 | Cypress Semiconductor Corporation | Memory architecture having two independently controlled voltage pumps |
CN102376715B (zh) * | 2010-08-11 | 2014-03-12 | 中国科学院微电子研究所 | 一种无电容型动态随机访问存储器结构及其制备方法 |
US20120043600A1 (en) * | 2010-08-18 | 2012-02-23 | Van Der Vegt Henderikus Albert | Floating-Gate Device and Method Therefor |
CN102468342A (zh) * | 2010-11-10 | 2012-05-23 | 中国科学院微电子研究所 | 一种半导体存储单元、器件及其制备方法 |
JP2014179361A (ja) * | 2013-03-13 | 2014-09-25 | Toshiba Corp | 不揮発性半導体記憶装置およびその製造方法 |
JP2014183293A (ja) * | 2013-03-21 | 2014-09-29 | Toshiba Corp | 不揮発性半導体記憶装置 |
Family Cites Families (10)
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US3744036A (en) * | 1971-05-24 | 1973-07-03 | Intel Corp | Electrically programmable read only memory array |
JP2633571B2 (ja) * | 1987-07-30 | 1997-07-23 | 株式会社東芝 | 紫外線消去型不揮発性半導体装置 |
JPH07118511B2 (ja) * | 1989-01-17 | 1995-12-18 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JPH0425176A (ja) * | 1990-05-18 | 1992-01-28 | Seiko Instr Inc | 半導体装置の製造方法 |
US5260593A (en) * | 1991-12-10 | 1993-11-09 | Micron Technology, Inc. | Semiconductor floating gate device having improved channel-floating gate interaction |
JP3071578B2 (ja) * | 1992-10-13 | 2000-07-31 | 沖電気工業株式会社 | 不揮発性半導体記憶装置 |
JPH07169861A (ja) * | 1993-12-14 | 1995-07-04 | Nec Corp | 不揮発性半導体記憶装置 |
JP3541958B2 (ja) * | 1993-12-16 | 2004-07-14 | 株式会社東芝 | 不揮発性半導体記憶装置 |
US5508543A (en) * | 1994-04-29 | 1996-04-16 | International Business Machines Corporation | Low voltage memory |
JP3673538B2 (ja) * | 1994-11-28 | 2005-07-20 | 沖電気工業株式会社 | 不揮発性半導体記憶装置の形成方法 |
-
1997
- 1997-03-10 JP JP9054906A patent/JPH10256400A/ja active Pending
- 1997-07-24 TW TW086110542A patent/TW338193B/zh active
- 1997-09-12 KR KR1019970047059A patent/KR19980079362A/ko not_active Application Discontinuation
- 1997-09-23 US US08/933,764 patent/US5901084A/en not_active Expired - Fee Related
- 1997-11-26 DE DE19752434A patent/DE19752434C2/de not_active Expired - Fee Related
- 1997-12-12 IT IT97MI002762A patent/IT1296864B1/it active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE19752434C2 (de) | 2000-10-19 |
US5901084A (en) | 1999-05-04 |
DE19752434A1 (de) | 1998-09-24 |
JPH10256400A (ja) | 1998-09-25 |
KR19980079362A (ko) | 1998-11-25 |
TW338193B (en) | 1998-08-11 |
ITMI972762A1 (it) | 1999-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |