IN2015DN00551A - - Google Patents
Info
- Publication number
- IN2015DN00551A IN2015DN00551A IN551DEN2015A IN2015DN00551A IN 2015DN00551 A IN2015DN00551 A IN 2015DN00551A IN 551DEN2015 A IN551DEN2015 A IN 551DEN2015A IN 2015DN00551 A IN2015DN00551 A IN 2015DN00551A
- Authority
- IN
- India
- Prior art keywords
- insulating layer
- elasticity modulus
- layer
- sandwiched
- substrate
- Prior art date
Links
- 239000010410 layer Substances 0.000 abstract 7
- 239000012792 core layer Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012141508 | 2012-06-22 | ||
JP2012177980 | 2012-08-10 | ||
JP2012179095 | 2012-08-10 | ||
PCT/JP2013/001678 WO2013190748A1 (ja) | 2012-06-22 | 2013-03-13 | 基板、撮像ユニットおよび撮像装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2015DN00551A true IN2015DN00551A (ru) | 2015-06-26 |
Family
ID=49768363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN551DEN2015 IN2015DN00551A (ru) | 2012-06-22 | 2013-03-13 |
Country Status (6)
Country | Link |
---|---|
US (3) | US9743510B2 (ru) |
EP (2) | EP3592121B1 (ru) |
JP (3) | JPWO2013190748A1 (ru) |
CN (2) | CN104584701B (ru) |
IN (1) | IN2015DN00551A (ru) |
WO (1) | WO2013190748A1 (ru) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104584701B (zh) * | 2012-06-22 | 2018-11-13 | 株式会社尼康 | 基板、拍摄单元及拍摄装置 |
JP6253070B2 (ja) * | 2013-09-30 | 2017-12-27 | エルジー・ケム・リミテッド | 有機電子素子用基板およびこの製造方法 |
JP6357784B2 (ja) * | 2014-02-03 | 2018-07-18 | 株式会社ニコン | 撮像ユニット及び撮像装置 |
US10375280B2 (en) * | 2014-07-18 | 2019-08-06 | Fuji Corporation | Imaging device with improved heat dissipation including a board section between a first and a second housing |
US10580811B2 (en) * | 2015-11-24 | 2020-03-03 | Sony Corporation | Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus |
CN108432352B (zh) * | 2015-12-25 | 2019-11-26 | 太阳诱电株式会社 | 印刷布线板和摄像组件 |
JP6972523B2 (ja) * | 2016-09-13 | 2021-11-24 | セイコーエプソン株式会社 | 電子機器 |
US10133158B2 (en) * | 2016-10-17 | 2018-11-20 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
JP7383866B2 (ja) * | 2017-01-09 | 2023-11-21 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | プリント回路基板 |
JP2018120968A (ja) * | 2017-01-25 | 2018-08-02 | 太陽誘電株式会社 | プリント配線板、プリント配線板を用いたモジュールおよびプリント配線板を用いたカメラモジュール |
US10580725B2 (en) * | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US10602608B2 (en) | 2017-08-22 | 2020-03-24 | Taiyo Yuden Co., Ltd. | Circuit board |
JP6745770B2 (ja) * | 2017-08-22 | 2020-08-26 | 太陽誘電株式会社 | 回路基板 |
JP6783724B2 (ja) * | 2017-08-22 | 2020-11-11 | 太陽誘電株式会社 | 回路基板 |
JP2019076358A (ja) * | 2017-10-24 | 2019-05-23 | オリンパス株式会社 | 撮像モジュール、内視鏡、撮像モジュールの製造方法 |
DE102018109920A1 (de) * | 2018-04-25 | 2019-10-31 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlung von leistungselektronischen Schaltungen |
TW202015208A (zh) * | 2018-10-09 | 2020-04-16 | 南茂科技股份有限公司 | 基板結構以及半導體封裝 |
JP2020064998A (ja) * | 2018-10-18 | 2020-04-23 | キヤノン株式会社 | 実装基板およびその製造方法 |
EP3886170A4 (en) * | 2018-11-20 | 2022-08-17 | LG Innotek Co., Ltd. | SUBSTRATE FOR AN IMAGE SENSOR |
WO2021010173A1 (ja) * | 2019-07-12 | 2021-01-21 | ソニーセミコンダクタソリューションズ株式会社 | 配線モジュール及び撮像装置 |
CN114450795A (zh) * | 2019-09-30 | 2022-05-06 | 株式会社尼康 | 拍摄元件及拍摄装置 |
JP7262626B2 (ja) * | 2020-01-22 | 2023-04-21 | 日立Astemo株式会社 | 撮像装置 |
US20230087792A1 (en) * | 2020-05-06 | 2023-03-23 | Veea Inc. | Method and Procedure for Miniaturing a Multi-layer PCB |
US12035060B2 (en) * | 2021-11-05 | 2024-07-09 | Omnivision Technologies, Inc. | Stacked image sensor |
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JPS6473695A (en) * | 1987-09-14 | 1989-03-17 | Mitsubishi Plastics Ind | Substrate for printed-circuit board |
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JP5397037B2 (ja) | 2009-06-25 | 2014-01-22 | 株式会社ニコン | 固体撮像装置 |
JP2011059272A (ja) | 2009-09-08 | 2011-03-24 | Canon Inc | 撮像装置 |
CN102550138B (zh) * | 2009-09-28 | 2015-07-22 | 京瓷株式会社 | 结构体及其制造方法 |
US20110232953A1 (en) * | 2010-03-29 | 2011-09-29 | Kyocera Corporation | Circuit board and structure using the same |
JP5582904B2 (ja) | 2010-07-22 | 2014-09-03 | 矢崎総業株式会社 | メタルコア基板とその製造方法 |
KR101456088B1 (ko) * | 2010-07-30 | 2014-11-03 | 쿄세라 코포레이션 | 절연 시트, 그 제조방법 및 그 절연 시트를 사용한 구조체의 제조방법 |
CN104584701B (zh) * | 2012-06-22 | 2018-11-13 | 株式会社尼康 | 基板、拍摄单元及拍摄装置 |
US9877387B2 (en) * | 2013-03-27 | 2018-01-23 | Kyocera Corporation | Wiring board and mounting structure using same |
-
2013
- 2013-03-13 CN CN201380043799.6A patent/CN104584701B/zh active Active
- 2013-03-13 WO PCT/JP2013/001678 patent/WO2013190748A1/ja unknown
- 2013-03-13 CN CN201811210483.2A patent/CN109616485B/zh active Active
- 2013-03-13 IN IN551DEN2015 patent/IN2015DN00551A/en unknown
- 2013-03-13 JP JP2014520869A patent/JPWO2013190748A1/ja active Pending
- 2013-03-13 EP EP19194875.1A patent/EP3592121B1/en active Active
- 2013-03-13 EP EP13806277.3A patent/EP2866535B1/en active Active
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2014
- 2014-12-22 US US14/579,108 patent/US9743510B2/en active Active
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2017
- 2017-08-15 JP JP2017156964A patent/JP6344516B2/ja active Active
- 2017-08-17 US US15/679,340 patent/US10412824B2/en active Active
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2018
- 2018-05-24 JP JP2018100081A patent/JP6711370B2/ja active Active
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2019
- 2019-07-29 US US16/524,568 patent/US11343907B2/en active Active
Also Published As
Publication number | Publication date |
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EP2866535A1 (en) | 2015-04-29 |
US9743510B2 (en) | 2017-08-22 |
EP2866535B1 (en) | 2019-09-04 |
JPWO2013190748A1 (ja) | 2016-02-08 |
CN109616485A (zh) | 2019-04-12 |
CN104584701A (zh) | 2015-04-29 |
EP3592121A1 (en) | 2020-01-08 |
JP6711370B2 (ja) | 2020-06-17 |
US20170374735A1 (en) | 2017-12-28 |
US20150181698A1 (en) | 2015-06-25 |
US20190350076A1 (en) | 2019-11-14 |
EP2866535A4 (en) | 2016-03-16 |
JP2018166207A (ja) | 2018-10-25 |
CN104584701B (zh) | 2018-11-13 |
US11343907B2 (en) | 2022-05-24 |
CN109616485B (zh) | 2024-08-27 |
JP2018029180A (ja) | 2018-02-22 |
WO2013190748A1 (ja) | 2013-12-27 |
JP6344516B2 (ja) | 2018-06-20 |
US10412824B2 (en) | 2019-09-10 |
EP3592121B1 (en) | 2021-02-17 |
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