HK22189A - A semiconductor memory device and a method of manufacture thereof - Google Patents

A semiconductor memory device and a method of manufacture thereof

Info

Publication number
HK22189A
HK22189A HK221/89A HK22189A HK22189A HK 22189 A HK22189 A HK 22189A HK 221/89 A HK221/89 A HK 221/89A HK 22189 A HK22189 A HK 22189A HK 22189 A HK22189 A HK 22189A
Authority
HK
Hong Kong
Prior art keywords
manufacture
memory device
semiconductor memory
semiconductor
memory
Prior art date
Application number
HK221/89A
Other languages
English (en)
Inventor
Mitsumasa Koyanagi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK22189A publication Critical patent/HK22189A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
HK221/89A 1983-04-15 1989-03-16 A semiconductor memory device and a method of manufacture thereof HK22189A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58065432A JPH0666436B2 (ja) 1983-04-15 1983-04-15 半導体集積回路装置

Publications (1)

Publication Number Publication Date
HK22189A true HK22189A (en) 1989-03-24

Family

ID=13286935

Family Applications (1)

Application Number Title Priority Date Filing Date
HK221/89A HK22189A (en) 1983-04-15 1989-03-16 A semiconductor memory device and a method of manufacture thereof

Country Status (9)

Country Link
US (1) US5021842A (xx)
JP (1) JPH0666436B2 (xx)
KR (1) KR920007331B1 (xx)
DE (1) DE3414057A1 (xx)
FR (1) FR2544537B1 (xx)
GB (1) GB2138207B (xx)
HK (1) HK22189A (xx)
IT (1) IT1176006B (xx)
SG (1) SG77088G (xx)

Families Citing this family (40)

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US5357131A (en) * 1982-03-10 1994-10-18 Hitachi, Ltd. Semiconductor memory with trench capacitor
FR2554954B1 (fr) * 1983-11-11 1989-05-12 Hitachi Ltd Dispositif de memoire a semi-conducteurs
JPS60113460A (ja) * 1983-11-25 1985-06-19 Oki Electric Ind Co Ltd ダイナミックメモリ素子の製造方法
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JPH0616549B2 (ja) * 1984-04-17 1994-03-02 三菱電機株式会社 半導体集積回路装置
DE3565339D1 (en) * 1984-04-19 1988-11-03 Nippon Telegraph & Telephone Semiconductor memory device and method of manufacturing the same
US4791463A (en) * 1984-10-31 1988-12-13 Texas Instruments Incorporated Structure for contacting devices in three dimensional circuitry
JPS61135151A (ja) * 1984-12-05 1986-06-23 Mitsubishi Electric Corp 半導体記憶装置
JPS61140168A (ja) * 1984-12-12 1986-06-27 Toshiba Corp 半導体記憶装置
FR2575335B1 (fr) * 1984-12-21 1987-06-19 Thomson Csf Element capacitif integre sur une pastille de circuit integre, et procede de realisation de cet element capacitif
JPS61179568A (ja) * 1984-12-29 1986-08-12 Fujitsu Ltd 半導体記憶装置の製造方法
JPS61212055A (ja) * 1985-03-18 1986-09-20 Oki Electric Ind Co Ltd 半導体記憶装置
JP2604705B2 (ja) * 1985-04-03 1997-04-30 松下電子工業株式会社 Ｍｏｓキヤパシタの製造方法
JPS61258468A (ja) * 1985-05-13 1986-11-15 Hitachi Ltd 半導体記憶装置およびその製造方法
JPH0750745B2 (ja) * 1985-10-03 1995-05-31 株式会社日立製作所 半導体装置
US4704368A (en) * 1985-10-30 1987-11-03 International Business Machines Corporation Method of making trench-incorporated monolithic semiconductor capacitor and high density dynamic memory cells including the capacitor
US6028346A (en) * 1986-04-25 2000-02-22 Mitsubishi Denki Kabushiki Kaisha Isolated trench semiconductor device
JP2593524B2 (ja) * 1988-07-25 1997-03-26 株式会社東芝 半導体装置の製造方法
US4918454A (en) * 1988-10-13 1990-04-17 Crystal Semiconductor Corporation Compensated capacitors for switched capacitor input of an analog-to-digital converter
US5208597A (en) * 1988-10-13 1993-05-04 Crystal Semiconductor Compensated capacitors for switched capacitor input of an analog-to-digital converter
US5225698A (en) * 1989-08-12 1993-07-06 Samsung Electronics Co., Inc. Semi-conductor device with stacked trench capacitor
DE3932683A1 (de) * 1989-09-29 1991-04-11 Siemens Ag Verfahren zur herstellung eines grabenkondensators einer ein-transistor-speicherzelle in einem halbleitersubstrat mit einer selbstjustierten kondensator-gegenelektrode
KR920007909B1 (ko) * 1989-11-18 1992-09-19 삼성전자 주식회사 램 테스트시 고속 기록방법
KR920004028B1 (ko) * 1989-11-20 1992-05-22 삼성전자 주식회사 반도체 장치 및 그 제조방법
JPH03171663A (ja) * 1989-11-29 1991-07-25 Toshiba Corp 半導体記憶装置およびその製造方法
EP0439634B1 (en) * 1990-01-24 1996-12-18 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor device including a trench capacitor
US5005103A (en) * 1990-06-05 1991-04-02 Samsung Electronics Co., Ltd. Method of manufacturing folded capacitors in semiconductor and folded capacitors fabricated thereby
US5075817A (en) * 1990-06-22 1991-12-24 Ramtron Corporation Trench capacitor for large scale integrated memory
US5354701A (en) * 1991-04-18 1994-10-11 Industrial Technology Research Institute Doubled stacked trench capacitor DRAM and method of fabricating
KR970001894B1 (en) * 1991-09-13 1997-02-18 Nippon Electric Kk Semiconductor memory device
US5589847A (en) * 1991-09-23 1996-12-31 Xerox Corporation Switched capacitor analog circuits using polysilicon thin film technology
JP3749776B2 (ja) 1997-02-28 2006-03-01 株式会社東芝 半導体装置
TW580736B (en) * 2000-04-27 2004-03-21 Hitachi Ltd Fabrication method for semiconductor device
US6737699B2 (en) * 2002-06-27 2004-05-18 Intel Corporation Enhanced on-chip decoupling capacitors and method of making same
US6984860B2 (en) * 2002-11-27 2006-01-10 Semiconductor Components Industries, L.L.C. Semiconductor device with high frequency parallel plate trench capacitor structure
TWI270198B (en) * 2004-03-29 2007-01-01 Promos Technologies Inc An array structure, mask and fabrication method of a dynamic random access memory
JP4456027B2 (ja) * 2005-03-25 2010-04-28 Ｏｋｉセミコンダクタ株式会社 貫通導電体の製造方法
KR20100071211A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 셀 어레이로 인가되는 리키지 커런트를 막는 더미 셀 비트 라인 구조를 갖는 반도체 소자 및 그 형성 방법
US9171848B2 (en) 2013-11-22 2015-10-27 GlobalFoundries, Inc. Deep trench MIM capacitor and moat isolation with epitaxial semiconductor wafer scheme
US10460787B1 (en) 2018-05-16 2019-10-29 Palo Alto Research Center Incorporated Selection circuit usable with ferroelectric memory

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
BE789501A (fr) * 1971-09-30 1973-03-29 Siemens Ag Condensateur electrique dans un circuit integre, utilise notamment comme memoire pour une memoire a semiconducteur
US3892608A (en) * 1974-02-28 1975-07-01 Motorola Inc Method for filling grooves and moats used on semiconductor devices
US4119772A (en) * 1974-10-31 1978-10-10 Chloride Group Limited Lead acid cells and batteries
JPS5812739B2 (ja) * 1975-05-07 1983-03-10 株式会社日立製作所 半導体記憶装置
JPS6037619B2 (ja) * 1976-11-17 1985-08-27 株式会社東芝 半導体メモリ装置
DE2728928A1 (de) * 1977-06-27 1979-01-18 Siemens Ag Ein-transistor-speicherelement
US4139442A (en) * 1977-09-13 1979-02-13 International Business Machines Corporation Reactive ion etching method for producing deep dielectric isolation in silicon
US4475118A (en) * 1978-12-21 1984-10-02 National Semiconductor Corporation Dynamic MOS RAM with storage cells having a mainly insulated first plate
US4216489A (en) * 1979-01-22 1980-08-05 Bell Telephone Laboratories, Incorporated MOS Dynamic memory in a diffusion current limited semiconductor structure
US4252579A (en) * 1979-05-07 1981-02-24 International Business Machines Corporation Method for making single electrode U-MOSFET random access memory utilizing reactive ion etching and polycrystalline deposition
EP0024905B1 (en) * 1979-08-25 1985-01-16 Zaidan Hojin Handotai Kenkyu Shinkokai Insulated-gate field-effect transistor
JPS5847862B2 (ja) * 1979-08-30 1983-10-25 富士通株式会社 半導体記憶装置及びその製造方法
JPS5643753A (en) * 1979-09-18 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Semiconductor memory storage
US4353086A (en) * 1980-05-07 1982-10-05 Bell Telephone Laboratories, Incorporated Silicon integrated circuits
US4397075A (en) * 1980-07-03 1983-08-09 International Business Machines Corporation FET Memory cell structure and process
JPS5832789B2 (ja) * 1980-07-18 1983-07-15 富士通株式会社 半導体メモリ
JPS583260A (ja) * 1981-06-29 1983-01-10 Fujitsu Ltd 竪型埋め込みキヤパシタ
DE3128014A1 (de) * 1981-07-15 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Anordnung zur reduzierung der empfindlichkeit von integrierten halbleiterspeichern gegen alpha-strahlung
DE3137708A1 (de) * 1981-09-22 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Integratorschaltung mit einem differenzverstaerker
JPS58137245A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd 大規模半導体メモリ
JPS58154256A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS59141262A (ja) * 1983-02-02 1984-08-13 Nec Corp 半導体メモリセル

Also Published As

Publication number Publication date
FR2544537A1 (fr) 1984-10-19
JPH0666436B2 (ja) 1994-08-24
FR2544537B1 (fr) 1990-08-31
IT8420481A0 (it) 1984-04-10
JPS59191373A (ja) 1984-10-30
GB2138207B (en) 1987-04-01
GB2138207A (en) 1984-10-17
DE3414057C2 (xx) 1993-07-22
KR840008539A (ko) 1984-12-15
GB8405975D0 (en) 1984-04-11
IT1176006B (it) 1987-08-12
DE3414057A1 (de) 1984-10-18
KR920007331B1 (ko) 1992-08-31
US5021842A (en) 1991-06-04
SG77088G (en) 1989-03-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)