HK1204386A1 - Paste composition for electrodes, and solar cell - Google Patents
Paste composition for electrodes, and solar cellInfo
- Publication number
- HK1204386A1 HK1204386A1 HK15104863.9A HK15104863A HK1204386A1 HK 1204386 A1 HK1204386 A1 HK 1204386A1 HK 15104863 A HK15104863 A HK 15104863A HK 1204386 A1 HK1204386 A1 HK 1204386A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electrodes
- solar cell
- paste composition
- paste
- composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/02245—Electrode arrangements specially adapted for back-contact solar cells for metallisation wrap-through [MWT] type solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010013512 | 2010-01-25 | ||
JP2010222203A JP5633285B2 (ja) | 2010-01-25 | 2010-09-30 | 電極用ペースト組成物及び太陽電池 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1204386A1 true HK1204386A1 (en) | 2015-11-13 |
Family
ID=44307016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15104863.9A HK1204386A1 (en) | 2010-01-25 | 2015-05-21 | Paste composition for electrodes, and solar cell |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2530683B1 (ko) |
JP (1) | JP5633285B2 (ko) |
KR (1) | KR101859236B1 (ko) |
CN (3) | CN104392771B (ko) |
HK (1) | HK1204386A1 (ko) |
TW (2) | TWI515946B (ko) |
WO (1) | WO2011090215A1 (ko) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222738A1 (en) * | 2011-03-02 | 2012-09-06 | Electronics And Telecommunications Research Institute | Conductive composition, silicon solar cell including the same, and manufacturing method thereof |
JP5120477B2 (ja) * | 2011-04-07 | 2013-01-16 | 日立化成工業株式会社 | 電極用ペースト組成物及び太陽電池 |
US9224517B2 (en) | 2011-04-07 | 2015-12-29 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
JP5879790B2 (ja) * | 2011-07-20 | 2016-03-08 | 日立化成株式会社 | 電極用ペースト組成物および太陽電池 |
MY173371A (en) * | 2011-07-21 | 2020-01-21 | Hitachi Chemical Co Ltd | Conductive material |
CN103688365B (zh) * | 2011-07-25 | 2016-09-28 | 日立化成株式会社 | 元件及太阳能电池 |
WO2013015285A1 (ja) * | 2011-07-25 | 2013-01-31 | 日立化成工業株式会社 | 素子および太陽電池 |
EP2764000A4 (en) * | 2011-08-26 | 2015-10-14 | Heraeus Precious Metals North America Conshohocken Llc | FIRE ALUMINUM PASTE FOR SINX AND BETTER BSF EDUCATION |
US8901414B2 (en) * | 2011-09-14 | 2014-12-02 | International Business Machines Corporation | Photovoltaic cells with copper grid |
EP2782102A4 (en) * | 2011-11-14 | 2015-07-15 | Hitachi Chemical Co Ltd | PULP COMPOSITION FOR ELECTRODE, SOLAR CELL ELEMENT, SOLAR CELL |
US20130180583A1 (en) * | 2012-01-17 | 2013-07-18 | E I Du Pont De Nemours And Company | Conductive paste for fine-line high-aspect-ratio screen printing in the manufacture of semiconductor devices |
US8956557B2 (en) | 2012-01-24 | 2015-02-17 | E I Du Pont De Nemours And Company | Thick film silver paste containing copper and lead—tellurium—oxide and its use in the manufacture of semiconductor devices |
CN103311348A (zh) * | 2012-03-08 | 2013-09-18 | 茂迪股份有限公司 | 太阳能电池及其制造方法 |
KR101315105B1 (ko) * | 2012-03-23 | 2013-10-07 | (주)창성 | 태양전지용 전극 페이스트 조성물 |
US20130248777A1 (en) * | 2012-03-26 | 2013-09-26 | Heraeus Precious Metals North America Conshohocken Llc | Low silver content paste composition and method of making a conductive film therefrom |
JP2013243279A (ja) | 2012-05-22 | 2013-12-05 | Namics Corp | 太陽電池の電極形成用導電性ペースト |
US9023922B2 (en) | 2012-05-24 | 2015-05-05 | Sabic Global Technologies B.V. | Flame retardant compositions, articles comprising the same and methods of manufacture thereof |
US9394483B2 (en) | 2012-05-24 | 2016-07-19 | Sabic Global Technologies B.V. | Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same |
JP5408322B2 (ja) * | 2012-10-09 | 2014-02-05 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池 |
JP2014077101A (ja) * | 2012-10-12 | 2014-05-01 | Hitachi Chemical Co Ltd | リン含有銅合金粒子を用いた接着剤組成物及びそれを用いた半導体装置 |
TWI632207B (zh) * | 2013-07-01 | 2018-08-11 | 德商漢高智慧財產控股公司 | 奈米粒子墨水組成物、方法及應用 |
JP2015111563A (ja) * | 2013-11-06 | 2015-06-18 | Dowaエレクトロニクス株式会社 | 銅粒子分散液およびそれを用いた導電膜の製造方法 |
US9793025B2 (en) * | 2013-12-03 | 2017-10-17 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
JP2015133317A (ja) * | 2013-12-10 | 2015-07-23 | Dowaエレクトロニクス株式会社 | 導電性ペーストおよびそれを用いた導電膜の製造方法 |
WO2015115565A1 (ja) * | 2014-01-31 | 2015-08-06 | 日立化成株式会社 | 電極形成用組成物、電極、太陽電池素子及びその製造方法並びに太陽電池 |
JP6098858B2 (ja) * | 2014-06-30 | 2017-03-22 | 株式会社村田製作所 | 導電性ペースト、及びガラス物品 |
EP2966121A1 (en) * | 2014-07-09 | 2016-01-13 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive paste with characteristic weight loss for high temperature application |
EP2966124A1 (en) * | 2014-07-09 | 2016-01-13 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive paste with characteristic weight loss for low temperature application |
DE102014221679B4 (de) * | 2014-10-24 | 2016-12-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Silber enthaltenden Glaspulvers sowie die Verwendung des Glaspulvers |
JP2016115873A (ja) * | 2014-12-17 | 2016-06-23 | 京都エレックス株式会社 | 太陽電池電極形成用導電性ペースト、並びに、これを用いた太陽電池素子および太陽電池モジュール |
JP2016131078A (ja) * | 2015-01-13 | 2016-07-21 | Dowaエレクトロニクス株式会社 | 導電性ペーストおよびそれを用いた導電膜の製造方法 |
JP6433351B2 (ja) * | 2015-03-19 | 2018-12-05 | 株式会社ノリタケカンパニーリミテド | 被覆銅粉末、銅ペースト、および銅導体膜 |
JP2016176133A (ja) * | 2015-03-23 | 2016-10-06 | 株式会社村田製作所 | 銅粉末および該銅粉末を用いた導電性ペースト |
JP6065049B2 (ja) * | 2015-05-11 | 2017-01-25 | 日立化成株式会社 | 電極用ペースト組成物および太陽電池 |
US11646246B2 (en) * | 2016-11-18 | 2023-05-09 | Samtec, Inc. | Method of fabricating a glass substrate with a plurality of vias |
CN107482071A (zh) * | 2017-07-24 | 2017-12-15 | 协鑫集成科技股份有限公司 | 异质结太阳能电池及其制备方法 |
JP6958257B2 (ja) * | 2017-11-08 | 2021-11-02 | Agc株式会社 | ガラス組成物、ガラス粉末、導電ペーストおよび太陽電池 |
CN115053339A (zh) | 2019-09-30 | 2022-09-13 | 申泰公司 | 导电导孔及其制造方法 |
JP7192743B2 (ja) * | 2019-11-07 | 2022-12-20 | 株式会社村田製作所 | 外部電極用ペースト |
US11842958B2 (en) | 2022-03-18 | 2023-12-12 | Chun-Ming Lin | Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure |
US11764153B1 (en) | 2022-07-28 | 2023-09-19 | Chun-Ming Lin | Interconnect structure and manufacturing method for the same |
US12087662B1 (en) | 2023-06-12 | 2024-09-10 | Chun-Ming Lin | Semiconductor package structure having thermal management structure |
CN116844755A (zh) * | 2023-07-28 | 2023-10-03 | 广东风华高新科技股份有限公司 | 一种铜端电极浆料及其制备方法与应用 |
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JPS63118466A (ja) | 1986-11-04 | 1988-05-23 | 富士変速機株式会社 | 横行格納台車の横行駆動装置 |
JPH06290635A (ja) * | 1993-04-01 | 1994-10-18 | Toray Ind Inc | 感光性導電ペースト |
JP4354047B2 (ja) * | 1998-06-19 | 2009-10-28 | 京都エレックス株式会社 | ビア充填用導電ペースト組成物 |
US6228288B1 (en) * | 2000-04-27 | 2001-05-08 | Cts Corporation | Electrically conductive compositions and films for position sensors |
JP3848069B2 (ja) | 2000-09-22 | 2006-11-22 | 株式会社東芝 | 半導体記憶装置 |
KR100832282B1 (ko) * | 2000-10-23 | 2008-05-26 | 세키스이가가쿠 고교가부시키가이샤 | 피복 입자 |
JP4158713B2 (ja) * | 2004-02-03 | 2008-10-01 | 住友金属鉱山株式会社 | 外部電極用銅ペースト組成物 |
JP4916107B2 (ja) * | 2004-03-10 | 2012-04-11 | 株式会社村田製作所 | 導電性ペーストおよびこれを用いたセラミック電子部品 |
US7176152B2 (en) * | 2004-06-09 | 2007-02-13 | Ferro Corporation | Lead-free and cadmium-free conductive copper thick film pastes |
WO2006038720A1 (ja) * | 2004-10-06 | 2006-04-13 | Showa Denko K.K. | ニオブ粉、ニオブ造粒物、ニオブ焼結体及びコンデンサ並びにそれらの製造方法 |
CN101107678B (zh) * | 2005-01-25 | 2012-03-07 | 藤仓化成株式会社 | 导电浆料 |
US7494607B2 (en) | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
JP4796815B2 (ja) * | 2005-10-25 | 2011-10-19 | 釜屋電機株式会社 | 超小形チップ抵抗器及び超小形チップ抵抗器用抵抗体ペースト。 |
JP4894266B2 (ja) * | 2006-01-06 | 2012-03-14 | 住友金属鉱山株式会社 | 導電粉の表面処理方法と導電粉及び導電性ペースト |
JP5139659B2 (ja) * | 2006-09-27 | 2013-02-06 | Dowaエレクトロニクス株式会社 | 銀粒子複合粉末およびその製造法 |
JP5309521B2 (ja) | 2006-10-11 | 2013-10-09 | 三菱マテリアル株式会社 | 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法 |
US20100096014A1 (en) * | 2006-12-25 | 2010-04-22 | Hideyo Iida | Conductive paste for solar cell |
JP4885781B2 (ja) * | 2007-03-30 | 2012-02-29 | 日立粉末冶金株式会社 | 導電性ペースト |
CN101295739B (zh) * | 2007-04-26 | 2010-09-29 | 比亚迪股份有限公司 | 太阳能电池正面电极用导电浆料及其制备方法 |
JP4709238B2 (ja) | 2008-02-08 | 2011-06-22 | 株式会社日立製作所 | Cu系配線用材料およびそれを用いた電子部品 |
-
2010
- 2010-09-30 JP JP2010222203A patent/JP5633285B2/ja active Active
-
2011
- 2011-01-25 TW TW100102721A patent/TWI515946B/zh not_active IP Right Cessation
- 2011-01-25 TW TW104121141A patent/TWI591881B/zh not_active IP Right Cessation
- 2011-01-25 WO PCT/JP2011/051366 patent/WO2011090215A1/ja active Application Filing
- 2011-01-25 CN CN201410659024.8A patent/CN104392771B/zh active Active
- 2011-01-25 CN CN2011800066840A patent/CN102870167A/zh active Pending
- 2011-01-25 KR KR1020127020756A patent/KR101859236B1/ko active IP Right Grant
- 2011-01-25 EP EP11734821.9A patent/EP2530683B1/en not_active Not-in-force
- 2011-01-25 CN CN201510323228.9A patent/CN105006269A/zh active Pending
-
2015
- 2015-05-21 HK HK15104863.9A patent/HK1204386A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201140914A (en) | 2011-11-16 |
WO2011090215A1 (ja) | 2011-07-28 |
EP2530683B1 (en) | 2018-07-25 |
TW201541692A (zh) | 2015-11-01 |
KR101859236B1 (ko) | 2018-05-18 |
EP2530683A4 (en) | 2013-11-06 |
CN102870167A (zh) | 2013-01-09 |
EP2530683A1 (en) | 2012-12-05 |
CN104392771A (zh) | 2015-03-04 |
TWI515946B (zh) | 2016-01-01 |
KR20120124439A (ko) | 2012-11-13 |
JP5633285B2 (ja) | 2014-12-03 |
CN104392771B (zh) | 2020-01-07 |
CN105006269A (zh) | 2015-10-28 |
JP2011171272A (ja) | 2011-09-01 |
TWI591881B (zh) | 2017-07-11 |
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