JP4709238B2 - Cu系配線用材料およびそれを用いた電子部品 - Google Patents
Cu系配線用材料およびそれを用いた電子部品 Download PDFInfo
- Publication number
- JP4709238B2 JP4709238B2 JP2008028298A JP2008028298A JP4709238B2 JP 4709238 B2 JP4709238 B2 JP 4709238B2 JP 2008028298 A JP2008028298 A JP 2008028298A JP 2008028298 A JP2008028298 A JP 2008028298A JP 4709238 B2 JP4709238 B2 JP 4709238B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- glass
- powder
- electronic component
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
- B62J1/00—Saddles or other seats for cycles; Arrangement thereof; Component parts
- B62J1/18—Covers for saddles or other seats; Paddings
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
- A41D13/05—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches protecting only a particular body part
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
- A41D13/05—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches protecting only a particular body part
- A41D13/055—Protector fastening, e.g. on the human body
- A41D13/0556—Protector fastening, e.g. on the human body with releasable fastening means
- A41D13/0562—Protector fastening, e.g. on the human body with releasable fastening means with hook and loop fastener
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Description
11 背面板
12 隔壁
13 封着材料
15,16,17 赤色,緑色,青色の蛍光体
18 表示電極
19 アドレス電極
20 紫外線
21,22,402 誘電体層
23 保護層
24,26 金属クロム膜
25 Cu−Al合金膜
27 純Cu円板
28 純Al
30 配線
31 グリーンシート
32 貫通孔
401 Cu系材料
403 泡
Claims (9)
- ガラスまたはガラスセラミックス部材と接する配線を有する電子部品であって、
前記配線がCu及びAlからなる2元合金で、かつ、Al含有量が3.0〜15.0wt%であり、
前記配線は、大気中で基板上に形成され、ガラス或いは該ガラスを含むガラスセラミックスにより直に被覆されることを特徴とする電子部品。 - 請求項1において、前記配線がさらにガラスを含み、印刷法により基板上に形成されることを特徴とする電子部品。
- 請求項1において、前記配線が印刷法によってガラス或いはガラスセラミックスのグリーンシートの空孔部及び表面に形成され、該グリーンシートを積層,焼成し、該配線が三次元的に組み込まれたことを特徴とする電子部品。
- 請求項1〜3に記載の電子部品が、システムオンフィルム,テープキャリアパッケージ,低温焼成セラミックス多層配線基板,プラズマディスプレイ,液晶ディスプレイ,有機ELディスプレイ、あるいは太陽電池であること特徴とする電子部品。
- 請求項1〜4の電子部品の配線に用いる配線用材料であって、導電性金属材料粉末とガラス粉末を含み、該導電性金属材料粉末がCu及びAlからなる2元合金で、かつ、Al含有量が3.0〜15.0wt%であることを特徴とする配線用材料。
- 請求項5において、前記導電性金属材料粉末が粒子粉末の成形形態を有することを特徴とする配線用材料。
- 請求項5において、前記導電性金属材料粉末が65〜90vol.%、ガラス粉末が10〜35vol.%であることを特徴とする配線用材料。
- 請求項5において、さらに、バインダーと溶剤を含むことを特徴とする配線用材料。
- 請求項5に記載の配線用材料をスパッタリング法で作製するためのスパッタターゲットであって、CuまたはAlが各々単体金属としてターゲット内に埋め込まれた構造、あるいは、Cu及びAlの2元合金で構成された構造を有することを特徴とするスパッタターゲット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008028298A JP4709238B2 (ja) | 2008-02-08 | 2008-02-08 | Cu系配線用材料およびそれを用いた電子部品 |
KR1020090009225A KR101093045B1 (ko) | 2008-02-08 | 2009-02-05 | Cu계 배선용 재료 및 그것을 사용한 전자부품 |
US12/366,707 US20090200070A1 (en) | 2008-02-08 | 2009-02-06 | Cu-BASED WIRING MATERIAL AND ELECTRONIC COMPONENT USING THE SAME |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008028298A JP4709238B2 (ja) | 2008-02-08 | 2008-02-08 | Cu系配線用材料およびそれを用いた電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009188281A JP2009188281A (ja) | 2009-08-20 |
JP4709238B2 true JP4709238B2 (ja) | 2011-06-22 |
Family
ID=40937928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008028298A Expired - Fee Related JP4709238B2 (ja) | 2008-02-08 | 2008-02-08 | Cu系配線用材料およびそれを用いた電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090200070A1 (ja) |
JP (1) | JP4709238B2 (ja) |
KR (1) | KR101093045B1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8602213B2 (en) * | 2009-10-28 | 2013-12-10 | The Procter & Gamble Company | Product display system for disposable absorbent article containers having enhanced visibility and recognition |
JP5633285B2 (ja) | 2010-01-25 | 2014-12-03 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池 |
CN102695358B (zh) * | 2011-03-25 | 2015-04-08 | 中山市云创知识产权服务有限公司 | 印刷电路板 |
JP5120477B2 (ja) | 2011-04-07 | 2013-01-16 | 日立化成工業株式会社 | 電極用ペースト組成物及び太陽電池 |
JP5768455B2 (ja) | 2011-04-14 | 2015-08-26 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池素子 |
EP2782102A4 (en) | 2011-11-14 | 2015-07-15 | Hitachi Chemical Co Ltd | PULP COMPOSITION FOR ELECTRODE, SOLAR CELL ELEMENT, SOLAR CELL |
CN104245203B (zh) * | 2012-03-05 | 2016-10-12 | 株式会社村田制作所 | 接合方法、电子装置的制造方法和电子部件 |
JP5598739B2 (ja) | 2012-05-18 | 2014-10-01 | 株式会社マテリアル・コンセプト | 導電性ペースト |
CN105229750A (zh) | 2013-05-13 | 2016-01-06 | 日立化成株式会社 | 电极形成用组合物,太阳能电池元件和太阳能电池 |
KR20150117762A (ko) * | 2014-04-10 | 2015-10-21 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
CN104064286B (zh) * | 2014-07-10 | 2016-04-20 | 吴旦英 | 一种太阳能电池用银浆的制备方法 |
US20170211185A1 (en) * | 2016-01-22 | 2017-07-27 | Applied Materials, Inc. | Ceramic showerhead with embedded conductive layers |
KR102551354B1 (ko) * | 2018-04-20 | 2023-07-04 | 삼성전자 주식회사 | 반도체 발광 소자 및 그 제조 방법 |
JP2023124653A (ja) * | 2022-02-25 | 2023-09-06 | Jx金属株式会社 | スパッタリングターゲット及びその製造方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01124297A (ja) * | 1987-11-09 | 1989-05-17 | Hitachi Ltd | 多層配線基板 |
JPH06349316A (ja) * | 1993-06-11 | 1994-12-22 | Tdk Corp | 導電ペースト |
JPH07105721A (ja) * | 1993-10-07 | 1995-04-21 | Murata Mfg Co Ltd | 導電性ペーストの製造方法 |
JPH08125341A (ja) * | 1994-10-25 | 1996-05-17 | Hitachi Ltd | 電子回路装置 |
JPH11121934A (ja) * | 1997-10-13 | 1999-04-30 | Ngk Spark Plug Co Ltd | 低損失多層配線基板 |
JP2001243836A (ja) * | 1999-12-21 | 2001-09-07 | Murata Mfg Co Ltd | 導電性ペースト及びそれを用いた印刷配線板 |
WO2003064722A1 (fr) * | 2002-01-30 | 2003-08-07 | Nikko Materials Company, Limited | Cible de pulverisation d'alliage de cuivre et procede de fabrication de cette cible |
JP2004228445A (ja) * | 2003-01-24 | 2004-08-12 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP2006128005A (ja) * | 2004-10-29 | 2006-05-18 | Murata Mfg Co Ltd | 導電性ペーストおよび印刷配線板 |
JP2006140404A (ja) * | 2004-11-15 | 2006-06-01 | Renesas Technology Corp | 半導体装置 |
JP2006351671A (ja) * | 2005-06-14 | 2006-12-28 | Alps Electric Co Ltd | 配線基板 |
JP2007019483A (ja) * | 2005-06-09 | 2007-01-25 | Ngk Spark Plug Co Ltd | 配線基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51133127A (en) * | 1975-05-16 | 1976-11-18 | Hitachi Ltd | Abrasion resistant aluminum bronze |
JPS60254697A (ja) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | 多層セラミック回路基板および製法 |
US4712161A (en) * | 1985-03-25 | 1987-12-08 | Olin Corporation | Hybrid and multi-layer circuitry |
US20040072009A1 (en) * | 1999-12-16 | 2004-04-15 | Segal Vladimir M. | Copper sputtering targets and methods of forming copper sputtering targets |
JP2005063797A (ja) | 2003-08-11 | 2005-03-10 | Pioneer Plasma Display Corp | プラズマディスプレイパネル用電極材料,プラズマディスプレイパネルの製造方法,プラズマ表示装置 |
JP2008034214A (ja) * | 2006-07-28 | 2008-02-14 | Fujitsu Hitachi Plasma Display Ltd | プラズマディスプレイパネル及びその製造方法 |
-
2008
- 2008-02-08 JP JP2008028298A patent/JP4709238B2/ja not_active Expired - Fee Related
-
2009
- 2009-02-05 KR KR1020090009225A patent/KR101093045B1/ko not_active IP Right Cessation
- 2009-02-06 US US12/366,707 patent/US20090200070A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01124297A (ja) * | 1987-11-09 | 1989-05-17 | Hitachi Ltd | 多層配線基板 |
JPH06349316A (ja) * | 1993-06-11 | 1994-12-22 | Tdk Corp | 導電ペースト |
JPH07105721A (ja) * | 1993-10-07 | 1995-04-21 | Murata Mfg Co Ltd | 導電性ペーストの製造方法 |
JPH08125341A (ja) * | 1994-10-25 | 1996-05-17 | Hitachi Ltd | 電子回路装置 |
JPH11121934A (ja) * | 1997-10-13 | 1999-04-30 | Ngk Spark Plug Co Ltd | 低損失多層配線基板 |
JP2001243836A (ja) * | 1999-12-21 | 2001-09-07 | Murata Mfg Co Ltd | 導電性ペースト及びそれを用いた印刷配線板 |
WO2003064722A1 (fr) * | 2002-01-30 | 2003-08-07 | Nikko Materials Company, Limited | Cible de pulverisation d'alliage de cuivre et procede de fabrication de cette cible |
JP2004228445A (ja) * | 2003-01-24 | 2004-08-12 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP2006128005A (ja) * | 2004-10-29 | 2006-05-18 | Murata Mfg Co Ltd | 導電性ペーストおよび印刷配線板 |
JP2006140404A (ja) * | 2004-11-15 | 2006-06-01 | Renesas Technology Corp | 半導体装置 |
JP2007019483A (ja) * | 2005-06-09 | 2007-01-25 | Ngk Spark Plug Co Ltd | 配線基板 |
JP2006351671A (ja) * | 2005-06-14 | 2006-12-28 | Alps Electric Co Ltd | 配線基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20090086325A (ko) | 2009-08-12 |
KR101093045B1 (ko) | 2011-12-13 |
JP2009188281A (ja) | 2009-08-20 |
US20090200070A1 (en) | 2009-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4709238B2 (ja) | Cu系配線用材料およびそれを用いた電子部品 | |
JP3389240B2 (ja) | プラズマディスプレイパネルおよびその製造方法 | |
CN103052605B (zh) | 电极用玻璃组合物、使用该组合物的电极膏、以及使用该电极膏的电子部件 | |
JP3389243B1 (ja) | プラズマディスプレイパネルおよびその製造方法 | |
WO2010109541A1 (ja) | 導電性ペースト及びそれを用いた電極配線を具備する電子部品 | |
JP2010161331A (ja) | 電極,電極ペースト及びそれを用いた電子部品 | |
TW201036929A (en) | Low softening point glass composition, bonding material using same and electronic parts | |
US6774558B2 (en) | Plasma display panel and method of making the same | |
US6614184B2 (en) | Display panel and display panel production method | |
JP5517495B2 (ja) | 配線部材、その製造方法及びそれを用いた電子部品 | |
JP2003162962A (ja) | プラズマディスプレイパネルおよびその製造方法 | |
US20080238316A1 (en) | Plasma dispaly panel and manufacturing method of the same | |
JP4924304B2 (ja) | 導電性黒色ペースト組成物及び該組成物を用いたバス電極の製造方法 | |
JP3317161B2 (ja) | プラズマディスプレイパネル | |
JP5474936B2 (ja) | Cu−Al−Co系合金の電極・配線を具備した電子部品及びCu−Al−Co系合金の電極・配線用材料ならびにそれを用いた電極・配線用ペースト材料 | |
TW201437405A (zh) | 電子零件用積層配線膜及被覆層形成用濺鍍靶材 | |
JPH11109888A (ja) | 積層電極 | |
JP3317175B2 (ja) | プラズマディスプレイパネル | |
JP5202134B2 (ja) | 無鉛低温ガラスフリット、それを用いた無鉛低温ガラスフリットペースト材料,画像表示装置及びicセラミックスパッケージ | |
KR20060116117A (ko) | 플라즈마 디스플레이 패널의 제조방법 | |
JP2004165079A (ja) | ディスプレイ用基板 | |
CN101341569B (zh) | 平面型显示装置 | |
JPH08162027A (ja) | 誘電体組成物およびプラズマディスプレイパネル | |
JP2525278B2 (ja) | 直流型放電表示管および放電表示管用酸化物陰極の製造方法 | |
JP2001057152A (ja) | カラーpdpの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100309 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100510 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101019 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101220 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110215 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110317 |
|
LAPS | Cancellation because of no payment of annual fees |