JP5474936B2 - Cu−Al−Co系合金の電極・配線を具備した電子部品及びCu−Al−Co系合金の電極・配線用材料ならびにそれを用いた電極・配線用ペースト材料 - Google Patents
Cu−Al−Co系合金の電極・配線を具備した電子部品及びCu−Al−Co系合金の電極・配線用材料ならびにそれを用いた電極・配線用ペースト材料 Download PDFInfo
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- JP5474936B2 JP5474936B2 JP2011508252A JP2011508252A JP5474936B2 JP 5474936 B2 JP5474936 B2 JP 5474936B2 JP 2011508252 A JP2011508252 A JP 2011508252A JP 2011508252 A JP2011508252 A JP 2011508252A JP 5474936 B2 JP5474936 B2 JP 5474936B2
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- 239000000463 material Substances 0.000 title claims description 67
- 229910018185 Al—Co Inorganic materials 0.000 title description 57
- 239000000956 alloy Substances 0.000 title description 49
- 229910045601 alloy Inorganic materials 0.000 title description 48
- 239000011521 glass Substances 0.000 claims description 82
- 239000000843 powder Substances 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- 239000002241 glass-ceramic Substances 0.000 claims description 21
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 21
- 239000006104 solid solution Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 16
- 239000007769 metal material Substances 0.000 claims description 15
- 229910002515 CoAl Inorganic materials 0.000 claims description 13
- 239000003245 coal Substances 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 10
- 229910000765 intermetallic Inorganic materials 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000010949 copper Substances 0.000 description 110
- 239000010410 layer Substances 0.000 description 63
- 239000012298 atmosphere Substances 0.000 description 35
- 230000003647 oxidation Effects 0.000 description 31
- 238000007254 oxidation reaction Methods 0.000 description 31
- 238000010438 heat treatment Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000011651 chromium Substances 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 230000001590 oxidative effect Effects 0.000 description 15
- 238000002076 thermal analysis method Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 13
- 238000005192 partition Methods 0.000 description 12
- 238000010304 firing Methods 0.000 description 11
- 238000013508 migration Methods 0.000 description 10
- 230000005012 migration Effects 0.000 description 10
- 238000010587 phase diagram Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 8
- 238000000605 extraction Methods 0.000 description 7
- 239000002923 metal particle Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000005477 sputtering target Methods 0.000 description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 3
- 229910002520 CoCu Inorganic materials 0.000 description 3
- 229910017767 Cu—Al Inorganic materials 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 230000006399 behavior Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002003 electrode paste Substances 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910016570 AlCu Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000001757 thermogravimetry curve Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 208000025174 PANDAS Diseases 0.000 description 1
- 208000021155 Paediatric autoimmune neuropsychiatric disorders associated with streptococcal infection Diseases 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000013142 basic testing Methods 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/22—Electrodes
- H01J2211/225—Material of electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Energy (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
Description
β;AlCu3
γ1;Al4Cu9
δ;〜Al2Cu3 (<680℃)
ε2;〜Al2Cu3(<850-560℃)
η1;AlCu
τ;Al5CoCu4
ω;〜Al6CoCu3
κ;〜Al3CoCu
ψ;〜Al10Co3Cu
2,21,22 誘電体層
3 泡
10 前面板
11 背面板
12 隔壁
13 封着材料
14 セル
15,16,17 赤色,緑色,青色の蛍光体
18 表示電極
19 アドレス電極
20 紫外線
23 保護層
24,26 金属クロム膜
25 Cu−Al−Co合金膜
27 純Cuの円板
28 純Al及び純Co
30 配線
31 グリーンシート
32 貫通孔
130 半導体基板
131 拡散層
132 反射防止層
133 受光面電極
134 集電電極
135 出力取出し電極
136 電極成分拡散層
Claims (10)
- 電極または配線を有する電子部品であって、前記電極または配線の一部または全部が、Al含有量:10at%〜25at%,Co含有量:5at%〜20at%、残部がCu及び不可避不純物で構成される化学組成を有し、CuにAlとCoが溶け込んだCu固溶体と、CoAl金属間化合物の2相が共存した3元系合金であることを特徴とする電子部品。
- 請求項1において、前記電極または配線が、ガラスまたはガラスセラミックス部材と接する構造を有することを特徴とする電子部品。
- 請求項1において、前記電極・配線はスパッタリング法により基板上に形成され、ガラス或いはガラスセラミックスにより被覆,焼成されたことを特徴とする電子部品。
- 請求項1において、前記電極・配線がさらにガラス成分を含むことを特徴とする電子部品。
- 請求項1において、前記電極または配線が印刷法によってガラス或いはガラスセラミックスのグリーンシートの空孔部及び表面に形成され、該グリーンシートを積層,焼成し、該配線が三次元的に組み込まれたことを特徴とする電子部品。
- 請求項1に記載の電子部品が、システムオンフィルム,テープキャリアパッケージ,低温焼成セラミックス,プラズマディスプレイ,液晶ディスプレイ,有機ELディスプレイ、あるいは太陽電池のいずれかであることを特徴とする電子部品。
- 少なくとも導電性金属材料粉末とガラス粉末を混合した電極・配線用材料であって、該導電性金属材料粉末が、Al含有量:10at%〜25at%,Co含有量:5at%〜20at%、残部がCu及び不可避不純物で構成される化学組成を有し、CuにAlとCoが溶け込んだCu固溶体と、CoAl金属間化合物の2相が共存した3元系合金であることを特徴とする電極・配線用材料。
- 請求項7において、前記導電性金属材料粉末が、球状及び板状の粒子粉末の成形形態を有することを特徴とする電極・配線用材料。
- 請求項7において、前記導電性金属材料粉末が75〜97vol.%、及び前記ガラス粉末が3〜25vol.%からなることを特徴とする電極・配線用材料。
- 請求項7に記載の電極・配線用材料に樹脂バインダー又は溶剤を混合して構成されることを特徴とする電極・配線用ペースト材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011508252A JP5474936B2 (ja) | 2009-04-10 | 2010-04-08 | Cu−Al−Co系合金の電極・配線を具備した電子部品及びCu−Al−Co系合金の電極・配線用材料ならびにそれを用いた電極・配線用ペースト材料 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009095628 | 2009-04-10 | ||
JP2009095628 | 2009-04-10 | ||
JP2011508252A JP5474936B2 (ja) | 2009-04-10 | 2010-04-08 | Cu−Al−Co系合金の電極・配線を具備した電子部品及びCu−Al−Co系合金の電極・配線用材料ならびにそれを用いた電極・配線用ペースト材料 |
PCT/JP2010/002573 WO2010116746A1 (ja) | 2009-04-10 | 2010-04-08 | Cu-Al-Co系合金の電極・配線を具備した電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010116746A1 JPWO2010116746A1 (ja) | 2012-10-18 |
JP5474936B2 true JP5474936B2 (ja) | 2014-04-16 |
Family
ID=42936040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011508252A Expired - Fee Related JP5474936B2 (ja) | 2009-04-10 | 2010-04-08 | Cu−Al−Co系合金の電極・配線を具備した電子部品及びCu−Al−Co系合金の電極・配線用材料ならびにそれを用いた電極・配線用ペースト材料 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8790549B2 (ja) |
JP (1) | JP5474936B2 (ja) |
WO (1) | WO2010116746A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3664156A4 (en) * | 2017-12-04 | 2020-12-09 | Kaneka Corporation | SOLAR CELL AND ELECTRONIC DEVICE EQUIPPED WITH THE SAID SOLAR CELL |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125341A (ja) * | 1994-10-25 | 1996-05-17 | Hitachi Ltd | 電子回路装置 |
JPH09199976A (ja) * | 1996-01-18 | 1997-07-31 | Hitachi Ltd | 弾性表面波素子電極 |
JP2002294437A (ja) * | 2001-04-02 | 2002-10-09 | Mitsubishi Materials Corp | 銅合金スパッタリングターゲット |
JP2003277170A (ja) * | 2002-03-26 | 2003-10-02 | Kyocera Corp | 配線導体用組成物 |
JP2004207009A (ja) * | 2002-12-25 | 2004-07-22 | Kyocera Corp | 銅メタライズ組成物、並びに、配線基板およびその製法 |
JP2007305528A (ja) * | 2006-05-15 | 2007-11-22 | Fujitsu Hitachi Plasma Display Ltd | プラズマディスプレイパネルおよびその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2130737A (en) * | 1937-09-15 | 1938-09-20 | Mallory & Co Inc P R | Copper alloy |
US5468310A (en) * | 1993-02-01 | 1995-11-21 | Nissan Motor Co., Ltd. | High temperature abrasion resistant copper alloy |
JP3754011B2 (ja) | 2002-09-04 | 2006-03-08 | デプト株式会社 | 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品 |
GB0512836D0 (en) * | 2005-06-21 | 2005-08-03 | Jha Animesh | Inert alloy anodes for aluminium electrolysis cell using molten salt bath confidential |
-
2010
- 2010-04-08 US US13/263,359 patent/US8790549B2/en not_active Expired - Fee Related
- 2010-04-08 JP JP2011508252A patent/JP5474936B2/ja not_active Expired - Fee Related
- 2010-04-08 WO PCT/JP2010/002573 patent/WO2010116746A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125341A (ja) * | 1994-10-25 | 1996-05-17 | Hitachi Ltd | 電子回路装置 |
JPH09199976A (ja) * | 1996-01-18 | 1997-07-31 | Hitachi Ltd | 弾性表面波素子電極 |
JP2002294437A (ja) * | 2001-04-02 | 2002-10-09 | Mitsubishi Materials Corp | 銅合金スパッタリングターゲット |
JP2003277170A (ja) * | 2002-03-26 | 2003-10-02 | Kyocera Corp | 配線導体用組成物 |
JP2004207009A (ja) * | 2002-12-25 | 2004-07-22 | Kyocera Corp | 銅メタライズ組成物、並びに、配線基板およびその製法 |
JP2007305528A (ja) * | 2006-05-15 | 2007-11-22 | Fujitsu Hitachi Plasma Display Ltd | プラズマディスプレイパネルおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2010116746A1 (ja) | 2012-10-18 |
WO2010116746A1 (ja) | 2010-10-14 |
US20120285733A1 (en) | 2012-11-15 |
US8790549B2 (en) | 2014-07-29 |
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