WO2013015285A1 - 素子および太陽電池 - Google Patents
素子および太陽電池 Download PDFInfo
- Publication number
- WO2013015285A1 WO2013015285A1 PCT/JP2012/068721 JP2012068721W WO2013015285A1 WO 2013015285 A1 WO2013015285 A1 WO 2013015285A1 JP 2012068721 W JP2012068721 W JP 2012068721W WO 2013015285 A1 WO2013015285 A1 WO 2013015285A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- acid
- mass
- solar cell
- flux
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims abstract description 175
- 229910000679 solder Inorganic materials 0.000 claims abstract description 126
- 239000000203 mixture Substances 0.000 claims abstract description 102
- 230000004907 flux Effects 0.000 claims abstract description 100
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 95
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 94
- 239000011574 phosphorus Substances 0.000 claims abstract description 94
- 239000002003 electrode paste Substances 0.000 claims abstract description 76
- 239000011521 glass Substances 0.000 claims abstract description 62
- 239000002904 solvent Substances 0.000 claims abstract description 54
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000010703 silicon Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 41
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 41
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 41
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 40
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 32
- 150000004820 halides Chemical class 0.000 claims description 28
- 150000007522 mineralic acids Chemical class 0.000 claims description 21
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 18
- 150000007524 organic acids Chemical class 0.000 claims description 18
- 238000009792 diffusion process Methods 0.000 claims description 17
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 16
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 12
- 235000011054 acetic acid Nutrition 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 claims description 6
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 6
- 235000019253 formic acid Nutrition 0.000 claims description 6
- 235000006408 oxalic acid Nutrition 0.000 claims description 6
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 5
- 239000004327 boric acid Substances 0.000 claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 238000010304 firing Methods 0.000 abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 51
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 50
- 229910052709 silver Inorganic materials 0.000 description 48
- 239000004332 silver Substances 0.000 description 48
- 229910052802 copper Inorganic materials 0.000 description 42
- 239000010949 copper Substances 0.000 description 42
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 34
- 238000000034 method Methods 0.000 description 34
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 30
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 28
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 27
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 27
- 230000003647 oxidation Effects 0.000 description 27
- 238000007254 oxidation reaction Methods 0.000 description 27
- 238000010438 heat treatment Methods 0.000 description 24
- 239000004065 semiconductor Substances 0.000 description 19
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 239000011592 zinc chloride Substances 0.000 description 15
- 235000005074 zinc chloride Nutrition 0.000 description 15
- 235000019270 ammonium chloride Nutrition 0.000 description 14
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 13
- 235000011187 glycerol Nutrition 0.000 description 13
- -1 phosphorous inorganic acids Chemical class 0.000 description 13
- 238000007639 printing Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000000605 extraction Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 8
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 8
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 239000006104 solid solution Substances 0.000 description 7
- 229940116411 terpineol Drugs 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 6
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- OSWPMRLSEDHDFF-UHFFFAOYSA-N methyl salicylate Chemical compound COC(=O)C1=CC=CC=C1O OSWPMRLSEDHDFF-UHFFFAOYSA-N 0.000 description 6
- YLYBTZIQSIBWLI-UHFFFAOYSA-N octyl acetate Chemical compound CCCCCCCCOC(C)=O YLYBTZIQSIBWLI-UHFFFAOYSA-N 0.000 description 6
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 150000003505 terpenes Chemical class 0.000 description 5
- 235000007586 terpenes Nutrition 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 5
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 150000001733 carboxylic acid esters Chemical class 0.000 description 4
- ULDHMXUKGWMISQ-UHFFFAOYSA-N carvone Chemical compound CC(=C)C1CC=C(C)C(=O)C1 ULDHMXUKGWMISQ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 4
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 4
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 235000021317 phosphate Nutrition 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 4
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 4
- YHQGMYUVUMAZJR-UHFFFAOYSA-N α-terpinene Chemical compound CC(C)C1=CC=C(C)CC1 YHQGMYUVUMAZJR-UHFFFAOYSA-N 0.000 description 4
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000004254 Ammonium phosphate Substances 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 3
- 235000019289 ammonium phosphates Nutrition 0.000 description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 3
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003759 ester based solvent Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000004210 ether based solvent Substances 0.000 description 3
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 3
- 239000005453 ketone based solvent Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 229960001047 methyl salicylate Drugs 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- CFNJLPHOBMVMNS-UHFFFAOYSA-N pentyl butyrate Chemical compound CCCCCOC(=O)CCC CFNJLPHOBMVMNS-UHFFFAOYSA-N 0.000 description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229940070710 valerate Drugs 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- 238000009692 water atomization Methods 0.000 description 3
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 2
- GQVMHMFBVWSSPF-SOYUKNQTSA-N (4E,6E)-2,6-dimethylocta-2,4,6-triene Chemical compound C\C=C(/C)\C=C\C=C(C)C GQVMHMFBVWSSPF-SOYUKNQTSA-N 0.000 description 2
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 2
- UOWSVNMPHMJCBZ-UHFFFAOYSA-N 1-[2-(2-butoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCCCC UOWSVNMPHMJCBZ-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 239000005973 Carvone Substances 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- WSTYNZDAOAEEKG-UHFFFAOYSA-N Mayol Natural products CC1=C(O)C(=O)C=C2C(CCC3(C4CC(C(CC4(CCC33C)C)=O)C)C)(C)C3=CC=C21 WSTYNZDAOAEEKG-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- 229940022663 acetate Drugs 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 2
- VYBREYKSZAROCT-UHFFFAOYSA-N alpha-myrcene Natural products CC(=C)CCCC(=C)C=C VYBREYKSZAROCT-UHFFFAOYSA-N 0.000 description 2
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 229930006722 beta-pinene Natural products 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 2
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- GQVMHMFBVWSSPF-UHFFFAOYSA-N cis-alloocimene Natural products CC=C(C)C=CC=C(C)C GQVMHMFBVWSSPF-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N isobutyl acetate Chemical compound CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropyl acetate Chemical compound CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 2
- 235000001510 limonene Nutrition 0.000 description 2
- 229940087305 limonene Drugs 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- YDSWCNNOKPMOTP-UHFFFAOYSA-N mellitic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1C(O)=O YDSWCNNOKPMOTP-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- GJQIMXVRFNLMTB-UHFFFAOYSA-N nonyl acetate Chemical compound CCCCCCCCCOC(C)=O GJQIMXVRFNLMTB-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229940102001 zinc bromide Drugs 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- IHPKGUQCSIINRJ-UHFFFAOYSA-N β-ocimene Natural products CC(C)=CCC=C(C)C=C IHPKGUQCSIINRJ-UHFFFAOYSA-N 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- LGXVIGDEPROXKC-UHFFFAOYSA-N 1,1-dichloroethene Chemical group ClC(Cl)=C LGXVIGDEPROXKC-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- PVMMVWNXKOSPRB-UHFFFAOYSA-N 1,2-dipropoxypropane Chemical compound CCCOCC(C)OCCC PVMMVWNXKOSPRB-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- QMGJMGFZLXYHCR-UHFFFAOYSA-N 1-(2-butoxypropoxy)butane Chemical compound CCCCOCC(C)OCCCC QMGJMGFZLXYHCR-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- HQSLKNLISLWZQH-UHFFFAOYSA-N 1-(2-propoxyethoxy)propane Chemical compound CCCOCCOCCC HQSLKNLISLWZQH-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- JRRDISHSXWGFRF-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]-2-methoxyethane Chemical compound CCOCCOCCOCCOC JRRDISHSXWGFRF-UHFFFAOYSA-N 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- SLXZPRDVXSNULE-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]hexane Chemical compound CCCCCCOCCOCCOC SLXZPRDVXSNULE-UHFFFAOYSA-N 0.000 description 1
- MBRRDORCFVPYMA-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOC MBRRDORCFVPYMA-UHFFFAOYSA-N 0.000 description 1
- QPHFJZRSMXHTAW-UHFFFAOYSA-N 1-[2-(2-methoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OC QPHFJZRSMXHTAW-UHFFFAOYSA-N 0.000 description 1
- QKFNXFNHRDUNKF-UHFFFAOYSA-N 1-[2-(2-methoxypropoxy)propoxy]hexane Chemical compound CCCCCCOCC(C)OCC(C)OC QKFNXFNHRDUNKF-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- OHRSSDYDJRJIMN-UHFFFAOYSA-N 1-[2-[2-(2-butoxypropoxy)propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCCCC OHRSSDYDJRJIMN-UHFFFAOYSA-N 0.000 description 1
- SNAQINZKMQFYFV-UHFFFAOYSA-N 1-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOC SNAQINZKMQFYFV-UHFFFAOYSA-N 0.000 description 1
- WECDVJWNQLMVAZ-UHFFFAOYSA-N 1-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]hexane Chemical compound CCCCCCOCCOCCOCCOC WECDVJWNQLMVAZ-UHFFFAOYSA-N 0.000 description 1
- XRAINLRHLSBUGO-UHFFFAOYSA-N 1-[2-[2-(2-methoxypropoxy)propoxy]propoxy]hexane Chemical compound CCCCCCOCC(C)OCC(C)OCC(C)OC XRAINLRHLSBUGO-UHFFFAOYSA-N 0.000 description 1
- MQGIBEAIDUOVOH-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCOCCCC MQGIBEAIDUOVOH-UHFFFAOYSA-N 0.000 description 1
- JVMKCHOJVQIXQN-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxypropoxy)propoxy]propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCC(C)OCCCC JVMKCHOJVQIXQN-UHFFFAOYSA-N 0.000 description 1
- OQEQLIIVVZJHCB-UHFFFAOYSA-N 1-[2-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCOC OQEQLIIVVZJHCB-UHFFFAOYSA-N 0.000 description 1
- XUJPECKOHREIMQ-UHFFFAOYSA-N 1-[2-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]ethoxy]hexane Chemical compound CCCCCCOCCOCCOCCOCCOC XUJPECKOHREIMQ-UHFFFAOYSA-N 0.000 description 1
- FVAPDRAWQSCTPE-UHFFFAOYSA-N 1-[2-[2-[2-(2-methoxypropoxy)propoxy]propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCC(C)OC FVAPDRAWQSCTPE-UHFFFAOYSA-N 0.000 description 1
- HQDNNZKRDROCFP-UHFFFAOYSA-N 1-[2-[2-[2-(2-methoxypropoxy)propoxy]propoxy]propoxy]hexane Chemical compound CCCCCCOCC(C)OCC(C)OCC(C)OCC(C)OC HQDNNZKRDROCFP-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- JXFITNNCZLPZNX-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OC JXFITNNCZLPZNX-UHFFFAOYSA-N 0.000 description 1
- KIAMPLQEZAMORJ-UHFFFAOYSA-N 1-ethoxy-2-[2-(2-ethoxyethoxy)ethoxy]ethane Chemical compound CCOCCOCCOCCOCC KIAMPLQEZAMORJ-UHFFFAOYSA-N 0.000 description 1
- SFXVPXODAPMPMQ-UHFFFAOYSA-N 1-ethoxy-2-[2-(2-methoxypropoxy)propoxy]propane Chemical compound CCOCC(C)OCC(C)OCC(C)OC SFXVPXODAPMPMQ-UHFFFAOYSA-N 0.000 description 1
- FXAFMVDJGZBDEP-UHFFFAOYSA-N 1-ethoxy-2-[2-[2-(2-ethoxypropoxy)propoxy]propoxy]propane Chemical compound CCOCC(C)OCC(C)OCC(C)OCC(C)OCC FXAFMVDJGZBDEP-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- BAWUFGWWCWMUNU-UHFFFAOYSA-N 1-hexylpyrrolidin-2-one Chemical compound CCCCCCN1CCCC1=O BAWUFGWWCWMUNU-UHFFFAOYSA-N 0.000 description 1
- RERATEUBWLKDFE-UHFFFAOYSA-N 1-methoxy-2-[2-(2-methoxypropoxy)propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OC RERATEUBWLKDFE-UHFFFAOYSA-N 0.000 description 1
- ROSYHLFNMZTEKZ-UHFFFAOYSA-N 1-methoxy-2-[2-[2-(2-methoxypropoxy)propoxy]propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OCC(C)OC ROSYHLFNMZTEKZ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- JOERQAIRIDZWHX-UHFFFAOYSA-N 1-propoxy-2-(2-propoxypropoxy)propane Chemical compound CCCOCC(C)OCC(C)OCCC JOERQAIRIDZWHX-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- DCALJVULAGICIX-UHFFFAOYSA-N 1-propylpyrrolidin-2-one Chemical compound CCCN1CCCC1=O DCALJVULAGICIX-UHFFFAOYSA-N 0.000 description 1
- AWBIJARKDOFDAN-UHFFFAOYSA-N 2,5-dimethyl-1,4-dioxane Chemical compound CC1COC(C)CO1 AWBIJARKDOFDAN-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- CKCGJBFTCUCBAJ-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propyl acetate Chemical compound CCOC(C)COC(C)COC(C)=O CKCGJBFTCUCBAJ-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HQLKZWRSOHTERR-UHFFFAOYSA-N 2-Ethylbutyl acetate Chemical compound CCC(CC)COC(C)=O HQLKZWRSOHTERR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- GQKZRWSUJHVIPE-UHFFFAOYSA-N 2-Pentanol acetate Chemical compound CCCC(C)OC(C)=O GQKZRWSUJHVIPE-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- SDHQGBWMLCBNSM-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]ethyl acetate Chemical compound COCCOCCOCCOC(C)=O SDHQGBWMLCBNSM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- MXVMODFDROLTFD-UHFFFAOYSA-N 2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCCOCCOCCOCCOCCO MXVMODFDROLTFD-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- BYVKCQBOHJQWIO-UHFFFAOYSA-N 2-ethoxyethyl propanoate Chemical compound CCOCCOC(=O)CC BYVKCQBOHJQWIO-UHFFFAOYSA-N 0.000 description 1
- TZYRSLHNPKPEFV-UHFFFAOYSA-N 2-ethyl-1-butanol Chemical compound CCC(CC)CO TZYRSLHNPKPEFV-UHFFFAOYSA-N 0.000 description 1
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical compound CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 1
- CETWDUZRCINIHU-UHFFFAOYSA-N 2-heptanol Chemical compound CCCCCC(C)O CETWDUZRCINIHU-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VAHNPAMCADTGIO-UHFFFAOYSA-N 2-methoxyethyl propanoate Chemical compound CCC(=O)OCCOC VAHNPAMCADTGIO-UHFFFAOYSA-N 0.000 description 1
- PFNHSEQQEPMLNI-UHFFFAOYSA-N 2-methyl-1-pentanol Chemical compound CCCC(C)CO PFNHSEQQEPMLNI-UHFFFAOYSA-N 0.000 description 1
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- MGADZUXDNSDTHW-UHFFFAOYSA-N 2H-pyran Chemical compound C1OC=CC=C1 MGADZUXDNSDTHW-UHFFFAOYSA-N 0.000 description 1
- PKNKULBDCRZSBT-UHFFFAOYSA-N 3,4,5-trimethylnonan-2-one Chemical compound CCCCC(C)C(C)C(C)C(C)=O PKNKULBDCRZSBT-UHFFFAOYSA-N 0.000 description 1
- HYDWALOBQJFOMS-UHFFFAOYSA-N 3,6,9,12,15-pentaoxaheptadecane Chemical compound CCOCCOCCOCCOCCOCC HYDWALOBQJFOMS-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N 4-methylcyclohexan-1-ol Chemical compound CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- VHRSUDSXCMQTMA-PJHHCJLFSA-N 6alpha-methylprednisolone Chemical compound C([C@@]12C)=CC(=O)C=C1[C@@H](C)C[C@@H]1[C@@H]2[C@@H](O)C[C@]2(C)[C@@](O)(C(=O)CO)CC[C@H]21 VHRSUDSXCMQTMA-PJHHCJLFSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910016338 Bi—Sn Inorganic materials 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- VXHDFMMJEZRQLA-UHFFFAOYSA-N C(C)OCC(C)O.C(C)(=O)O.C(C)(=O)O.C(C)(=O)O Chemical compound C(C)OCC(C)O.C(C)(=O)O.C(C)(=O)O.C(C)(=O)O VXHDFMMJEZRQLA-UHFFFAOYSA-N 0.000 description 1
- WRCXYMVSLACFPS-UHFFFAOYSA-N CCCCOCC(C)OCC(C)OCC(C)OC Chemical compound CCCCOCC(C)OCC(C)OCC(C)OC WRCXYMVSLACFPS-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- 208000005156 Dehydration Diseases 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- JKRZOJADNVOXPM-UHFFFAOYSA-N Oxalic acid dibutyl ester Chemical compound CCCCOC(=O)C(=O)OCCCC JKRZOJADNVOXPM-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000005643 Pelargonic acid Substances 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- JDOWHGVIUHWPGE-UHFFFAOYSA-N acetic acid;2,2,4-trimethylpentane-1,3-diol Chemical compound CC(O)=O.CC(C)C(O)C(C)(C)CO JDOWHGVIUHWPGE-UHFFFAOYSA-N 0.000 description 1
- PNRYMXHHKKOAJZ-UHFFFAOYSA-N acetic acid;2,2-diethyl-4-methylhexane-1,3-diol Chemical compound CC(O)=O.CCC(C)C(O)C(CC)(CC)CO PNRYMXHHKKOAJZ-UHFFFAOYSA-N 0.000 description 1
- FUECIDVNGAUMGJ-UHFFFAOYSA-N acetic acid;2-(2-butoxyethoxy)ethanol Chemical compound CC(O)=O.CCCCOCCOCCO FUECIDVNGAUMGJ-UHFFFAOYSA-N 0.000 description 1
- GTYLEVMOSBBKCQ-UHFFFAOYSA-N acetic acid;2-(2-ethoxyethoxy)ethanol Chemical compound CC(O)=O.CCOCCOCCO GTYLEVMOSBBKCQ-UHFFFAOYSA-N 0.000 description 1
- JQICEOPIRHDDER-UHFFFAOYSA-N acetic acid;2-(2-methoxyethoxy)ethanol Chemical compound CC(O)=O.COCCOCCO JQICEOPIRHDDER-UHFFFAOYSA-N 0.000 description 1
- JIMPAYYJPMENLQ-UHFFFAOYSA-N acetic acid;2-(2-methoxypropoxy)propan-1-ol Chemical compound CC(O)=O.COC(C)COC(C)CO JIMPAYYJPMENLQ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 125000005418 aryl aryl group Chemical group 0.000 description 1
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 description 1
- 229910001626 barium chloride Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyloxyacetoaldehyde Natural products CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CKQGKSPXCTWTCX-UHFFFAOYSA-N butanoic acid;2,2,4-trimethylpentane-1,3-diol Chemical compound CCCC(O)=O.CC(C)C(O)C(C)(C)CO CKQGKSPXCTWTCX-UHFFFAOYSA-N 0.000 description 1
- BTMVHUNTONAYDX-UHFFFAOYSA-N butyl propionate Chemical compound CCCCOC(=O)CC BTMVHUNTONAYDX-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- IKFJXNLSXNKTHY-UHFFFAOYSA-N cyclohexanone;ethanol Chemical compound CCO.O=C1CCCCC1 IKFJXNLSXNKTHY-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000006392 deoxygenation reaction Methods 0.000 description 1
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- FOBPTJZYDGNHLR-UHFFFAOYSA-N diphosphorus Chemical compound P#P FOBPTJZYDGNHLR-UHFFFAOYSA-N 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- JIRDGEGGAWJQHQ-UHFFFAOYSA-N disulfur dibromide Chemical compound BrSSBr JIRDGEGGAWJQHQ-UHFFFAOYSA-N 0.000 description 1
- 235000020669 docosahexaenoic acid Nutrition 0.000 description 1
- 229940090949 docosahexaenoic acid Drugs 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- JAZBEHYOTPTENJ-UHFFFAOYSA-N eicosapentaenoic acid Natural products CCC=CCC=CCC=CCC=CCC=CCCCC(O)=O JAZBEHYOTPTENJ-UHFFFAOYSA-N 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- CYKDLUMZOVATFT-UHFFFAOYSA-N ethenyl acetate;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=O)OC=C CYKDLUMZOVATFT-UHFFFAOYSA-N 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 1
- RXTNIJMLAQNTEG-UHFFFAOYSA-N hexan-2-yl acetate Chemical compound CCCCC(C)OC(C)=O RXTNIJMLAQNTEG-UHFFFAOYSA-N 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- CBEQRNSPHCCXSH-UHFFFAOYSA-N iodine monobromide Chemical compound IBr CBEQRNSPHCCXSH-UHFFFAOYSA-N 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- 229910003443 lutetium oxide Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNKYTQGIUYNRMY-UHFFFAOYSA-N methoxypropane Chemical compound CCCOC VNKYTQGIUYNRMY-UHFFFAOYSA-N 0.000 description 1
- IMXBRVLCKXGWSS-UHFFFAOYSA-N methyl 2-cyclohexylacetate Chemical compound COC(=O)CC1CCCCC1 IMXBRVLCKXGWSS-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229940017144 n-butyl lactate Drugs 0.000 description 1
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- LJDZFAPLPVPTBD-UHFFFAOYSA-N nitroformic acid Chemical compound OC(=O)[N+]([O-])=O LJDZFAPLPVPTBD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000007823 ocimene derivatives Chemical class 0.000 description 1
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- MPARYNQUYZOBJM-UHFFFAOYSA-N oxo(oxolutetiooxy)lutetium Chemical compound O=[Lu]O[Lu]=O MPARYNQUYZOBJM-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- UFQXGXDIJMBKTC-UHFFFAOYSA-N oxostrontium Chemical compound [Sr]=O UFQXGXDIJMBKTC-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 1
- GXOHBWLPQHTYPF-UHFFFAOYSA-N pentyl 2-hydroxypropanoate Chemical compound CCCCCOC(=O)C(C)O GXOHBWLPQHTYPF-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- IPNPIHIZVLFAFP-UHFFFAOYSA-N phosphorus tribromide Chemical compound BrP(Br)Br IPNPIHIZVLFAFP-UHFFFAOYSA-N 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000000700 radioactive tracer Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- QGMWCJPYHVWVRR-UHFFFAOYSA-N tellurium monoxide Chemical compound [Te]=O QGMWCJPYHVWVRR-UHFFFAOYSA-N 0.000 description 1
- VJHDVMPJLLGYBL-UHFFFAOYSA-N tetrabromogermane Chemical compound Br[Ge](Br)(Br)Br VJHDVMPJLLGYBL-UHFFFAOYSA-N 0.000 description 1
- BRGJIIMZXMWMCC-UHFFFAOYSA-N tetradecan-2-ol Chemical compound CCCCCCCCCCCCC(C)O BRGJIIMZXMWMCC-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- XJPBRODHZKDRCB-UHFFFAOYSA-N trans-alpha-ocimene Natural products CC(=C)CCC=C(C)C=C XJPBRODHZKDRCB-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XMUJIPOFTAHSOK-UHFFFAOYSA-N undecan-2-ol Chemical compound CCCCCCCCCC(C)O XMUJIPOFTAHSOK-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/02245—Electrode arrangements specially adapted for back-contact solar cells for metallisation wrap-through [MWT] type solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Definitions
- the present invention relates to an element and a solar cell.
- a solar cell is provided with a surface electrode, and the wiring resistance and contact resistance of the surface electrode are related to voltage loss related to conversion efficiency, and the wiring width and shape affect the amount of incident sunlight.
- the surface electrode of a solar cell is usually formed as follows. That is, a conductive composition is applied by screen printing or the like on an n-type semiconductor layer formed by thermally diffusing phosphorus or the like at a high temperature on the light-receiving surface side of a p-type silicon substrate, and this is applied to 800 to 900 A surface electrode is formed by baking at ° C.
- the conductive composition forming the surface electrode includes conductive metal powder, glass particles, various additives, and the like.
- the conductive metal powder As the conductive metal powder, silver powder is generally used. However, use of metal powders other than silver powder has been studied for various reasons. For example, a conductive composition capable of forming a solar cell electrode containing silver and aluminum is disclosed (see, for example, JP-A-2006-313744). An electrode-forming composition containing metal nanoparticles containing silver and metal particles other than silver such as copper has been disclosed (see, for example, JP-A-2008-226816).
- silver used for electrode formation is a noble metal, and due to the problem of resources, and the metal itself is expensive, a proposal of a paste material to replace the silver-containing conductive composition (silver-containing paste) is desired.
- a promising material that can replace silver is copper that is applied to semiconductor wiring materials. Copper is abundant in terms of resources, and the cost of bullion is as low as about 1/100 of silver. However, copper is a material that is easily oxidized at a high temperature of 200 ° C. or higher.
- Patent Document 2 when copper is contained as a conductive metal, this is baked to form an electrode. Therefore, a special process of baking in an atmosphere of nitrogen or the like is necessary.
- An object of the present invention is to provide an element having an electrode in which oxidation of copper during firing is suppressed and a reduction in resistivity is achieved, and a solar cell having the element.
- An electrode that is a fired product of an electrode paste composition comprising phosphorus-containing copper alloy particles, glass particles, a solvent, and a resin provided on the silicon substrate;
- the flux includes at least one selected from a halide, an inorganic acid, an organic acid, and rosin.
- halide is at least one selected from chloride and bromide.
- the inorganic acid includes at least one selected from hydrochloric acid, hydrobromic acid, nitric acid, phosphoric acid, and boric acid.
- ⁇ 6> The element according to ⁇ 5>, wherein the carboxylic acid includes at least one selected from formic acid, acetic acid, and oxalic acid.
- ⁇ 7> The element according to any one of ⁇ 2> to ⁇ 6>, wherein the flux contains 5% by mass or more of rosin.
- ⁇ 8> The element according to any one of ⁇ 1> to ⁇ 7>, wherein the solder layer contains 42% by mass or more of tin.
- ⁇ 9> The silicon substrate according to any one of ⁇ 1> to ⁇ 8>, wherein the silicon substrate has an impurity diffusion layer and is pn-junction, and is used for a solar cell having the electrode on the impurity diffusion layer. element.
- a solar cell having:
- the present invention it is possible to provide an element having an electrode in which the oxidation of copper during firing is suppressed and the resistivity is reduced, and a solar cell having the element.
- the element of the present invention includes a silicon substrate, an electrode provided on the silicon substrate, and a solder layer provided on the electrode.
- the electrode is a fired product of an electrode paste composition containing phosphorus-containing copper alloy particles, glass particles, a solvent, and a resin.
- the solder layer contains a flux.
- the electrode having a low resistivity can be obtained by forming the electrode using phosphorus-containing copper alloy particles. This is presumably because phosphorus contained in the copper alloy particles functions as a reducing agent for the copper oxide and the oxidation resistance of copper is enhanced. As a result, it is presumed that the oxidation of copper is suppressed and an electrode having a low resistivity is formed.
- the solder layer provided on the electrode contains a flux, so that the adhesion between the electrode and the solder layer is improved, and further, the contact resistance at the interface between the electrode and the solder layer is reduced. Reduce. This is presumably because the surface oxide film of the solder layer is removed by using the flux, the wettability of the surface is improved, and the re-formation of the surface oxide film is suppressed. Thereby, it is estimated that the adhesion between the electrode and the solder layer is improved, and further, the contact resistance at the interface between the electrode and the solder layer is reduced.
- the method for incorporating the flux into the solder layer is not particularly limited, and examples thereof include a method of applying the flux to at least one surface of the electrode and the solder layer. Then, the electrode and the solder layer are brought into contact with each other and pressed, and further heat-treated to connect the electrode and the solder layer. Below, each structural member of the element of this invention is demonstrated.
- the type of the silicon substrate in the present invention is not particularly limited as long as it is used in a form in which an electrode is formed using the paste composition for an electrode and a solder layer is formed on the electrode.
- Examples of the silicon substrate include a silicon substrate having a pn junction for forming a solar cell, a silicon substrate used for manufacturing a semiconductor device other than the solar cell, and the like.
- the electrode according to the present invention is a fired product of an electrode paste composition containing phosphorus-containing copper alloy particles, glass particles, a solvent, and a resin.
- the details of the electrode paste composition used for electrode formation will be described below.
- the electrode paste composition according to the present invention includes at least one phosphorous-containing copper alloy particle, at least one glass particle, at least one solvent, and at least one resin. With such a configuration, generation of a copper oxide film is suppressed even during firing, and an electrode having a lower resistivity than that using copper particles can be formed.
- the electrode paste composition according to the present invention contains at least one phosphorus-containing copper alloy particle.
- the phosphorus content contained in the phosphorus-containing copper alloy particles is preferably 6% by mass or more and 8% by mass or less, and 6.3% by mass or more and 7.8% by mass. More preferably, it is 6.5 mass% or more and 7.5 mass% or less.
- the productivity of the phosphorus-containing copper alloy particles is excellent. .
- the more outstanding oxidation resistance can be achieved because it is 6 mass% or more.
- phosphorus copper brazing As a phosphorus-containing copper alloy used for the phosphorus-containing copper alloy particles, a brazing material called phosphorus copper brazing (phosphorus concentration: usually about 7% by mass or less) is known. Phosphor copper brazing is also used as a bonding agent between copper and copper.
- phosphorus-containing copper alloy particles in the electrode paste composition according to the present invention it is possible to form an electrode having excellent oxidation resistance and low resistivity by utilizing the reducibility of phosphorus to copper oxide. Further, the electrode can be fired at a low temperature, and the effect that the process cost can be reduced can be obtained.
- the phosphorus-containing copper alloy particles are composed of an alloy containing copper and phosphorus, but may further contain other atoms.
- Other atoms include Ag, Mn, Sb, Si, K, Na, Li, Ba, Sr, Ca, Mg, Be, Zn, Pb, Cd, Tl, V, Sn, Al, Zr, W, Mo, Ti, Co, Ni, Au, etc. can be mentioned.
- the content rate of the other atom contained in the said phosphorus containing copper alloy particle can be 3 mass% or less in the said phosphorus containing copper alloy particle, for example, from a viewpoint of oxidation resistance and a low resistivity, it is 1 It is preferable that it is below mass%.
- the phosphorus-containing copper alloy particles may be used singly or in combination of two or more.
- the particle diameter of the phosphorus-containing copper alloy particles is not particularly limited, but the particle diameter when the accumulated weight is 50% (hereinafter sometimes abbreviated as “D50%”) is 0.4 ⁇ m to 10 ⁇ m. It is preferably 1 ⁇ m to 7 ⁇ m.
- D50% the particle diameter when the accumulated weight is 50%
- grains in an electrode becomes large because the particle diameter of a phosphorus containing copper alloy particle shall be 10 micrometers or less, and the resistivity of the formed electrode falls more effectively.
- the particle size of the phosphorus-containing copper alloy particles is measured by a microtrack particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., MT3300 type).
- the shape of the phosphorus-containing copper alloy particles is not particularly limited, and may be any of a substantially spherical shape, a flat shape, a block shape, a plate shape, a scale shape, and the like.
- the shape of the phosphorus-containing copper alloy particles is preferably substantially spherical, flat, or plate-like from the viewpoint of oxidation resistance and low resistivity.
- a content rate of the phosphorus-containing copper alloy particles contained in the paste composition for an electrode according to the present invention and a total content rate of phosphorus-containing copper alloy particles and silver particles in the case of containing silver particles described later, for example, 70 mass From the viewpoint of oxidation resistance and low resistivity, it is preferably 72% by mass to 90% by mass, and more preferably 74% by mass to 88% by mass.
- the phosphorus-containing copper alloy used for the phosphorus-containing copper alloy particles can be produced by a commonly used method.
- the phosphorus-containing copper alloy particles can be prepared using a normal method of preparing metal powder using a phosphorus-containing copper alloy prepared so as to have a desired phosphorus content, for example, a water atomization method Can be produced by a conventional method. Details of the water atomization method are described in Metal Handbook (Maruzen Co., Ltd. Publishing Division). Specifically, for example, after phosphorus-containing copper alloy is dissolved and powdered by nozzle spray, the obtained powder is dried and classified, whereby desired phosphorus-containing copper alloy particles can be produced. Moreover, the phosphorus containing copper alloy particle
- grains which have a desired particle diameter can be manufactured by selecting classification conditions suitably.
- the electrode paste composition according to the present invention contains at least one glass particle.
- the adhesion between the electrode portion and the substrate is improved during firing. Further, at the electrode formation temperature, the silicon nitride film as the antireflection film is removed by so-called fire-through, and an ohmic contact between the electrode and the silicon substrate is formed.
- the glass particles are usually used in the technical field as long as they can soften and melt at the electrode formation temperature, oxidize the contacted silicon nitride film, and take the oxidized silicon dioxide to remove the antireflection film.
- the glass particles used can be used without particular limitation.
- glass particles containing glass having a glass softening point of 600 ° C. or lower and a crystallization start temperature exceeding 600 ° C. are preferable from the viewpoint of oxidation resistance and low electrode resistivity.
- the glass softening point is measured by a usual method using a thermomechanical analyzer (TMA), and the crystallization start temperature is measured using a differential thermal-thermogravimetric analyzer (TG / DTA). Measured by method.
- the glass particles contained in the electrode paste composition may be composed of glass containing lead because silicon dioxide can be taken in efficiently.
- glass containing lead examples include those described in Japanese Patent No. 03050064, and these can also be suitably used in the present invention.
- lead-free glass that does not substantially contain lead in consideration of the influence on the environment.
- Examples of the lead-free glass include lead-free glass described in paragraphs 0024 to 0025 of JP-A-2006-313744 and lead-free glass described in JP-A-2009-188281. It is also preferable that the lead-free glass is appropriately selected and applied to the present invention.
- At least one selected from SiO 2 , P 2 O 5 , Al 2 O 3 , B 2 O 3 , V 2 O 5 , Bi 2 O 3 , ZnO, and PbO are preferable to use at least one selected from SiO 2 , P 2 O 5 , Al 2 O 3 , B 2 O 3 , V 2 O 5 , Bi 2 O 3 , ZnO, and PbO.
- a glass component include those containing SiO 2, PbO, B 2 O 3, Bi 2 O 3 and Al 2 O 3.
- the softening point is effectively lowered, and the wettability with phosphorus-containing copper alloy particles and silver particles added as necessary is improved. Sintering progresses, and an electrode with low resistivity can be formed.
- glass particles containing phosphorous pentoxide are preferable.
- the glass particles further contain divanadium pentoxide (P 2 O 5 —V 2 O 5 glass particles).
- divanadium pentoxide P 2 O 5 —V 2 O 5 glass particles.
- diphosphorus pentoxide-divanadium pentoxide glass particles P 2 O 5 —V 2 O 5 glass particles
- the content of divanadium pentoxide is 1% by mass or more based on the total mass of the glass. It is preferably 1% by mass to 70% by mass.
- the particle size of the glass particles is not particularly limited, but the particle size (hereinafter sometimes abbreviated as “D50%”) when the accumulated weight is 50% is 0.5 ⁇ m or more and 10 ⁇ m or less. Is more preferable, and it is more preferably 0.8 ⁇ m or more and 8 ⁇ m or less.
- the workability at the time of preparation of the electrode paste composition is improved by setting the particle diameter of the glass particles to 0.5 ⁇ m or more.
- the particle diameter of the glass particles 10 ⁇ m or less the glass particles can be easily uniformly dispersed in the electrode paste composition, and fire-through can be efficiently generated in the firing process.
- the formed electrode is a silicon substrate. Adhesiveness is also improved.
- the content of the glass particles is preferably 0.1% by mass to 10% by mass, more preferably 0.5% by mass to 8% by mass, based on the total mass of the electrode paste composition. More preferably, the content is from 7% by mass to 7% by mass.
- the electrode paste composition according to the present invention includes at least one solvent and at least one resin.
- the liquid physical property for example, a viscosity, surface tension, etc.
- the paste composition for electrodes which concerns on this invention can be adjusted to the required liquid physical property according to the provision method at the time of providing to a silicon substrate.
- the solvent is not particularly limited.
- hydrocarbon solvents such as hexane, cyclohexane and toluene
- chlorinated hydrocarbon solvents such as dichloroethylene, dichloroethane and dichlorobenzene
- cyclics such as tetrahydrofuran, furan, tetrahydropyran, pyran, dioxane, 1,3-dioxolane and trioxane Ether solvents
- amide solvents such as N, N-dimethylformamide and N, N-dimethylacetamide
- sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide
- ketone solvents such as acetone, methyl ethyl ketone, diethyl ketone and cyclohexanone
- ethanol Alcohol compounds such as 2-propanol, 1-butanol and diacetone alcohol; 2,2,4-trimethyl-1,3-pentane
- a polyhydric alcohol ester solvent, a terpene solvent, and a polyhydric alcohol ether solvent from the viewpoints of coatability and printability when the electrode paste composition is formed on a silicon substrate.
- a polyhydric alcohol ester solvent, a terpene solvent, and a polyhydric alcohol ether solvent from the viewpoints of coatability and printability when the electrode paste composition is formed on a silicon substrate.
- the said solvent may be used individually by 1 type or in combination of 2 or more types.
- any resin that is usually used in the technical field can be used as long as it can be thermally decomposed by firing.
- cellulose resins such as methylcellulose, ethylcellulose, carboxymethylcellulose, and nitrocellulose
- polyvinyl alcohols such as polyvinyl alcohols
- polyvinylpyrrolidones acrylic resins
- vinyl acetate-acrylic acid ester copolymers such as polyvinyl butyral
- alkyd resins such as alkyd resins and castor oil fatty acid-modified alkyd resins
- epoxy resins such as phenol resins; rosin ester resins.
- the resin in the present invention is preferably at least one selected from cellulosic resins and acrylic resins, and more preferably at least one selected from cellulosic resins, from the viewpoint of disappearance during firing. preferable.
- the said resin may be used individually by 1 type or in combination of 2 or more types.
- the weight average molecular weight of the resin in the present invention is not particularly limited.
- the weight average molecular weight of the resin is preferably 5,000 or more and 500,000 or more, and more preferably 10,000 or more and 300,000 or less.
- the weight average molecular weight of the resin is 5000 or more, an increase in the viscosity of the electrode paste composition can be suppressed. This can be considered because, for example, a three-dimensional repulsive action is effectively exerted when adsorbed on phosphorus-containing copper alloy particles, and aggregation of particles is suppressed.
- the weight average molecular weight of the resin is 500,000 or less, aggregation of the resins in the solvent is suppressed, and as a result, the phenomenon that the viscosity of the electrode paste composition increases is suppressed.
- the weight average molecular weight of the resin is suppressed to an appropriate size, the resin combustion temperature is prevented from increasing, and the resin is not completely burned when the electrode paste composition is baked, and remains as a foreign substance. Thus, the resistance of the electrode can be reduced.
- the content of the solvent and the resin can be appropriately selected according to the desired liquid properties and the type of solvent and resin used.
- the resin content is preferably 0.01% by mass to 5% by mass, more preferably 0.05% by mass to 4% by mass, based on the total mass of the electrode paste composition.
- the content is more preferably 0.1% by mass to 3% by mass, and further preferably 0.15% by mass to 2.5% by mass.
- the total content of the solvent and the resin is preferably 3% by mass to 29.8% by mass, more preferably 5% by mass to 25% by mass, based on the total mass of the electrode paste composition. More preferably, the content is 7% by mass to 20% by mass.
- the electrode paste composition according to the present invention further includes at least one silver particle.
- the oxidation resistance is further improved, and the resistivity as an electrode is further reduced.
- the effect that the solder connection property at the time of setting it as a solar cell module improves is also acquired. This can be considered as follows, for example.
- a small amount of silver is dissolved in copper and a small amount of copper is dissolved in silver, and copper is formed at the interface between copper and silver.
- -A silver solid solution layer (solid solution region) is formed.
- the solid solution layer at high temperature is thought to cover the surface of silver particles and phosphorus-containing copper alloy particles as a non-equilibrium solid solution phase or a eutectic structure of copper and silver.
- Such a copper-silver solid solution layer can be considered to contribute to the oxidation resistance of the phosphorus-containing copper alloy particles at the electrode formation temperature.
- the copper-silver solid solution layer starts to be formed at a temperature of 300 ° C. to 500 ° C. or higher. Therefore, by using silver particles in combination with phosphorus-containing copper-containing particles having a peak temperature of an exothermic peak showing a maximum area in differential heat-thermal mass simultaneous measurement of 280 ° C. or more, the phosphorus-containing copper-containing particles are more effectively used. It can be considered that the oxidation resistance can be improved and the resistivity of the formed electrode is further reduced.
- the silver which comprises the said silver particle may contain the other atom mixed unavoidable.
- Other atoms inevitably mixed include Sb, Si, K, Na, Li, Ba, Sr, Ca, Mg, Be, Zn, Pb, Cd, Tl, V, Sn, Al, Zr, W, and Mo.
- Ti, Co, Ni, Au, etc. can be mentioned.
- the content rate of the other atom contained in the said silver particle can be 3 mass% or less in a silver particle, for example, and it is 1 mass% or less from a viewpoint of melting
- the particle size of the silver particles in the present invention is not particularly limited, but when the integrated mass is 50%, the particle size (D50%) is preferably 0.4 ⁇ m to 10 ⁇ m, preferably 1 ⁇ m to 7 ⁇ m. It is more preferable. By making the particle diameter of the silver particles 0.4 ⁇ m or more, the oxidation resistance is more effectively improved. In addition, when the particle diameter of the silver particles is 10 ⁇ m or less, the contact area between the silver particles and the metal particles such as the phosphorus-containing copper-containing particles in the electrode is increased, and the resistivity of the formed electrode is more effectively reduced.
- the relationship between the particle diameter (D50%) of the phosphorus-containing copper-containing particles and the particle diameter (D50%) of the silver particles is not particularly limited, but either one of the particles
- the diameter (D50%) is preferably smaller than the other particle diameter (D50%), and the ratio of the other particle diameter to one of the particle diameters is more preferably 1 to 10.
- This can be considered to be caused, for example, by an increase in the contact area between metal particles such as phosphorus-containing copper-containing particles and silver particles in the electrode.
- the silver particle content in the electrode paste composition according to the present invention is 8.4% by mass to 85.5% by mass in the electrode paste composition from the viewpoint of oxidation resistance and low electrode resistivity. It is preferably 8.9% by mass to 80.1% by mass.
- the content of the phosphorus-containing copper-containing particles is 9% when the total amount of the phosphorus-containing copper-containing particles and the silver particles is 100% by mass. % To 88% by mass, more preferably 17% to 77% by mass.
- the content of the phosphorus-containing copper-containing particles with respect to the total amount of the phosphorus-containing copper-containing particles and silver particles is 9% by mass or more, for example, when the glass particles contain vanadium pentoxide, silver and vanadium Reaction is suppressed, and the volume resistance of the electrode is further reduced.
- the electrode material is resistant to hydrofluoric acid (the property that the electrode material does not peel off from the silicon substrate by the hydrofluoric acid aqueous solution) Will improve. Moreover, it is suppressed more that the content rate of the said phosphorus containing copper containing particle
- the total content of the phosphorus-containing copper-containing particles and the silver particles is 70 mass from the viewpoint of oxidation resistance, low resistivity of the electrode, and applicability to a silicon substrate. % To 94% by mass, more preferably 72% to 92% by mass, still more preferably 72% to 90% by mass, and 74% to 88% by mass. Further preferred.
- the total content of the phosphorus-containing copper-containing particles and the silver particles is 70% by mass or more, a suitable viscosity can be easily achieved when the electrode paste composition is applied.
- production of the glaze at the time of providing the paste composition for electrodes can be more effectively suppressed because the total content of the said phosphorus containing copper containing particle
- the total content of the phosphorus-containing copper-containing particles and the silver particles is 70% by mass to 94% by mass from the viewpoint of oxidation resistance and low resistivity of the electrode.
- the glass particle content is preferably 0.1% by mass to 10% by mass, and the total content of the solvent and the resin is preferably 3% by mass to 29.8% by mass.
- the total content of the copper-containing particles and the silver particles is 74 to 88% by mass, the content of the glass particles is 1 to 7% by mass, and the total content of the solvent and the resin is 7%. More preferably, the content is from 20% by mass to 20% by mass.
- the electrode paste composition may further include at least one phosphorus-containing compound.
- oxidation resistance improves more effectively and the resistivity of an electrode falls more.
- the element in the phosphorus-containing compound diffuses as an n-type dopant, and an effect that power generation efficiency is improved when a solar cell is obtained.
- the phosphorus-containing compound is a compound having a large phosphorus atom content in the molecule from the viewpoint of oxidation resistance and low resistivity of the electrode, and does not cause evaporation or decomposition under a temperature condition of about 200 ° C. Preferably there is.
- the phosphorus-containing compound include phosphorous inorganic acids such as phosphoric acid, phosphates such as ammonium phosphate, phosphoric acid esters such as alkyl phosphates and aryl aryl esters, and cyclic phosphazenes such as hexaphenoxyphosphazene.
- the phosphorus-containing compound in the present invention is preferably at least one selected from the group consisting of phosphoric acid, ammonium phosphate, phosphate ester, and cyclic phosphazene, from the viewpoint of oxidation resistance and low electrode resistivity. More preferably, it is at least one selected from the group consisting of phosphate esters and cyclic phosphazenes.
- the content of the phosphorus-containing compound in the present invention is preferably 0.5% by mass to 10% by mass in the total mass of the electrode paste composition from the viewpoints of oxidation resistance and low electrode resistivity. More preferably, the content is 1% by mass to 7% by mass. Furthermore, in the present invention, at least one selected from the group consisting of phosphoric acid, ammonium phosphate, phosphate ester, and cyclic phosphazene is used as the phosphorus-containing compound in an amount of 0.5% by mass based on the total mass of the electrode paste composition.
- the electrode paste composition according to the present invention may further include other components that are usually used in the technical field, if necessary, in addition to the components described above.
- other components include plasticizers, dispersants, surfactants, inorganic binders, metal oxides, ceramics, and organometallic compounds.
- the phosphorus-containing copper-containing particles, glass particles, solvent, resin, and silver particles contained as necessary can be produced by dispersing and mixing them using a commonly used dispersion and mixing method.
- the flux is preferably applied to the electrode surface.
- the flux used for the electrode is the same as the flux used for the solder layer described later, and the preferred range is also the same. Further, the method of applying the flux to the electrode is the same as that applied to the solder layer.
- the electrode paste composition is applied to a region where the electrode is to be formed, and after drying, the electrode is formed in a desired region by firing. Can be formed.
- the paste composition for an electrode an electrode having a low resistivity can be formed even when a baking treatment is performed in the presence of oxygen (for example, in the air).
- the electrode paste composition when a solar cell electrode is formed using the electrode paste composition, the electrode paste composition is applied on a silicon substrate so as to have a desired shape, and dried and fired. Thereby, a solar cell electrode with low resistivity can be formed in a desired shape. Further, by using the electrode paste composition, an electrode having a low resistivity can be formed even when a baking treatment is performed in the presence of oxygen (for example, in the air).
- Examples of the method for applying the electrode paste composition on the silicon substrate include screen printing, an ink jet method, a dispenser method, and the like. From the viewpoint of productivity, application by screen printing is preferable.
- the electrode paste composition according to the present invention When the electrode paste composition according to the present invention is applied by screen printing, it preferably has a viscosity in the range of 80 Pa ⁇ s to 1000 Pa ⁇ s.
- the viscosity of the electrode paste composition is measured at 25 ° C. using a Brookfield HBT viscometer.
- the application amount of the electrode paste composition can be appropriately selected according to the size of the electrode to be formed.
- the application amount of the electrode paste composition can be 2 g / m 2 to 10 g / m 2, and preferably 4 g / m 2 to 8 g / m 2 .
- heat treatment conditions when forming an electrode using the electrode paste composition according to the present invention, heat treatment conditions usually used in the technical field can be applied.
- the heat treatment temperature (firing temperature) is 800 ° C. to 900 ° C.
- heat treatment conditions at a lower temperature can be applied.
- An electrode having good characteristics can be formed at a heat treatment temperature of 850 ° C. to 850 ° C.
- the heat treatment time can be appropriately selected according to the heat treatment temperature and the like, and can be, for example, 1 second to 20 seconds.
- solder layer The solder layer according to the present invention is provided on the electrode, and connects the electrode and a tab wire or the like. And the solder layer concerning this invention contains a flux. When the solder layer contains a flux, the adhesion between the electrode and the solder layer is improved, and the contact resistance at the interface between the electrode and the solder layer is further reduced.
- the type of solder material constituting the solder layer is not particularly limited, and examples thereof include lead-containing solder materials and lead-free solder materials.
- examples of the lead-containing solder material include Sn—Pb, Sn—Pb—Bi, and Sn—Pb—Ag.
- examples of the lead-free solder material include Sn—Ag—Cu, Sn—Ag, Sn—Sb, Sn—Cu, Bi—Sn, and In—Sn.
- the lead-free solder material is more preferably a lead-free solder material containing 32% by mass or more of tin. It is more preferable to use a lead-free solder material containing 42% by mass or more.
- the electrode and the solder layer can be connected by the effect that the surface oxide film of the electrode and the solder layer can be removed, the wettability of the surface is improved, and the re-formation of the surface oxide film can be suppressed.
- the electrode and the solder layer can be connected by the effect that the surface oxide film of the electrode and the solder layer can be removed, the wettability of the surface is improved, and the re-formation of the surface oxide film can be suppressed.
- at least one flux component selected from inorganic acids, halides, organic acids and rosin is preferably included.
- Examples of the inorganic acid include hydrobromic acid, hydrochloric acid, nitric acid, phosphoric acid, boric acid, sulfuric acid, and hydrofluoric acid, and at least one selected from hydrobromic acid, hydrochloric acid, nitric acid, phosphoric acid, and boric acid. It is preferable to contain.
- the halide preferably contains at least one selected from chloride and bromide.
- the chloride include zinc chloride, ammonium chloride, methylene chloride, magnesium chloride, bismuth chloride, barium chloride, tin chloride, silver chloride, potassium chloride, indium chloride, antimony chloride, and aluminum chloride. It is preferable to include at least one selected from ammonium.
- the bromide include phosphorus bromide, iodine bromide, methylene bromide, germanium bromide, sulfur bromide, ammonium bromide, zinc bromide and the like, and at least one selected from ammonium bromide and zinc bromide. It is preferable to contain.
- Examples of the organic acid include a carboxylic acid compound, a phenol derivative, and a sulfonic acid compound, and the carboxylic acid compound is preferable from the viewpoint that the surface oxide film of the electrode and the solder layer can be easily removed.
- Examples of the carboxylic acid compound include formic acid, acetic acid, oxalic acid, lauric acid, myristic acid, palmitic acid, stearic acid, sorbic acid, stearic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid.
- the phenol derivative include phenol resin, salicylic acid, picric acid, and the like, and preferably includes a phenol resin.
- these flux components may be used singly or in combination of two or more.
- a combination of rosin and organic acid, a combination of rosin and inorganic acid, a combination of rosin and halide, a combination of inorganic acid and halide, a halide and halide a combination of rosin and organic acid, the combination of rosin and inorganic acid, and the combination of rosin and halide are more preferable combinations.
- rosin and other flux components are combined in this way, rosin is preferably contained in an amount of 5% by mass to 40% by mass, more preferably 10% by mass to 30% by mass, More preferably, the content is 12% by mass to 20% by mass.
- the flux may contain a solvent from the viewpoint of workability when applied to the electrode and the solder layer.
- the solvent is preferably appropriately selected according to the type of flux component such as inorganic acid, halide, organic acid, rosin and the like.
- the solvent examples include water; ethylene glycol methyl ether propionate, ethylene glycol ethyl ether propionate, butyl carbitol acetate, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol methyl ether acetate, diethylene glycol ethyl ether acetate, Ether acetate solvents such as diethylene glycol-n-butyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, dipropylene glycol methyl ether acetate, dipropylene glycol ethyl ether acetate; ⁇ -terpinene, ⁇ -Te Terpene solvents such as lupineol, myrcene, alloocimene, limonene, dipentene, ⁇ -pin
- glycerol When rosin is used as the flux component in the flux, glycerol, ethylene glycol, isopropanol, or the like is preferably used as the solvent.
- inorganic acid water, butyl carbitol acetate, or the like.
- water, terpineol or the like is used when the halide is used as the flux component
- glycerin, ethylene glycol, isopropanol or the like is used when an organic acid is used as the flux component. preferable.
- the flux may further contain other components.
- other components include esters of the above carboxylic acid compounds.
- Specific examples of the ester of the carboxylic acid compound include ethyl acetate, trimethyl borate, methyl butyrate, methyl salicylate, ethyl formate, ethyl butyrate, ethyl caproate, pentyl acetate, isopentyl acetate, pencil valerate, pentyl butyrate, An octyl acetate etc. are mentioned, It is preferable that at least 1 sort (s) chosen from ethyl acetate and a trimethyl borate is included.
- the content of the flux component in the flux is preferably adjusted as appropriate.
- the content of rosin in the flux is preferably 5% by mass or more from the viewpoint that the surface oxide film of the electrode and the solder layer can be easily removed, and more preferably 10% by mass or more. preferable.
- an upper limit is not restrict
- the flux component is an inorganic acid, a halide or an organic acid
- the content is preferably 2 to 10% by mass, more preferably.
- the method for adding the flux to the solder layer is not particularly limited. From the viewpoint of improving the adhesion between the electrode and the solder layer, it is preferable that a flux exists at least on the surface of the solder layer.
- a method for producing such a solder layer for example, a method of applying a flux to the surface of at least one of the electrode and the solder layer can be mentioned.
- the method of incorporating the flux into the solder layer is not particularly limited, and examples thereof include a method of applying the flux to at least one surface of the electrode and the solder layer.
- a liquid containing the flux component and the solvent may be applied, or first, after applying the solvent, a liquid containing the flux component and the solvent may be applied. If the electrode has water absorption, apply the flux component and the liquid containing the solvent after applying the solvent from the viewpoint that the oxide film on the electrode surface can be effectively removed without the flux component soaking into the electrode. Is also suitable.
- the solder layer contains the flux by heat-treating the electrode and the solder layer after that.
- the amount of flux applied to the electrode surface is small, it is preferable to apply the flux also to the surface of the solder layer.
- the electrode prepared as described above and the solder layer are brought into contact with each other and pressed, and further heat-treated to connect the electrode and the solder layer.
- the pressing pressure when heat-treating the solder connecting the electrode and the approximate electrode is generally about 2 MPa, but in the present invention, the wettability between the electrode and the solder layer is improved so that it is 1.5 MPa or less. Can do. By reducing the pressing pressure when heat-treating the electrode and the solder layer, it is possible to prevent the silicon substrate from being damaged and the yield from being lowered when pressed.
- the heat treatment temperature at the time of connection can be appropriately selected according to the flux and the solder material.
- the temperature of the electrode and the solder layer can be 125 ° C. to 350 ° C.
- the pressing time can be appropriately selected according to the type of the flux, the solder material, and the heat treatment temperature, and can be, for example, 2 seconds to 120 seconds.
- heat treatment means we apply manual heat treatment using hot plates, heat blows, soldering irons, ovens, etc., and automatic heat treatment machines using devices such as pulse heat bonding devices, thermocompression bonding devices, and ultrasonic bonding devices. can do.
- cleaning to remove the flux can be performed.
- a flux that contains a large amount of halide and is likely to be corroded by residue it is desirable to carefully remove it using ultrasonic cleaning or the like.
- the use of the element of the present invention is not particularly limited, and can be used as a solar cell element, an electroluminescence light-emitting element, or the like.
- the substrate in the element has an impurity diffusion layer
- the electrode is formed on the impurity diffusion layer
- a solder layer containing flux is formed on the electrode.
- a solar cell element means what has the silicon substrate in which the pn junction was formed, and the electrode formed on the silicon substrate.
- a solar cell means the thing comprised by providing a tab line
- FIGS. 1, 2, and 3 A cross-sectional view of an example of a typical solar cell element, a schematic diagram of a light receiving surface, and a schematic diagram of a back surface are shown in FIGS. 1, 2, and 3, respectively.
- single crystal or polycrystalline Si is used for the semiconductor substrate 130 of the solar cell element.
- the semiconductor substrate 130 contains boron or the like and constitutes a p-type semiconductor.
- unevenness is formed by etching in order to suppress reflection of sunlight. As shown in FIG.
- the light-receiving surface side is doped with phosphorus or the like, an n-type semiconductor diffusion layer 131 is provided with a thickness on the order of submicrons, and a pn junction is formed at the boundary with the p-type bulk portion. The part is formed. Further, on the light receiving surface side, an antireflection layer 132 such as silicon nitride is provided on the diffusion layer 131 with a film thickness of about 100 nm by vapor deposition or the like.
- the light receiving surface electrode 133 provided on the light receiving surface side, and the current collecting electrode 134 and the output extraction electrode 135 formed on the back surface will be described.
- the light-receiving surface electrode 133 and the output extraction electrode 135 are formed from the electrode paste composition.
- the collecting electrode 134 is formed from an aluminum electrode paste composition containing glass powder. These electrodes are formed by applying the paste composition to a desired pattern by screen printing or the like, and then baking the paste composition at about 600 ° C. to 850 ° C. in the atmosphere.
- the glass particles contained in the electrode paste composition forming the light-receiving surface electrode 133 react with the antireflection layer 132 (fire-through), and the light-receiving surface electrode 133 and the diffusion layer are reacted. 131 is electrically connected (ohmic contact).
- the light-receiving surface electrode 133 is formed using the electrode paste composition, so that copper is suppressed as a conductive metal, and the oxidation of copper is suppressed. Formed with excellent productivity.
- the adhesion between the light receiving surface electrode 133 and the solder layer is improved, and further, the light receiving surface electrode 133 and the solder layer are The contact resistance at the interface is reduced.
- aluminum in the aluminum electrode paste composition that forms the collecting electrode 134 during firing diffuses to the back surface of the semiconductor substrate 130 to form the electrode component diffusion layer 136, thereby forming the semiconductor substrate 130.
- an ohmic contact can be obtained between the current collecting electrode 134 and the output extraction electrode 135.
- FIG. 4 is a view showing a back contact solar cell element which is an example of a solar cell element according to another aspect of the present invention.
- FIG. 4A is a perspective view of the light receiving surface and the AA cross-sectional structure, and
- FIG. It is a top view of a back surface side electrode structure.
- the cell wafer 1 made of a p-type semiconductor silicon substrate through holes penetrating both sides of the light receiving surface and the back surface are formed by laser drilling, etching, or the like. Further, a texture (not shown) for improving the light incident efficiency is formed on the light receiving surface side. Further, on the light receiving surface side, an n-type semiconductor layer 3 by n-type diffusion treatment and an antireflection film (not shown) are formed on the n-type semiconductor layer 3. These are manufactured by the same process as a conventional crystalline Si type solar cell element.
- the electrode paste composition according to the present invention is filled in the previously formed through-holes by a printing method or an ink jet method, and the electrode paste composition according to the present invention is also applied to the grid on the light receiving surface side.
- the composition layer which forms the through-hole electrode 4 and the grid electrode 2 for current collection is printed.
- a heavily doped layer 5 for preventing carrier recombination is formed on the opposite side (back side) of the light receiving surface.
- boron (B) or aluminum (Al) is used as an impurity element for forming the high-concentration doped layer 5, and a p + layer is formed.
- the high-concentration doped layer 5 may be formed by performing a thermal diffusion process using, for example, B as a diffusion source in an element manufacturing process before forming the antireflection film, or when using Al. May be formed by printing an Al paste on the opposite surface side in the printing step.
- the electrode paste composition fired at 650 ° C. to 850 ° C., filled in and printed on the antireflection film formed in the through hole and on the light receiving surface side has a lower n-type layer due to a fire through effect. Ohmic contact is achieved.
- the back electrode 6 and 7 is formed by printing and baking the electrode paste composition according to the present invention in stripes on both the n side and the p side, respectively. Has been.
- the back electrode 6 and the back electrode 7 are formed by using the electrode paste composition, so that copper is suppressed as a conductive metal, and the back surface of the low resistivity is suppressed.
- the electrode 6 and the back electrode 7 are formed with excellent productivity. Further, when a solder layer (not shown) containing flux is provided on the outer surfaces of the back electrode 6 and the back electrode 7, the adhesion between the back electrode 6 and the back electrode 7 and the solder layer is improved, and further the back electrode. 6 and the contact resistance of the interface between the back electrode 7 and the solder layer is reduced.
- the solar cell electrode paste composition of the present invention is not limited to the use of solar cell electrodes as described above.
- electrode wiring and shield wiring of plasma displays, ceramic capacitors, antenna circuits, and various sensors can also be suitably used for applications such as heat dissipation materials for circuits and semiconductor devices.
- the solar cell of the present invention includes at least one of the solar cell elements, and is configured by arranging tab wires on the electrodes of the solar cell element. Since a solder layer containing flux is provided on the electrode surface, the adhesion between the electrode and the solder layer is improved, and the contact resistance at the interface between the electrode and the solder layer is reduced, resulting in battery performance. A solar cell with excellent resistance can be obtained.
- the solar cell may further be configured by connecting a plurality of solar cell elements via tab wires and further sealing with a sealing material as necessary.
- the tab wire and the sealing material are not particularly limited, and can be appropriately selected from those usually used in the art.
- a silicon substrate An electrode that is a fired product of an electrode paste composition comprising phosphorus-containing copper alloy particles, glass particles, a solvent, and a resin provided on the silicon substrate; A solder layer containing flux provided on the electrode; A device having
- the flux includes at least one selected from a halide, an inorganic acid, an organic acid, and rosin.
- the inorganic acid includes at least one selected from hydrochloric acid, hydrobromic acid, nitric acid, phosphoric acid, and boric acid.
- solder layer contains 42% by mass or more of tin.
- the flux is a combination of rosin and organic acid, a combination of rosin and inorganic acid, a combination of rosin and halide, a combination of inorganic acid and halide, or a combination of halide and halide.
- the device according to any one of (1) to (8), which is contained.
- the flux includes an organic acid and at least one selected from glycerin, ethylene glycol, and isopropanol.
- the carboxylic acid ester is selected from ethyl acetate, trimethyl borate, methyl butyrate, methyl salicylate, ethyl formate, ethyl butyrate, ethyl caproate, pentyl acetate, isopentyl acetate, pencil valerate, pentyl butyrate and octyl acetate.
- the relationship between the particle diameter (D50%) of the phosphorus-containing copper-containing particles and the particle diameter (D50%) of the silver particles is such that the ratio of the other particle diameter to one of the particle diameters is 1 to 10.
- the content ratio of the phosphorus-containing copper-containing particles when the total amount of the phosphorus-containing copper-containing particles and the silver particles is 100% by mass is 9% by mass to 88% by mass (18) to (20) The device according to any one of the above.
- At least one flux component selected from a halide, an inorganic acid, an organic acid, and rosin; At least one solvent selected from water, ether acetate solvents, terpene solvents, alcohol solvents, ketone solvents, ether solvents, ester solvents, aprotic polar solvents and glycol monoether solvents;
- the flux provided between the electrode which is a baked product of the paste composition for electrodes containing phosphorus containing copper alloy particle
- the flux component is a combination of rosin and organic acid, a combination of rosin and inorganic acid, a combination of rosin and halide, a combination of inorganic acid and halide, or a combination of halide and halide.
- the flux as described in (27) above.
- the carboxylic acid ester is selected from ethyl acetate, trimethyl borate, methyl butyrate, methyl salicylate, ethyl formate, ethyl butyrate, ethyl caproate, pentyl acetate, isopentyl acetate, pencil valerate, pentyl butyrate and octyl acetate.
- the flux according to (33), wherein the flux is at least one kind.
- Example 1> Preparation of electrode paste composition Phosphorus-containing copper alloy particles containing 7% by mass of phosphorus were prepared by a conventional method, dissolved and powdered by a water atomization method, and then dried and classified. The classified powders were blended and subjected to deoxygenation / dehydration treatment to prepare phosphorus-containing copper alloy particles containing 7% by mass of phosphorus (hereinafter sometimes abbreviated as “Cu7P”). The particle diameter (D50%) of the phosphorus-containing copper alloy particles was 5 ⁇ m.
- a glass composed of 9 parts of zinc oxide (ZnO) (hereinafter sometimes abbreviated as “G1”) was prepared.
- the obtained glass G1 had a softening point of 420 ° C. and a crystallization temperature of over 600 ° C. Glass particles having a particle diameter (D50%) of 1.1 ⁇ m were obtained using the obtained glass G1.
- Terpineol (isomer mixture) solution 13 containing 85.1 parts of the phosphorus-containing copper alloy particles Cu7P obtained above, 1.7 parts of glass particles G1, and 3% by mass of ethyl cellulose (EC, weight average molecular weight 190000) 13 2 parts were mixed and stirred in an agate mortar for 20 minutes to prepare an electrode paste composition Cu7PG1.
- a p-type semiconductor substrate having a thickness of 190 ⁇ m having an n-type semiconductor layer, a texture, and an antireflection film (silicon nitride film) formed on the light-receiving surface is prepared and has a size of 125 mm ⁇ 125 mm. Cut out.
- a silver electrode paste composition manufactured by DuPont, conductor paste Solomet 159A was printed so as to have an electrode pattern as shown in FIG.
- the electrode pattern is composed of a finger line with a width of 150 ⁇ m and a bus bar with a width of 1.1 mm, and printing conditions (screen plate mesh, printing speed, printing pressure) were appropriately adjusted so that the film thickness after firing was about 5 ⁇ m. . This was placed in an oven heated to 150 ° C. for 15 minutes, and the solvent was removed by evaporation.
- an aluminum electrode paste PVG Solutions Inc.
- Solar Cell Paste (Al) HyperBSF Al Paste was printed on the entire surface other than the portion where the output extraction electrode was formed as shown in FIG.
- the printing conditions were appropriately adjusted so that the film thickness after firing was 40 ⁇ m. This was placed in an oven heated to 150 ° C. for 15 minutes, and the solvent was removed by evaporation. Furthermore, heat treatment (baking) was performed at 850 ° C. for 2 seconds in an infrared rapid heating furnace in an air atmosphere to obtain a light-receiving surface electrode and a collector electrode.
- the electrode paste composition Cu7PG1 obtained above was printed so as to have an electrode pattern as shown in the output extraction electrode of FIG.
- the electrode pattern was composed of a bus bar having a width of 4 mm, and the printing conditions (screen plate mesh, printing speed, printing pressure) were appropriately adjusted so that the film thickness after firing was 15 ⁇ m. This was placed in an oven heated to 150 ° C. for 15 minutes, and the solvent was removed by evaporation. Subsequently, heat treatment (firing) was performed at 600 ° C. for 10 seconds in an infrared rapid heating furnace in an air atmosphere to obtain an output extraction electrode.
- solder Sn96.5Ag3Cu0 solder Sn96.5Ag3Cu0 is applied thereon. .5 (hereinafter, solder is described using symbols according to JIS Z 3282) was placed on a copper wire coated with solder (usually called a tab wire). The solder is not particularly coated with flux, but it gets wet with the flux at the same time it is placed on the output extraction electrode.
- the semiconductor substrate on which the solder-coated tab wire was placed was placed on a hot plate and heated to 250 ° C. while applying a pressing load to the tab wire.
- the pressing load on the tab line was adjusted to about 1.0 MPa in terms of unit area. Thereafter, it was cooled to produce a solar cell element 1 on which an electrode connected to a desired solder was formed.
- Example 2 In Example 1, the flux was changed from an aqueous hydrochloric acid solution containing 5% zinc chloride and 5% ammonium chloride to butyl carbitol acetate containing 10% hydrobromic acid (hereinafter sometimes abbreviated as “BCA”). In the same manner as in Example 1, a solar cell element 2 in which an electrode connected to a desired solder was formed was produced.
- BCA butyl carbitol acetate containing 10% hydrobromic acid
- Example 3 An electrode connected to a desired solder is formed in the same manner as in Example 1 except that the aqueous solution containing 5% zinc chloride and 5% ammonium chloride as the flux is changed to an aqueous solution containing 5% hydrochloric acid. A solar cell element 3 was prepared.
- Example 4 In Example 1, except that the aqueous hydrochloric acid solution containing 5% zinc chloride and 5% ammonium chloride as the flux was changed to the aqueous solution containing 5% zinc chloride and 5% hydrochloric acid, and connected to the desired solder in the same manner as in Example 1. The solar cell element 4 in which the prepared electrode was formed was produced.
- Example 5 In Example 1, except that the aqueous hydrochloric acid solution containing 5% zinc chloride and 5% ammonium chloride as the flux was changed to terpineol containing 5% zinc chloride and 2% ammonium chloride, the same solder as in Example 1 was used. The solar cell element 5 in which the connected electrode was formed was produced.
- Example 6 In Example 1, except that the aqueous hydrochloric acid solution containing 5% zinc chloride and 5% ammonium chloride was changed to isopropanol containing 3% oxalic acid and 6% phenolic resin (hereinafter sometimes abbreviated as IPA). In the same manner as in Example 1, a solar cell element 6 in which an electrode connected to a desired solder was formed.
- IPA oxalic acid and 6% phenolic resin
- Example 7 In Example 1, an electrode connected to a desired solder was formed in the same manner as in Example 1 except that the aqueous hydrochloric acid solution containing 5% zinc chloride and 5% ammonium chloride was changed to glycerin containing 2% acetic acid as the flux. The produced solar cell element 7 was produced.
- Example 8 In Example 1, except that the aqueous hydrochloric acid solution containing 5% zinc chloride and 5% ammonium chloride as the flux was changed to IPA containing 30% rosin and 5% ethyl acetate, and connected to the desired solder in the same manner as in Example 1. A solar cell element 8 having the formed electrode was produced.
- Example 9 In Example 8, it was connected to the desired solder in the same manner as in Example 8 except that the IPA containing 30% rosin and 5% ethyl acetate was changed to IPA containing 12% rosin and 3% oxalic acid. A solar cell element 9 on which an electrode was formed was produced.
- Example 10 In Example 8, it was connected to a desired solder in the same manner as in Example 8 except that IPA containing 30% rosin and 5% ethyl acetate was changed to ethylene glycol containing 25% rosin and 1% formic acid as the flux. A solar cell element 10 on which an electrode was formed was produced.
- Example 11 An electrode connected to a desired solder in the same manner as in Example 8, except that the IPA containing 30% rosin and 5% ethyl acetate was changed to IPA containing 20% rosin and 2% acetic acid.
- the solar cell element 11 in which was formed.
- Example 12 Example 1 except that the aqueous solution of hydrochloric acid containing 5% zinc chloride and 5% ammonium chloride was changed to a glycerin solution of hydrochloric acid containing 5% zinc chloride and 2% ammonium chloride (hydrochloric acid concentration 2%) in Example 1. In the same manner as described above, a solar cell element 12 in which an electrode connected to desired solder was formed.
- Example 13 In Example 11, the heat treatment temperature of the electrode paste composition Cu7PG1 was changed from 600 ° C. to 550 ° C., and the flux was changed from IPA containing 20% rosin and 2% acetic acid to glycerin containing 20% rosin and 2% acetic acid.
- a solar cell element 13 having an electrode connected to a desired solder was produced in the same manner as in Example 11 except that.
- Example 14 In Example 13, the solar cell element 14 in which the electrode connected to the desired solder was formed in the same manner as in Example 13 except that the electrode pace and the heat treatment temperature of the composition Cu7PG1 were changed from 550 ° C. to 650 ° C. Was made.
- Example 15 phosphorus-containing copper alloy particles (Cu6P) containing 6% by mass of phosphorus were used instead of phosphorus-containing copper alloy particles Cu7PG1 containing 7% by mass of phosphorus, and the heat treatment temperature of the electrode paste composition was 550.
- a solar cell element 15 in which an electrode connected to a desired solder was formed was produced in the same manner as in Example 13 except that the temperature was changed from 0 ° C to 580 ° C.
- Example 16 a phosphorus-containing copper alloy particle (Cu8P) containing 8% by mass of phosphorus was used instead of the phosphorus-containing copper alloy particle Cu7PG1 containing 7% by mass of phosphorus, and the electrode pace and the heat treatment temperature of the composition were changed. Except having changed into 620 degreeC from 550 degreeC, it carried out similarly to Example 13, and produced the solar cell element 16 in which the electrode connected to the desired solder was formed.
- Cu8P phosphorus-containing copper alloy particle
- Example 17 In Example 13, instead of the glass particles G1, the electrode paste composition Cu7PG2 using the following adjusted glass particles (G2) was used, and the electrode pace and the heat treatment temperature of the composition were changed from 550 ° C. to 600 ° C. Except for this, a solar cell element 17 in which an electrode connected to a desired solder was formed was produced in the same manner as in Example 13.
- Glass particles G2 are composed of 45 parts of vanadium oxide (V 2 O 5 ), 24.2 parts of phosphorus oxide (P 2 O 5 ), 20.8 parts of barium oxide (BaO), 5 parts of antimony oxide (Sb 2 O 3 ), It consisted of 5 parts of tungsten oxide (WO 3 ) and had a particle size (D50%) of 1.7 ⁇ m. The glass had a softening point of 492 ° C. and a crystallization temperature of 600 ° C. or higher.
- Example 18 In Example 17, an electrode connected to a desired solder was obtained in the same manner as in Example 17 except that instead of the glass particle G2, the electrode paste composition Cu7PG11 using the following adjusted glass particle (G11) was used.
- the formed solar cell element 18 was produced.
- Glass particles G11 are composed of 3 parts of silicon dioxide (SiO 2 ), 60 parts of lead oxide (PbO), 18 parts of boron oxide (B 2 O 3 ), 5 parts of bismuth oxide (Bi 2 O 3 ), aluminum oxide (Al 2 O). 3 ) 5 parts and 9 parts of zinc oxide (ZnO), and the particle diameter (D50%) was 1.7 ⁇ m.
- the glass had a softening point of 420 ° C. and a crystallization temperature of 600 ° C. or higher.
- Example 19 In Example 13, except that the heat treatment temperature of the electrode paste composition was changed from 550 ° C. to 600 ° C., a solar cell element 19 in which an electrode connected to a desired solder was formed was produced in the same manner as in Example 13. did.
- Example 20 a solar cell element 20 in which an electrode connected to a desired solder was formed in the same manner as in Example 19 except that the temperature of the electrode when applying the flux was changed from room temperature to 150 ° C. did.
- Example 21 when applying the flux, it was connected to the desired solder in the same manner as in Example 19 except that only glycerin was first applied and then glycerin containing 20 parts of rosin and 2 parts of acetic acid was applied. A solar cell element 21 having electrodes formed thereon was produced.
- Example 22 In Example 19, when the semiconductor substrate on which the solder-coated tab wire was placed was placed on a hot plate and heated to 250 ° C. with a pressing load applied to the tab wire, a constant temperature treatment time of 10 minutes at 150 ° C. A solar cell element 22 in which an electrode connected to a desired solder was formed was produced in the same manner as in Example 19 except that was added.
- Example 23 In Example 19, the solar cell element 23 in which the electrode connected to the desired solder was formed in the same manner as in Example 19 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Sn95Ag5. Was made.
- Example 24 In Example 19, the solar cell element 24 in which the electrode connected to the desired solder was formed in the same manner as in Example 19 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Sn95Sb5. Was made.
- Example 25 the solar cell element 25 in which the electrode connected to the desired solder was formed in the same manner as in Example 19 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Sn97Cu3. Was made.
- Example 26 In Example 19, the solar cell element 26 in which the electrode connected to the desired solder was formed in the same manner as in Example 19 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Bi58Sn42. Was made.
- Example 27 In Example 19, the solar cell element 27 in which the electrode connected to the desired solder was formed in the same manner as in Example 19 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to In52Sn48. Was made.
- Example 28 In Example 2, the solar cell element 28 in which the electrode connected to the desired solder was formed in the same manner as in Example 2 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Sn63Pb37. Was made.
- Example 29 a solar cell element 29 in which an electrode connected to a desired solder was formed in the same manner as in Example 2 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Sn50Pb50. Was made.
- Example 30 the solar cell element 30 in which the electrode connected to the desired solder was formed in the same manner as in Example 2 except that the solder coated with the copper wire was changed from Sn96.5Ag3Cu0.5 to Sn62Pb36Ag2. Was made.
- Example 1 the composition for forming the output extraction electrode 135 was changed from phosphorus-containing copper alloy particles Cu7P to silver particles (Ag), and from an aqueous hydrochloric acid solution containing 5 parts of zinc chloride and 5 parts of ammonium chloride as a flux.
- a solar cell element C1 was produced in the same manner as in Example 1 except that the IPA containing 20 parts of rosin was changed and the heat treatment temperature of the electrode paste composition was changed from 600 ° C to 800 ° C.
- a solar cell element C32 was produced in the same manner as in Example 1, except that the aqueous hydrochloric acid solution containing 5 parts of zinc chloride and 5 parts of ammonium chloride was changed to glycerin as the flux.
- Eff conversion efficiency
- FF fill factor
- Voc open circuit voltage
- Jsc short circuit current
- the performance of the solar cell elements produced in Examples 1 to 30 was almost equal to or higher than that of the solar cell element produced in Comparative Example 1.
- Example 31 Using the electrode paste composition Cu7PG1 obtained above, a solar cell element 31 having the structure shown in FIGS. 4A and 4B was produced in the same manner as in Example 1. When the obtained solar cell element was evaluated in the same manner as described above, it was found that good characteristics were exhibited as described above.
- SYMBOLS 1 Cell wafer which consists of p-type silicon substrate 2 Current collecting grid electrode 3 N-type semiconductor layer 4 Through-hole electrode 5 High concentration doped layer 6 Back surface electrode 7 Back surface electrode 130 Semiconductor substrate 131 Diffusion layer 132 Antireflection layer 133 Light-receiving surface electrode 134 Electrode 135 Output extraction electrode 136 Electrode component diffusion layer
Landscapes
- Engineering & Computer Science (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Photovoltaic Devices (AREA)
- Conductive Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
前記シリコン基板上に設けられた、リン含有銅合金粒子とガラス粒子と溶剤と樹脂とを含む電極用ペースト組成物の焼成物である電極と、
前記電極上に設けられた、フラックスを含有するはんだ層と、
を有する素子。
前記素子の電極のはんだ層に接続されたタブ線と、
を有する太陽電池。
なお、本明細書において「~」はその前後に記載される数値をそれぞれ最小値及び最大値として含む範囲を示す。
また、本明細書において「工程」との語は、独立した工程だけではなく、他の工程と明確に区別できない場合であってもその工程の初期の目的が達成されれば、本用語に含まれる。
さらに本明細書において組成物中の各成分の量は、組成物中に各成分に該当する物質が複数存在する場合には、特に断らない限り、組成物中に存在する当該複数の物質の合計量を意味する。
本発明の素子は、シリコン基板と、前記シリコン基板上に設けられた電極と、前記電極の上に設けられたはんだ層とを有する。そして、前記電極は、リン含有銅合金粒子とガラス粒子と溶剤と樹脂とを含む電極用ペースト組成物の焼成物である。また、前記はんだ層は、フラックスを含有する。
以下では、本発明の素子の各構成部材について説明する。
本発明におけるシリコン基板は、前記電極用ペースト組成物を用いて電極を形成し、その電極の上にはんだ層を形成する形態に用いられるものであれば、種類は特に制限されるものではない。シリコン基板としては、例えば太陽電池形成用のpn接合を有するシリコン基板、太陽電池以外の半導体デバイスの製造に用いるシリコン基板等を挙げることができる。
本発明に係る電極は、リン含有銅合金粒子とガラス粒子と溶剤と樹脂とを含む電極用ペースト組成物の焼成物である。以下、電極形成に用いる電極用ペースト組成物の詳細を説明する。
本発明に係る電極用ペースト組成物は、リン含有銅合金粒子の少なくとも1種を含む。
前記リン含有銅合金粒子に含まれるリン含有率は、耐酸化性と低抵抗率の観点から、6質量%以上8質量%以下であることが好ましく、6.3質量%以上7.8質量%以下であることがより好ましく、6.5質量%以上7.5質量%以下であることが更に好ましい。リン含有銅合金粒子に含まれるリン含有率が8質量%以下であることで、形成した電極のより低い抵抗率を達成することが可能であり、また、リン含有銅合金粒子の生産性に優れる。また6質量%以上であることで、より優れた耐酸化性を達成できる。
また前記リン含有銅合金粒子に含まれる他の原子の含有率は、例えば、前記リン含有銅合金粒子中に3質量%以下とすることができ、耐酸化性と低抵抗率の観点から、1質量%以下であることが好ましい。
具体的には例えば、リン含有銅合金を溶解し、これをノズル噴霧によって粉末化した後、得られた粉末を乾燥、分級することで、所望のリン含有銅合金粒子を製造することができる。また、分級条件を適宜選択することで所望の粒子径を有するリン含有銅合金粒子を製造することができる。
本発明に係る電極用ペースト組成物は、ガラス粒子の少なくとも1種を含む。電極用ペースト組成物がガラス粒子を含むことにより、焼成時に電極部と基板との密着性が向上する。また、電極形成温度において、いわゆるファイヤースルーによって反射防止膜である窒化ケイ素膜が取り除かれ、電極とシリコン基板とのオーミックコンタクトが形成される。
本発明に係る電極用ペースト組成物は、溶剤の少なくとも1種と樹脂の少なくとも1種とを含む。これにより本発明に係る電極用ペースト組成物の液物性(例えば、粘度、表面張力等)を、シリコン基板に付与する際の付与方法に応じて必要とされる液物性に調整することができる。
本発明において前記溶剤は1種単独でも、2種以上を組み合わせて用いてもよい。
本発明において前記樹脂は1種単独でも、2種以上を組み合わせて用いてもよい。
例えば、樹脂の含有率は、電極用ペースト組成物の全質量中に、0.01質量%~5質量%であることが好ましく、0.05質量%~4質量%であることがより好ましく、0.1質量%~3質量%であることが更に好ましく、0.15質量%~2.5質量%であることが更に好ましい。
また、溶剤と樹脂の総含有量が、電極用ペースト組成物の全質量中に3質量%~29.8質量%であることが好ましく、5質量%~25質量%であることがより好ましく、7質量%~20質量%であることがさらに好ましい。
溶剤と樹脂の含有量が前記範囲内であることにより、電極用ペースト組成物をシリコン基板に付与する際の付与適性が良好になり、所望の幅および高さを有する電極をより容易に形成することができる。
本発明に係る電極用ペースト組成物は、銀粒子の少なくとも1種を更に含むことが好ましい。銀粒子を含むことで耐酸化性がより向上し、電極としての抵抗率がより低下する。さらに太陽電池モジュールとした場合のはんだ接続性が向上するという効果も得られる。このことは例えば、以下のように考えることができる。
また前記銀粒子に含まれる他の原子の含有率は、例えば銀粒子中に3質量%以下とすることができ、融点及び電極の低抵抗率化の観点から、1質量%以下であることが好ましい。
前記リン含有銅含有粒子および前記銀粒子の総含有量が70質量%以上であることで、電極用ペースト組成物を付与する際に好適な粘度を容易に達成することができる。また前記リン含有銅含有粒子および前記銀粒子の総含有量が94質量%以下であることで、電極用ペースト組成物を付与する際のかすれの発生をより効果的に抑制することができる。
前記電極用ペースト組成物は、リン含有化合物の少なくとも1種を更に含んでもよい。これにより、より効果的に耐酸化性が向上し、電極の抵抗率がより低下する。さらにシリコン基板において、リン含有化合物中の元素がn型ドーパントとして拡散し、太陽電池としたときに発電効率が向上するという効果も得られる。
前記リン含有化合物としては、耐酸化性と電極の低抵抗率の観点から、分子内におけるリン原子の含有率が大きい化合物であって、200℃程度の温度条件で蒸発や分解を起こさない化合物であることが好ましい。
本発明におけるリン含有化合物は、耐酸化性と電極の低抵抗率の観点から、リン酸、リン酸アンモニウム、リン酸エステル、および環状ホスファゼンからなる群から選ばれる少なくとも1種であることが好ましく、リン酸エステル、および環状ホスファゼンからなる群から選ばれる少なくとも1種であることがより好ましい。
さらに本発明においては、リン含有化合物としてリン酸、リン酸アンモニウム、リン酸エステル、および環状ホスファゼンからなる群から選ばれる少なくとも1種を、電極用ペースト組成物の全質量中に0.5質量%~10質量%含むことが好ましく、リン酸エステルおよび環状ホスファゼンからなる群から選ばれる少なくとも1種を、電極用ペースト組成物の全質量中に1質量%~7質量%含むことがより好ましい。
さらに本発明に係る電極用ペースト組成物は、上述した成分に加え、必要に応じて、当該技術分野で通常用いられるその他の成分をさらに含むことができる。その他の成分としては、可塑剤、分散剤、界面活性剤、無機結合剤、金属酸化物、セラミック、有機金属化合物等を挙げることができる。
本発明に係る電極用ペースト組成物を用いて電極を製造する方法としては、前記電極用ペースト組成物を、電極を形成する領域に付与し、乾燥後に、焼成することで所望の領域に電極を形成することができる。前記電極用ペースト組成物を用いることで、酸素の存在下(例えば、大気中)で焼成処理を行っても、抵抗率の低い電極を形成することができる。
一般に、熱処理温度(焼成温度)としては800℃~900℃であるが、本発明に係る電極用ペースト組成物を用いる場合には、より低温での熱処理条件を適用することができ、例えば、600℃~850℃の熱処理温度で良好な特性を有する電極を形成することができる。
また熱処理時間は、熱処理温度等に応じて適宜選択することができ、例えば、1秒~20秒とすることができる。
本発明に係るはんだ層は、前記電極の上に設けられるものであり、前記電極とタブ線などとを接続する。そして、本発明に係るはんだ層はフラックスを含有する。前記はんだ層がフラックスを含有することで、前記電極と前記はんだ層との密着性が向上し、更には前記電極と前記はんだ層との界面の接触抵抗が低減する効果が得られる。
電極と概電極を接続するはんだを熱処理する際の押し付け圧力は、一般に2MPa程度とされているが、本発明においては、電極とはんだ層との濡れ性が向上するため1.5MPa以下とすることができる。電極とはんだ層を熱処理する際の押し付け圧力を低減することにより、押し付けた際にシリコン基板が破損し歩留まりが低下することを防ぐことができる。
更に押し付け時間は、フラックスの種類、はんだ材料、熱処理温度に応じて適宜選択することができ、例えば、2秒~120秒とすることができる。
熱処理手段としては、ホットプレート、ヒートブロー、はんだごて、オーブン等を用いた手作業による熱処理や、パルスヒート接合装置、加熱圧着装置、超音波接合装置等の装置を利用した自動熱処理機を適用することができる。
本発明の素子の用途は特に限定されず、太陽電池素子、エレクトロルミネッセンス発光素子などとして用いることができる。
本発明の太陽電池素子は、前記素子における前記基板が不純物拡散層を有し、この不純物拡散層の上に前記電極が形成され、そして前記電極上にフラックスを含有するはんだ層が形成されている。これにより、良好な特性を有する太陽電池素子が得られ、該太陽電池の生産性に優れる。
代表的な太陽電池素子の一例の断面図、受光面の概要図及び裏面の概要図を、それぞれ図1、図2及び図3に示す。
通常、太陽電池素子の半導体基板130には、単結晶または多結晶Siなどが使用される。この半導体基板130には、ホウ素などが含有され、p型半導体を構成している。受光面側は、太陽光の反射を抑制するために、エッチングにより凹凸(テクスチャー、図示せず)が形成されている。図1に示されるように、その受光面側にはリンなどがドーピングされ、n型半導体の拡散層131がサブミクロンオーダーの厚みで設けられているとともに、p型バルク部分との境界にpn接合部が形成されている。さらに受光面側には、拡散層131上に窒化シリコンなどの反射防止層132が蒸着法などによって膜厚100nm前後で設けられている。
本発明においては、前記電極用ペースト組成物を用いて受光面電極133が形成されることで、導電性金属として銅を含みながら、銅の酸化が抑制され、低抵抗率の受光面電極133が優れた生産性で形成される。
また、受光面電極133の外側表面に、フラックスを含有するはんだ層(不図示)を設けると、受光面電極133とはんだ層との密着性が向上し、更には受光面電極133とはんだ層との界面の接触抵抗が低減する。
ここで、充填用と印刷用に用いるペーストでは、粘度を始めとして、それぞれのプロセスに最適な組成のペーストを使用するのが望ましいが、同じ組成のペーストで充填、印刷を一括で行ってもよい。
本発明の太陽電池は、前記太陽電池素子の少なくとも1つを含み、太陽電池素子の電極上にタブ線が配置されて構成される。電極表面にはフラックスを含有するはんだ層が設けられているため、電極とはんだ層との密着性が向上し、更には電極とはんだ層との界面の接触抵抗が低減し、結果として、電池性能に優れた太陽電池が得られる。
(1)シリコン基板と、
前記シリコン基板上に設けられた、リン含有銅合金粒子とガラス粒子と溶剤と樹脂とを含む電極用ペースト組成物の焼成物である電極と、
前記電極上に設けられた、フラックスを含有するはんだ層と、
を有する素子。
前記素子の電極のはんだ層に接続されたタブ線と、
を有する太陽電池。
前記電極と前記はんだ層とを、前記フラックスを塗布した面で接触させて加熱処理する工程と、
を有する、前記(1)~(23)のいずれか1項に記載の素子の製造方法。
水、エーテルアセテート系溶剤、テルペン系溶剤、アルコール系溶剤、ケトン系溶剤、エーテル系溶剤、エステル系溶剤、非プロトン性極性溶剤およびグリコールモノエーテル系溶剤から選ばれる少なくとも1種の溶剤と、
を含有する、リン含有銅合金粒子とガラス粒子と溶剤と樹脂とを含む電極用ペースト組成物の焼成物である電極と、はんだ層との間に付与するフラックス。
本明細書に記載された全ての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。
(a)電極用ペースト組成物の調製
7質量%のリンを含むリン含有銅合金粒子を定法により調製し、これを溶解して水アトマイズ法により粉末化した後、乾燥、分級した。分級した粉末をブレンドして、脱酸素・脱水分処理し、7質量%のリンを含むリン含有銅合金粒子(以下、「Cu7P」と略記することがある)を調整した。尚、リン含有銅合金粒子の粒子径(D50%)は5μmであった。
得られたガラスG1を用いて、粒子径(D50%)が1.1μmであるガラス粒子を
得た。
受光面にn型半導体層、テクスチャーおよび反射防止膜(窒化珪素膜)が形成された膜厚さ190μmのp型半導体基板を用意し、125mm×125mmの大きさに切り出した。その受光面にスクリーン印刷法を用い、銀電極用ペースト組成物(デュポン株式会社製、導体ペーストSolamet159A)を図2に示すような電極パターンとなるように印刷した。電極のパターンは150μm幅のフィンガーラインと1.1mm幅のバスバーで構成され、焼成後の膜厚が約5μmとなるよう、印刷条件(スクリーン版のメッシュ、印刷速度、印圧)を適宜調整した。これを150℃に加熱したオーブンの中に15分間入れ、溶剤を蒸散により取り除いた。
社製、Solar Cell Paste(Al) HyperBSF Al Paste)を同様にスクリーン印刷で、図3に示すように出力取出し電極を形成する部分以外の全面に印刷した。焼成後の膜厚が40μmとなるよう印刷条件は適宜調整した。これを150℃に加熱したオーブンの中に15分間入れ、溶剤を蒸散により取り除いた。
更に、赤外線急速加熱炉内で大気雰囲気下、850℃で2秒間の加熱処理(焼成)を行い、受光面電極および集電電極を得た。
続いて、赤外線急速加熱炉内で大気雰囲気下、600℃で10秒間の熱処理(焼成)を行い、出力取出し電極を得た。
その後冷却し、所望のはんだに接続された電極が形成された太陽電池素子1を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液から臭化水素酸10%を含むブチルカルビトールアセテート(以下、「BCA」と略記することがある)に変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子2を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液から塩酸5%を含む水溶液に変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子3を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液から塩化亜鉛5%および塩酸5%を含む水溶液に変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子4を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液から塩化亜鉛5%および塩化アンモニウム2%を含むテルピネオールに変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子5を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液からシュウ酸3%およびフェノール樹脂6%を含むイソプロパノール(以下、IPAと略記することがある)に変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子6を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液から酢酸2%を含むグリセリンに変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子7を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液からロジン30%および酢酸エチル5%を含むIPAに変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子8を作製した。
実施例8において、フラックスとしてロジン30%および酢酸エチル5%を含むIPAからロジン12%およびシュウ酸3%を含むIPAに変更した以外は実施例8と同様にして、所望のはんだに接続された電極が形成された太陽電池素子9を作製した。
実施例8において、フラックスとしてロジン30%および酢酸エチル5%を含むIPAからロジン25%および蟻酸1%を含むエチレングリコールに変更した以外は実施例8と同様にして、所望のはんだに接続された電極が形成された太陽電池素子10を作製した。
実施例8において、フラックスとしてロジン30%および酢酸エチル5%を含むIPAからロジン20%および酢酸2%を含むIPAに変更した以外は実施例8と同様にして、所望のはんだに接続された電極が形成された太陽電池素子11を作製した。
実施例1において、フラックスとして塩化亜鉛5%および塩化アンモニウム5%を含む塩酸水溶液から塩化亜鉛5%および塩化アンモニウム2%を含む塩酸のグリセリン溶液(塩酸濃度2%)に変更した以外は実施例1と同様にして、所望のはんだに接続された電極が形成された太陽電池素子12を作製した。
実施例11において、電極用ペースト組成物Cu7PG1の熱処理温度を600℃から550℃に変更し、且つフラックスとしてロジン20%および酢酸2%を含むIPAからロジン20%および酢酸2%を含むグリセリンに変更した以外は実施例11と同様にして、所望のはんだに接続された電極が形成された太陽電池素子13を作製した。
実施例13において、電極用ペースと組成物Cu7PG1の熱処理温度を550℃から650℃に変更した以外は実施例13と同様にして、所望のはんだに接続された電極が形成された太陽電池素子14を作製した。
実施例13において、7質量%のリンを含むリン含有銅合金粒子Cu7PG1の代わりに6質量%のリンを含むリン含有銅合金粒子(Cu6P)を用い、且つ電極用ペースト組成物の熱処理温度を550℃から580℃に変更した以外は実施例13と同様にして、所望のはんだに接続された電極が形成された太陽電池素子15を作製した。
実施例13において、7質量%のリンを含むリン含有銅合金粒子Cu7PG1の代わりに8質量%のリンを含むリン含有銅合金粒子(Cu8P)を用い、且つ電極用ペースと組成物の熱処理温度を550℃から620℃に変更した以外は実施例13と同様にして、所望のはんだに接続された電極が形成された太陽電池素子16を作製した。
実施例13において、ガラス粒子G1に代えて、下記調整したガラス粒子(G2)を用いた電極用ペースト組成物Cu7PG2とし、且つ電極用ペースと組成物の熱処理温度を550℃から600℃に変更した以外は実施例13と同様にして、所望のはんだに接続された電極が形成された太陽電池素子17を作製した。
ガラス粒子G2は、酸化バナジウム(V2O5)45部、酸化リン(P2O5)24.2部、酸化バリウム(BaO)20.8部、酸化アンチモン(Sb2O3)5部、酸化タングステン(WO3)5部からなり、粒子径(D50%)が1.7μmであった。また、このガラスの軟化点は492℃、結晶化温度は600℃以上であった。
実施例17において、ガラス粒子G2に代えて、下記調整したガラス粒子(G11)を用いた電極用ペースト組成物Cu7PG11とした以外は実施例17と同様にして、所望のはんだに接続された電極が形成された太陽電池素子18を作製した。
ガラス粒子G11は、二酸化ケイ素(SiO2)3部、酸化鉛(PbO)60部、酸化ホウ素(B2O3)18部、酸化ビスマス(Bi2O3)5部、酸化アルミニウム(Al2O3)5部、酸化亜鉛(ZnO)9部からなり、粒子径(D50%)は1.7μmであった。また、このガラスの軟化点は420℃、結晶化温度は600℃以上であった。
実施例13において、電極用ペースト組成物の熱処理温度を550℃から600℃に変更した以外は実施例13と同様にして、所望のはんだに接続された電極が形成された太陽電池素子19を作製した。
実施例19において、フラックスを塗布する際の電極の温度を常温から150℃に変更した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子20を作製した。
実施例19において、フラックスを塗布する際、最初にグリセリンのみを塗布し、次いでロジン20部および酢酸2部を含むグリセリンを塗布した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子21を作製した。
実施例19において、はんだコーティングしたタブ線を乗せたままの半導体基板をホットプレートに乗せ、タブ線に押し付け荷重を掛けたまま250℃になるまで加熱する際、150℃で10分間の定温処理時間を追加した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子22を作製した。
実施例19において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からSn95Ag5に変更した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子23を作製した。
実施例19において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からSn95Sb5に変更した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子24を作製した。
実施例19において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からSn97Cu3に変更した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子25を作製した。
実施例19において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からBi58Sn42に変更した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子26を作製した。
実施例19において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からIn52Sn48に変更した以外は実施例19と同様にして、所望のはんだに接続された電極が形成された太陽電池素子27を作製した。
実施例2において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からSn63Pb37に変更した以外は実施例2と同様にして、所望のはんだに接続された電極が形成された太陽電池素子28を作製した。
実施例2において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からSn50Pb50に変更した以外は実施例2と同様にして、所望のはんだに接続された電極が形成された太陽電池素子29を作製した。
実施例2において、銅線をコーティングしているはんだをSn96.5Ag3Cu0.5からSn62Pb36Ag2に変更した以外は実施例2と同様にして、所望のはんだに接続された電極が形成された太陽電池素子30を作製した。
実施例1において、出力取出し電極135を形成するための組成物においてリン含有銅合金粒子Cu7Pから銀粒子(Ag)に変更し、且つフラックスとして塩化亜鉛5部および塩化アンモニウム5部を含む塩酸水溶液からロジン20部を含むIPAに変更し、電極用ペースト組成物の熱処理温度を600℃から800℃に変更した以外は実施例1と同様にして、太陽電池素子C1を作製した。
実施例1において、フラックスとして塩化亜鉛5部および塩化アンモニウム5部を含む塩酸水溶液からグリセリンに変更した以外は実施例1と同様にして、太陽電池素子C32を作製した。
作製した太陽電池素子の評価は、擬似太陽光として(株)ワコム電創製WXS-155S-10、電流-電圧(I-V)評価測定器としてI-V CURVE TRACER MP-160(EKO INSTRUMENT社製)の測定装置を組み合わせて行った。太陽電池としての発電性能についての各測定値を、比較例1Cの測定値を100.0とした相対値として表2に示した。なお、太陽電池としての発電性能を示すEff(変換効率)、FF(フィルファクター)、Voc(開放電圧)およびJsc(短絡電流)は、それぞれJIS-C-8912、JIS-C-8913およびJIS-C-8914に準拠して測定を行なうことで得られたものである。
尚、比較例2においては、出力取出し電極をタブ線に接続することができず、したがって評価不能であった。
上記で得られた電極用ペースト組成物Cu7PG1を用いて、実施例1と同様にして図4A及び図4Bに示したような構造を有する太陽電池素子31を作製した。
得られた太陽電池素子について上記と同様にして評価したところ、上記と同様に良好な特性を示すことが分かった。
2 集電用グリッド電極
3 n型半導体層
4 スルーホール電極
5 高濃度ドープ層
6 裏面電極
7 裏面電極
130 半導体基板
131 拡散層
132 反射防止層
133 受光面電極
134 集電電極
135 出力取出し電極
136 電極成分拡散層
Claims (10)
- シリコン基板と、
前記シリコン基板上に設けられた、リン含有銅合金粒子とガラス粒子と溶剤と樹脂とを含む電極用ペースト組成物の焼成物である電極と、
前記電極上に設けられた、フラックスを含有するはんだ層と、
を有する素子。 - 前記フラックスが、ハロゲン化物、無機酸、有機酸、およびロジンから選ばれる少なくとも1種を含む請求項1に記載の素子。
- 前記ハロゲン化物が、塩化物および臭化物から選ばれる少なくとも1種である請求項2に記載の素子。
- 前記無機酸が、塩酸、臭化水素酸、硝酸、リン酸およびホウ酸から選ばれる少なくとも1種を含む請求項2に記載の素子。
- 前記有機酸が、カルボン酸を含む請求項2に記載の素子。
- 前記カルボン酸が、蟻酸、酢酸およびシュウ酸から選ばれる少なくとも1種を含む請求項5に記載の素子。
- 前記フラックスが、ロジンを5質量%以上含有する、請求項2~請求項6のいずれか1項に記載の素子。
- 前記はんだ層が、錫を42質量%以上含有する、請求項1~請求項7のいずれか1項に記載の素子。
- 前記シリコン基板が不純物拡散層を有しpn接合されてなり、前記不純物拡散層の上に前記電極を有する太陽電池に用いる請求項1~請求項8のいずれか1項に記載の素子。
- 請求項9に記載の太陽電池に用いる素子と、
前記素子の電極のはんだ層に接続されたタブ線と、
を有する太陽電池。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013525729A JP5725180B2 (ja) | 2011-07-25 | 2012-07-24 | 素子および太陽電池 |
CN201280036709.6A CN103890960A (zh) | 2011-07-25 | 2012-07-24 | 元件及太阳能电池 |
US14/233,383 US20140158196A1 (en) | 2011-07-25 | 2012-07-24 | Element and photovoltaic cell |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-162598 | 2011-07-25 | ||
JP2011162598 | 2011-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013015285A1 true WO2013015285A1 (ja) | 2013-01-31 |
Family
ID=47601128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/068721 WO2013015285A1 (ja) | 2011-07-25 | 2012-07-24 | 素子および太陽電池 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140158196A1 (ja) |
JP (1) | JP5725180B2 (ja) |
CN (1) | CN103890960A (ja) |
TW (1) | TW201310663A (ja) |
WO (1) | WO2013015285A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017136636A (ja) * | 2016-02-05 | 2017-08-10 | 株式会社弘輝 | フラックス及びはんだ組成物 |
TWI668709B (zh) * | 2017-07-25 | 2019-08-11 | 日商千住金屬工業股份有限公司 | 銅銀合金之合成方法、導通部之形成方法、銅銀合金及導通部 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012039265A1 (ja) * | 2010-09-24 | 2012-03-29 | 株式会社日立製作所 | 半導体接合素子およびそれを用いた半導体デバイス、並びに半導体接合素子の製造方法 |
CN103560089B (zh) * | 2013-10-22 | 2017-02-08 | 中船重工西安东仪科工集团有限公司 | 表贴元器件引脚去氧化方法 |
EP3159934B1 (en) * | 2014-09-30 | 2018-03-21 | LG Electronics Inc. | Solar cell panel |
JP6696665B2 (ja) * | 2015-10-25 | 2020-05-20 | 農工大ティー・エル・オー株式会社 | 超音波半田付け方法および超音波半田付け装置 |
US10707531B1 (en) | 2016-09-27 | 2020-07-07 | New Dominion Enterprises Inc. | All-inorganic solvents for electrolytes |
CN107175433A (zh) * | 2017-04-19 | 2017-09-19 | 天津大学 | 一种低温烧结的锡掺杂纳米银焊膏的制备方法 |
JP6940565B2 (ja) * | 2018-09-27 | 2021-09-29 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
CN111040632A (zh) * | 2019-12-26 | 2020-04-21 | 无锡市斯威克科技有限公司 | 一种光伏预涂材料、预涂焊带及其制备方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001110232A (ja) * | 1999-10-13 | 2001-04-20 | Murata Mfg Co Ltd | 導電性ペーストおよびそれを用いた半導体セラミック電子部品 |
JP2005222737A (ja) * | 2004-02-03 | 2005-08-18 | Sumitomo Metal Mining Co Ltd | 外部電極用銅ペースト組成物 |
JP2007019106A (ja) * | 2005-07-05 | 2007-01-25 | Kyocera Chemical Corp | 電極形成用導電性ペースト及び太陽電池セル |
JP2008034592A (ja) * | 2006-07-28 | 2008-02-14 | Sanyo Electric Co Ltd | 光起電力素子及びその製造方法 |
JP2010013730A (ja) * | 2008-06-05 | 2010-01-21 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト用銅粉及び導電性ペースト |
JP2010059469A (ja) * | 2008-09-03 | 2010-03-18 | Asahi Glass Co Ltd | 銅ナノ粒子の製造方法、金属ペーストおよび金属膜を有する物品 |
WO2011046176A1 (ja) * | 2009-10-15 | 2011-04-21 | 日立化成工業株式会社 | 導電性接着剤、太陽電池及びその製造方法、並びに太陽電池モジュール |
WO2011090215A1 (ja) * | 2010-01-25 | 2011-07-28 | 日立化成工業株式会社 | 電極用ペースト組成物及び太陽電池 |
WO2011090211A1 (ja) * | 2010-01-25 | 2011-07-28 | 日立化成工業株式会社 | 電極用ペースト組成物および太陽電池 |
WO2011090214A1 (ja) * | 2010-01-25 | 2011-07-28 | 日立化成工業株式会社 | 電極用ペースト組成物および太陽電池 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE786932A (fr) * | 1971-07-28 | 1973-01-29 | Int Nickel Ltd | Fondants de soudage |
US5428249A (en) * | 1992-07-15 | 1995-06-27 | Canon Kabushiki Kaisha | Photovoltaic device with improved collector electrode |
JP3734361B2 (ja) * | 1998-03-23 | 2006-01-11 | 三菱電機株式会社 | 太陽電池モジュール用はんだ付けフラックスおよびクリームはんだ |
JP4868716B2 (ja) * | 2004-04-28 | 2012-02-01 | 三井金属鉱業株式会社 | フレーク銅粉及び導電性ペースト |
CN1981348A (zh) * | 2004-07-15 | 2007-06-13 | 积水化学工业株式会社 | 导电性微粒、导电性微粒的制造方法以及各向异性导电材料 |
US7494607B2 (en) * | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
JP5095237B2 (ja) * | 2007-02-28 | 2012-12-12 | 日本特殊陶業株式会社 | 色素増感型太陽電池及びその製造方法 |
WO2009110095A1 (ja) * | 2008-03-07 | 2009-09-11 | 富士通株式会社 | 導電材料、導電ペースト、回路基板、及び半導体装置 |
US20090266409A1 (en) * | 2008-04-28 | 2009-10-29 | E.I.Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
US8710355B2 (en) * | 2008-12-22 | 2014-04-29 | E I Du Pont De Nemours And Company | Compositions and processes for forming photovoltaic devices |
-
2012
- 2012-07-24 JP JP2013525729A patent/JP5725180B2/ja not_active Expired - Fee Related
- 2012-07-24 CN CN201280036709.6A patent/CN103890960A/zh active Pending
- 2012-07-24 WO PCT/JP2012/068721 patent/WO2013015285A1/ja active Application Filing
- 2012-07-24 US US14/233,383 patent/US20140158196A1/en not_active Abandoned
- 2012-07-25 TW TW101126794A patent/TW201310663A/zh unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001110232A (ja) * | 1999-10-13 | 2001-04-20 | Murata Mfg Co Ltd | 導電性ペーストおよびそれを用いた半導体セラミック電子部品 |
JP2005222737A (ja) * | 2004-02-03 | 2005-08-18 | Sumitomo Metal Mining Co Ltd | 外部電極用銅ペースト組成物 |
JP2007019106A (ja) * | 2005-07-05 | 2007-01-25 | Kyocera Chemical Corp | 電極形成用導電性ペースト及び太陽電池セル |
JP2008034592A (ja) * | 2006-07-28 | 2008-02-14 | Sanyo Electric Co Ltd | 光起電力素子及びその製造方法 |
JP2010013730A (ja) * | 2008-06-05 | 2010-01-21 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト用銅粉及び導電性ペースト |
JP2010059469A (ja) * | 2008-09-03 | 2010-03-18 | Asahi Glass Co Ltd | 銅ナノ粒子の製造方法、金属ペーストおよび金属膜を有する物品 |
WO2011046176A1 (ja) * | 2009-10-15 | 2011-04-21 | 日立化成工業株式会社 | 導電性接着剤、太陽電池及びその製造方法、並びに太陽電池モジュール |
WO2011090215A1 (ja) * | 2010-01-25 | 2011-07-28 | 日立化成工業株式会社 | 電極用ペースト組成物及び太陽電池 |
WO2011090211A1 (ja) * | 2010-01-25 | 2011-07-28 | 日立化成工業株式会社 | 電極用ペースト組成物および太陽電池 |
WO2011090214A1 (ja) * | 2010-01-25 | 2011-07-28 | 日立化成工業株式会社 | 電極用ペースト組成物および太陽電池 |
Non-Patent Citations (1)
Title |
---|
L.N.HO: "Electrical Properties of Pre-Alloyed Cu-P Containing Electrically Conductive Adhesive", THE JOURNAL OF ADHESION, vol. 86, no. 8, 2010, pages 807 - 815 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017136636A (ja) * | 2016-02-05 | 2017-08-10 | 株式会社弘輝 | フラックス及びはんだ組成物 |
TWI668709B (zh) * | 2017-07-25 | 2019-08-11 | 日商千住金屬工業股份有限公司 | 銅銀合金之合成方法、導通部之形成方法、銅銀合金及導通部 |
Also Published As
Publication number | Publication date |
---|---|
TW201310663A (zh) | 2013-03-01 |
US20140158196A1 (en) | 2014-06-12 |
JPWO2013015285A1 (ja) | 2015-02-23 |
CN103890960A (zh) | 2014-06-25 |
JP5725180B2 (ja) | 2015-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5725180B2 (ja) | 素子および太陽電池 | |
JP5768455B2 (ja) | 電極用ペースト組成物及び太陽電池素子 | |
JP5120477B2 (ja) | 電極用ペースト組成物及び太陽電池 | |
WO2012140787A1 (ja) | 電極用ペースト組成物、太陽電池素子及び太陽電池 | |
JP5811186B2 (ja) | 電極用ペースト組成物、太陽電池素子及び太陽電池 | |
JP5708807B2 (ja) | 素子及び太陽電池 | |
JP5633284B2 (ja) | 電極用ペースト組成物および太陽電池 | |
JP2011171272A (ja) | 電極用ペースト組成物及び太陽電池 | |
US20110180139A1 (en) | Paste composition for electrode and photovoltaic cell | |
WO2011090213A1 (ja) | 電極用ペースト組成物及び太陽電池 | |
WO2011090214A1 (ja) | 電極用ペースト組成物および太陽電池 | |
JP5891599B2 (ja) | シリコン系太陽電池の電極用ペースト組成物 | |
JP2011171270A (ja) | 電極用ペースト組成物および太陽電池 | |
US20120260981A1 (en) | Paste composition for electrode, photovoltaic cell element, and photovoltaic cell | |
JP5879790B2 (ja) | 電極用ペースト組成物および太陽電池 | |
JP5720393B2 (ja) | 電極用ペースト組成物、太陽電池素子及び太陽電池 | |
US20130118573A1 (en) | Paste composition for electrode, photovoltaic cell element, and photovoltaic cell | |
US20120260982A1 (en) | Paste composition for electrode, photovoltaic cell element, and photovoltaic cell | |
JP2015195223A (ja) | 電極用ペースト組成物、太陽電池素子及び太陽電池 | |
JP2015144126A (ja) | 電極用ペースト組成物及び太陽電池素子 | |
JP5408322B2 (ja) | 電極用ペースト組成物及び太陽電池 | |
JP6065049B2 (ja) | 電極用ペースト組成物および太陽電池 | |
JP5958526B2 (ja) | 素子及び太陽電池並びに電極用ペースト組成物 | |
JP2015018814A (ja) | 電極用ペースト組成物及び太陽電池 | |
JP2015130355A (ja) | 電極用ペースト組成物及び太陽電池素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12818408 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013525729 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14233383 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12818408 Country of ref document: EP Kind code of ref document: A1 |