HK1154828A1 - 拋光墊及拋光墊的製造方法 - Google Patents

拋光墊及拋光墊的製造方法

Info

Publication number
HK1154828A1
HK1154828A1 HK11108960.6A HK11108960A HK1154828A1 HK 1154828 A1 HK1154828 A1 HK 1154828A1 HK 11108960 A HK11108960 A HK 11108960A HK 1154828 A1 HK1154828 A1 HK 1154828A1
Authority
HK
Hong Kong
Prior art keywords
polishing pad
manufacturing
polishing
pad
Prior art date
Application number
HK11108960.6A
Other languages
English (en)
Inventor
中山公男
高岡信夫
加藤充
菊池博文
Original Assignee
Kuraray Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co filed Critical Kuraray Co
Publication of HK1154828A1 publication Critical patent/HK1154828A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H3/00—Non-woven fabrics formed wholly or mainly of yarns or like filamentary material of substantial length
    • D04H3/016—Non-woven fabrics formed wholly or mainly of yarns or like filamentary material of substantial length characterised by the fineness
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H3/00—Non-woven fabrics formed wholly or mainly of yarns or like filamentary material of substantial length
    • D04H3/08—Non-woven fabrics formed wholly or mainly of yarns or like filamentary material of substantial length characterised by the method of strengthening or consolidating
    • D04H3/10—Non-woven fabrics formed wholly or mainly of yarns or like filamentary material of substantial length characterised by the method of strengthening or consolidating with bonds between yarns or filaments made mechanically

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Textile Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
HK11108960.6A 2008-08-08 2011-08-24 拋光墊及拋光墊的製造方法 HK1154828A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008205981 2008-08-08
PCT/JP2009/063802 WO2010016486A1 (ja) 2008-08-08 2009-08-04 研磨パッド及び研磨パッドの製造方法

Publications (1)

Publication Number Publication Date
HK1154828A1 true HK1154828A1 (zh) 2012-05-04

Family

ID=41663704

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11108960.6A HK1154828A1 (zh) 2008-08-08 2011-08-24 拋光墊及拋光墊的製造方法

Country Status (9)

Country Link
US (2) US20110171890A1 (zh)
EP (1) EP2316614B1 (zh)
JP (1) JP5411862B2 (zh)
KR (1) KR101410116B1 (zh)
CN (1) CN102119069B (zh)
HK (1) HK1154828A1 (zh)
IL (1) IL211092A (zh)
TW (1) TWI460052B (zh)
WO (1) WO2010016486A1 (zh)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8513147B2 (en) 2003-06-19 2013-08-20 Eastman Chemical Company Nonwovens produced from multicomponent fibers
US20040260034A1 (en) 2003-06-19 2004-12-23 Haile William Alston Water-dispersible fibers and fibrous articles
US7892993B2 (en) 2003-06-19 2011-02-22 Eastman Chemical Company Water-dispersible and multicomponent fibers from sulfopolyesters
US8512519B2 (en) 2009-04-24 2013-08-20 Eastman Chemical Company Sulfopolyesters for paper strength and process
CN101624511B (zh) * 2009-08-14 2012-08-29 上海震旦办公设备有限公司 碎纸机刀片锋利研磨组合物、由其制造的研磨片、研磨包和相关制造工艺
US8068011B1 (en) 2010-08-27 2011-11-29 Q Street, LLC System and method for interactive user-directed interfacing between handheld devices and RFID media
US20120302142A1 (en) * 2010-09-16 2012-11-29 San Fang Chemical Industry Co., Ltd. Polishing pad and method of producing the same
US9273417B2 (en) 2010-10-21 2016-03-01 Eastman Chemical Company Wet-Laid process to produce a bound nonwoven article
JP5729720B2 (ja) * 2011-06-08 2015-06-03 株式会社クラレ 研磨布及び該研磨布を用いた研磨方法
JP5945874B2 (ja) * 2011-10-18 2016-07-05 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP2811054B1 (en) * 2012-01-31 2022-06-29 Kuraray Co., Ltd. Composite fiber, method for producing polyurethane elastomer fabric, and polyurethane elastomer fabric
US8840758B2 (en) 2012-01-31 2014-09-23 Eastman Chemical Company Processes to produce short cut microfibers
JP5844189B2 (ja) * 2012-03-26 2016-01-13 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
EP2830829B1 (en) * 2012-03-30 2018-01-10 Saint-Gobain Abrasives, Inc. Abrasive products having fibrillated fibers
JP6033652B2 (ja) 2012-11-23 2016-11-30 光洋機械工業株式会社 両面研削装置における静圧パッドの熱変形防止装置および両面研削装置
US9303357B2 (en) 2013-04-19 2016-04-05 Eastman Chemical Company Paper and nonwoven articles comprising synthetic microfiber binders
CN105452559B (zh) * 2013-09-13 2017-11-21 东丽株式会社 片状物及其制造方法
US9598802B2 (en) 2013-12-17 2017-03-21 Eastman Chemical Company Ultrafiltration process for producing a sulfopolyester concentrate
US9605126B2 (en) 2013-12-17 2017-03-28 Eastman Chemical Company Ultrafiltration process for the recovery of concentrated sulfopolyester dispersion
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP2016087770A (ja) 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
JP6541683B2 (ja) * 2014-11-28 2019-07-10 株式会社クラレ 研磨層用成形体及び研磨パッド
CN105297161B (zh) * 2015-09-22 2018-06-29 四川大学 一种以水可溶聚氨酯弹性体为海的海岛纤维在温和条件下的减量方法
US10562149B2 (en) * 2015-09-25 2020-02-18 Cabot Microelectronics Corporation Polyurethane CMP pads having a high modulus ratio
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
TWI656199B (zh) 2016-06-29 2019-04-11 臺灣永光化學工業股份有限公司 聚氨酯型高分子紫外線吸收劑
WO2018034709A1 (en) * 2016-08-17 2018-02-22 Invista North America S.A R.L. Aqueous polyurethane dispersions, prepolymers, and shaped articles made therefrom
CN106223058A (zh) * 2016-08-29 2016-12-14 福建华阳超纤有限公司 一种耐光老化及耐磨的水性绒面超纤革的制作方法
WO2018092630A1 (ja) * 2016-11-16 2018-05-24 帝人フロンティア株式会社 研磨パッドおよびその製造方法
JP2018108612A (ja) * 2016-12-28 2018-07-12 花王株式会社 研磨パッド
KR102567102B1 (ko) * 2017-05-12 2023-08-14 주식회사 쿠라레 연마층용 폴리우레탄, 폴리우레탄을 포함하는 연마층과 그 연마층의 개질 방법, 연마 패드 및 연마 방법
JP6951895B2 (ja) * 2017-07-25 2021-10-20 ニッタ・デュポン株式会社 研磨布
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN107604533B (zh) * 2017-09-19 2019-10-18 四川大学 一种弹力超细纤维合成革及其环境友好的制备方法
JP7081351B2 (ja) * 2018-07-10 2022-06-07 日本電気硝子株式会社 ガラス板の製造方法およびガラス板の洗浄装置
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
KR20240033064A (ko) * 2018-10-25 2024-03-12 미츠이 케미칼즈 아사히 라이프 마테리알즈 가부시키가이샤 부직포 적층체, 및 신축성 부직포 적층체, 섬유 제품, 흡수성 물품 및 위생 마스크
SG11202103983YA (en) * 2018-11-09 2021-05-28 Kuraray Co Polyurethane for use in polishing layer, polishing layer, polishing pad, and method for modifying polishing layer
KR102638363B1 (ko) * 2018-12-03 2024-02-19 주식회사 쿠라레 연마층용 폴리우레탄, 연마층 및 연마 패드
CN109648451B (zh) * 2018-12-29 2020-12-01 徐州鑫晶半导体科技有限公司 硅晶圆的最终抛光方法和最终抛光装置
KR102174958B1 (ko) * 2019-03-27 2020-11-05 에스케이씨 주식회사 결함 발생을 최소화시키는 연마패드 및 이의 제조방법
JP2020200543A (ja) * 2019-06-07 2020-12-17 セイコーエプソン株式会社 繊維体成形方法および繊維結着処理液
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN111098218A (zh) * 2019-12-31 2020-05-05 杭州中欣晶圆半导体股份有限公司 用于硅片的中、精抛布的活化方法
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113510613B (zh) * 2021-03-12 2022-05-13 安徽禾臣新材料有限公司 一种显示屏抛光用白垫及其生产方法
CN115229606A (zh) * 2021-04-25 2022-10-25 苏州三鼎纺织科技有限公司 含有助剂的组合物及使用其制备的光学玻璃抛光用磨皮

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3773546A (en) * 1971-11-26 1973-11-20 Owens Corning Fiberglass Corp Coated glass fibers and glass fiber reinforced elastomers
JPH03234475A (ja) 1990-02-08 1991-10-18 Kanebo Ltd 研磨布
US6129620A (en) * 1993-04-23 2000-10-10 Jason Incorporated Honing tool and method of making
JPH08294872A (ja) * 1995-04-27 1996-11-12 Fuji Photo Film Co Ltd 研磨体
JPH10128674A (ja) 1996-10-28 1998-05-19 Rooder Nitta Kk 研磨用パッド
JPH10225864A (ja) 1997-02-17 1998-08-25 Sony Corp 研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法
JP3631879B2 (ja) * 1997-04-25 2005-03-23 Ｔｄｋ株式会社 研磨テープ
JPH1199479A (ja) 1997-09-30 1999-04-13 Teijin Ltd 研磨パッド
JPH11322878A (ja) 1998-05-13 1999-11-26 Dainippon Ink & Chem Inc 泡含有ポリウレタン成形物の製造方法、泡含有成形物用ウレタン樹脂組成物及びそれを用いた研磨パッド
JP3516874B2 (ja) 1998-12-15 2004-04-05 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP2000248034A (ja) 1999-03-02 2000-09-12 Mitsubishi Chemicals Corp 研磨材用ポリウレタン系樹脂組成物及びその発泡体
JP3558273B2 (ja) 1999-09-22 2004-08-25 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP2002009026A (ja) 2000-06-21 2002-01-11 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置及び研磨方法
TW491757B (en) * 2000-06-19 2002-06-21 Kuraray Co Abrasive sheet for texturing and method of producing same
JP2002079472A (ja) * 2000-06-19 2002-03-19 Kuraray Co Ltd テクスチャー加工用研磨シート及びその製造方法
JP3901939B2 (ja) 2000-12-05 2007-04-04 帝人コードレ株式会社 研磨用基布および研磨方法
KR100467113B1 (ko) * 2001-01-31 2005-01-24 가부시키가이샤 구라레 수성 수지 조성물 및 이 조성물을 사용한 면상 파스너의제조방법
US20030100250A1 (en) 2001-10-29 2003-05-29 West Thomas E. Pads for CMP and polishing substrates
JP3992483B2 (ja) 2001-12-06 2007-10-17 帝人コードレ株式会社 研磨基布の製造方法
JP3921085B2 (ja) 2001-12-28 2007-05-30 大日精化工業株式会社 研磨用基材の製造方法
JP2004130395A (ja) * 2002-10-08 2004-04-30 Toray Ind Inc ガラステクスチャー加工用研磨布及びそれを用いた磁気記録媒体の製造方法
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
JP2004311731A (ja) 2003-04-08 2004-11-04 Hitachi Chem Co Ltd 研磨用パッド及びそれを用いた被研磨物の研磨方法
SG2012073722A (en) * 2003-06-03 2016-11-29 Nexplanar Corp Synthesis of a functionally graded pad for chemical mechanical planarization
US7871946B2 (en) * 2003-10-09 2011-01-18 Kuraray Co., Ltd. Nonwoven fabric composed of ultra-fine continuous fibers, and production process and application thereof
US20050159063A1 (en) * 2004-01-16 2005-07-21 Bernard Hill Disposable cleaning substrate
JP2005212055A (ja) 2004-01-30 2005-08-11 Kanebo Ltd 不織布ベースの研磨布及びその製造方法
JP4455161B2 (ja) 2004-05-25 2010-04-21 旭化成せんい株式会社 研磨パッド用不織布および研磨パッド
JP2006028659A (ja) * 2004-07-13 2006-02-02 Kuraray Co Ltd スエード調人工皮革およびその製造方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
TW200641193A (en) * 2005-05-27 2006-12-01 San Fang Chemical Industry Co A polishing panel of micro fibers and its manufacturing method
JP4645361B2 (ja) 2005-08-24 2011-03-09 東レ株式会社 研磨布
US8647179B2 (en) * 2007-02-01 2014-02-11 Kuraray Co., Ltd. Polishing pad, and method for manufacturing polishing pad

Also Published As

Publication number Publication date
WO2010016486A1 (ja) 2010-02-11
JP5411862B2 (ja) 2014-02-12
US20110171890A1 (en) 2011-07-14
TW201016393A (en) 2010-05-01
IL211092A0 (en) 2011-04-28
US20190218697A1 (en) 2019-07-18
KR101410116B1 (ko) 2014-06-25
JPWO2010016486A1 (ja) 2012-01-26
EP2316614A1 (en) 2011-05-04
CN102119069A (zh) 2011-07-06
EP2316614B1 (en) 2019-07-17
IL211092A (en) 2014-03-31
EP2316614A4 (en) 2014-08-20
CN102119069B (zh) 2015-04-15
KR20110042213A (ko) 2011-04-25
TWI460052B (zh) 2014-11-11

Similar Documents

Publication Publication Date Title
HK1154828A1 (zh) 拋光墊及拋光墊的製造方法
EP2447004A4 (en) POLISHING PAD, METHOD OF MANUFACTURING SAME, AND POLISHING METHOD
IL200099A0 (en) A polishing pad and method of producing the same
SG10201605686XA (en) Polishing Composition And Polishing Method Using The Same
SI2174717T1 (sl) Postopek drobljenja
TWI349596B (en) Cushion for polishing pad and polishing pad using the same
TWI365528B (en) Semiconductor structure and method for manufacturing the same
EP2361022A4 (en) ELASTIC PAD COMPOSITE AND METHOD FOR THE PRODUCTION THEREOF
EP2351088A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2280417A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2193010A4 (en) POLISHING CUSHION
EP1975985A4 (en) CHEMICAL-MECHANICAL POLISHING ELEMENT AND METHOD OF MANUFACTURING THEREOF
EP2280449A4 (en) WIRELESS IC ELEMENT AND MANUFACTURING METHOD THEREFOR
EP2083027B8 (en) Mechanical polishing pad and chemical mechanical polishing method
EP2324956A4 (en) POLISHING COMPOSITION AND THIS USE POLISHING METHOD
HK1152573A1 (en) Thermocompensated spring and method for manufacturing the same
IL201028A0 (en) Metal film polishing pad and method for polishing metal film using the same
EP2312170A4 (en) MECHANICAL COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2349644A4 (en) POLISHERS, PRINTING PLATE OF A POLISHER AND POLISHING METHOD
EP2105250A4 (en) TIPLESS GRINDING PROCESS
HK1154990A1 (en) Semiconductor device and method for manufacturing the same
TWI367821B (en) Mold and method for manufacturing the same
EP2141737A4 (en) POLISHING APPARATUS AND PROGRAM FOR THE SAME
EP2231365A4 (en) GRINDING BODY AND MANUFACTURING METHOD THEREFOR
TWI370758B (en) Method for making polishing pad