HK1054616A1 - Vertical electrical interconnections in a stack - Google Patents

Vertical electrical interconnections in a stack

Info

Publication number
HK1054616A1
HK1054616A1 HK03106866A HK03106866A HK1054616A1 HK 1054616 A1 HK1054616 A1 HK 1054616A1 HK 03106866 A HK03106866 A HK 03106866A HK 03106866 A HK03106866 A HK 03106866A HK 1054616 A1 HK1054616 A1 HK 1054616A1
Authority
HK
Hong Kong
Prior art keywords
layers
edge
stack
electrical
substrate
Prior art date
Application number
HK03106866A
Other languages
English (en)
Inventor
Per-Erik Nordal
Hans Gude Gudesen
Geirr I Leistad
Goran Gustafsson
Original Assignee
Thin Film Electronics Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thin Film Electronics Asa filed Critical Thin Film Electronics Asa
Publication of HK1054616A1 publication Critical patent/HK1054616A1/xx

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    • H—ELECTRICITY
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
HK03106866A 2000-03-15 2003-09-24 Vertical electrical interconnections in a stack HK1054616A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20001360A NO20001360D0 (no) 2000-03-15 2000-03-15 Vertikale elektriske forbindelser i stabel
PCT/NO2001/000113 WO2001069679A1 (en) 2000-03-15 2001-03-15 Vertical electrical interconnections in a stack

Publications (1)

Publication Number Publication Date
HK1054616A1 true HK1054616A1 (en) 2003-12-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
HK03106866A HK1054616A1 (en) 2000-03-15 2003-09-24 Vertical electrical interconnections in a stack

Country Status (11)

Country Link
US (2) US20030024731A1 (xx)
EP (1) EP1287560A1 (xx)
JP (3) JP2003526945A (xx)
KR (1) KR100488256B1 (xx)
CN (1) CN1214462C (xx)
AU (1) AU775011B2 (xx)
CA (1) CA2403231C (xx)
HK (1) HK1054616A1 (xx)
NO (2) NO20001360D0 (xx)
RU (1) RU2237948C2 (xx)
WO (1) WO2001069679A1 (xx)

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US6756620B2 (en) * 2001-06-29 2004-06-29 Intel Corporation Low-voltage and interface damage-free polymer memory device
US6624457B2 (en) 2001-07-20 2003-09-23 Intel Corporation Stepped structure for a multi-rank, stacked polymer memory device and method of making same
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