HK1041402B - 線路板用基板 - Google Patents

線路板用基板

Info

Publication number
HK1041402B
HK1041402B HK02102846.0A HK02102846A HK1041402B HK 1041402 B HK1041402 B HK 1041402B HK 02102846 A HK02102846 A HK 02102846A HK 1041402 B HK1041402 B HK 1041402B
Authority
HK
Hong Kong
Prior art keywords
printed wiring
wiring board
lead frame
metal
board
Prior art date
Application number
HK02102846.0A
Other languages
English (en)
Other versions
HK1041402A1 (en
Inventor
中西幹育
Original Assignee
鈴木綜業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鈴木綜業株式會社 filed Critical 鈴木綜業株式會社
Publication of HK1041402A1 publication Critical patent/HK1041402A1/xx
Publication of HK1041402B publication Critical patent/HK1041402B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Structure Of Printed Boards (AREA)
HK02102846.0A 1999-09-06 2002-04-16 線路板用基板 HK1041402B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP25217199 1999-09-06
JP30419999 1999-10-26
JP2000214963 2000-07-14
PCT/JP2000/005991 WO2001019145A1 (en) 1999-09-06 2000-09-04 Substrate of circuit board

Publications (2)

Publication Number Publication Date
HK1041402A1 HK1041402A1 (en) 2002-07-05
HK1041402B true HK1041402B (zh) 2005-10-28

Family

ID=27334093

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102846.0A HK1041402B (zh) 1999-09-06 2002-04-16 線路板用基板

Country Status (9)

Country Link
US (1) US6479136B1 (zh)
EP (1) EP1139703B1 (zh)
KR (1) KR100740276B1 (zh)
CN (1) CN1195394C (zh)
AT (1) ATE369725T1 (zh)
DE (1) DE60035855D1 (zh)
HK (1) HK1041402B (zh)
TW (1) TW493259B (zh)
WO (1) WO2001019145A1 (zh)

Families Citing this family (34)

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US6787706B2 (en) * 2001-02-21 2004-09-07 Kyocera Corporation Ceramic circuit board
GB0200010D0 (en) * 2002-01-02 2002-02-13 Saveguard Uk Ltd Insulating material and method of insulating a body
JP4199198B2 (ja) * 2003-01-16 2008-12-17 富士通株式会社 多層配線基板およびその製造方法
TW200603694A (en) * 2004-05-15 2006-01-16 Kalu K Vasoya Printed wiring board with conductive constraining core including resin filled slots
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
KR20070112274A (ko) * 2005-03-15 2007-11-22 씨-코어 테크놀로지즈, 인코포레이티드 인쇄배선기판 내에 억제 코어 재료를 구성하는 방법
US20090025966A1 (en) * 2005-04-19 2009-01-29 Kanji Shimoosako Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board
JP2007045150A (ja) * 2005-07-15 2007-02-22 Kaneka Corp 繊維−樹脂複合体とその製造方法、及びプリント配線板
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
US7730613B2 (en) * 2005-08-29 2010-06-08 Stablcor, Inc. Processes for manufacturing printed wiring boards
US20070228986A1 (en) * 2006-03-31 2007-10-04 General Electric Company Light source incorporating a high temperature ceramic composite for selective emission
US7851985B2 (en) * 2006-03-31 2010-12-14 General Electric Company Article incorporating a high temperature ceramic composite for selective emission
US7722421B2 (en) * 2006-03-31 2010-05-25 General Electric Company High temperature ceramic composite for selective emission
US8044567B2 (en) * 2006-03-31 2011-10-25 General Electric Company Light source incorporating a high temperature ceramic composite and gas phase for selective emission
KR100919971B1 (ko) * 2007-11-13 2009-10-14 삼성정밀화학 주식회사 액정고분자 프리프레그 및 액정고분자 보정층을 구비한금속박 적층판과 프린트 배선판
DE102008043565A1 (de) * 2008-11-07 2010-05-12 Robert Bosch Gmbh Schaltungsträger und dessen Verwendung
KR101156151B1 (ko) * 2009-04-09 2012-06-18 스미또모 가가꾸 가부시키가이샤 금속 베이스 회로 기판 및 그 제조 방법
CN102460685B (zh) * 2009-06-22 2014-08-06 三菱电机株式会社 半导体封装件以及该半导体封装件的安装构造
CN102209437B (zh) * 2010-10-19 2012-11-14 博罗县精汇电子科技有限公司 具有聚酰亚胺和铝基板复合结构的电路板及其制作方法
JP5211185B2 (ja) 2011-02-10 2013-06-12 株式会社フジクラ プリント配線板
TW201240805A (en) * 2011-04-12 2012-10-16 ji-zong Zhuang Manufacturing method and product of substrate having heat conductive graphite
EP2753668B1 (en) 2011-09-06 2019-03-27 Henkel IP & Holding GmbH Conductive material and process
CN103781273A (zh) * 2012-10-19 2014-05-07 深南电路有限公司 嵌入式金属基pcb板及其加工方法
JP6057330B2 (ja) * 2013-01-17 2017-01-11 日本発條株式会社 複合材及び複合材の製造方法
KR102149800B1 (ko) * 2013-08-08 2020-08-31 삼성전기주식회사 인쇄회로기판용 적층재, 이를 이용한 인쇄회로기판 및 그 제조 방법
JP6576345B2 (ja) 2013-08-16 2019-09-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング サブミクロン銀粒子インク組成物、プロセスおよび応用
KR20150057838A (ko) * 2013-11-20 2015-05-28 삼성전기주식회사 전자 부품 모듈
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
KR102412612B1 (ko) * 2015-08-28 2022-06-23 삼성전자주식회사 패키지 기판 및 프리프레그
CN106273883B (zh) * 2016-08-12 2018-10-02 碳元科技股份有限公司 一种石墨层压结构及其制备方法
US9736923B1 (en) * 2017-01-17 2017-08-15 Northrop Grumman Systems Corporation Alloy bonded graphene sheets for enhanced thermal spreaders
CN107756985B (zh) * 2017-12-04 2019-06-18 钟文武 一种用于印刷电阻的层叠体及其制备方法
KR102424746B1 (ko) * 2020-06-30 2022-07-25 한국광기술원 Fpcb를 이용한 차량용 광원장치
CN116095946A (zh) * 2023-02-28 2023-05-09 合肥本源量子计算科技有限责任公司 一种软印刷电路板、稀释制冷机系统及量子计算机

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492730A (en) * 1982-03-26 1985-01-08 Showa Denko Kabushiki Kaisha Substrate of printed circuit
US4999419A (en) * 1986-07-03 1991-03-12 Creative Assets And Consulting Corporation Polyimide resins from bis-imide, monomer having two methylene groups activated by adjacent carbonyls, and polyamine
JPS63107092A (ja) * 1986-10-23 1988-05-12 三菱電機株式会社 金属ベ−スプリント基板の製造方法
JPS63287042A (ja) * 1987-05-19 1988-11-24 Asahi Chem Ind Co Ltd 回路用基板
JPH0772092B2 (ja) * 1988-02-10 1995-08-02 日本特殊陶業株式会社 低温焼成基板
JPH0668159B2 (ja) * 1988-04-08 1994-08-31 ハニー化成株式会社 金属ｉｃ基板の電着塗装方法
US5068061A (en) * 1989-12-08 1991-11-26 The Dow Chemical Company Electroconductive polymers containing carbonaceous fibers
JPH0548243A (ja) * 1991-08-08 1993-02-26 Furukawa Electric Co Ltd:The 配線基板の製造方法
JPH0575225A (ja) * 1991-09-18 1993-03-26 Hitachi Chem Co Ltd 金属ベース印刷配線基板及びその製造方法
FR2694139B1 (fr) * 1992-07-21 1994-10-14 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
JPH06128462A (ja) 1992-10-15 1994-05-10 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、接着剤シート、接着剤付きポリイミドフィルム及び金属はく張りポリイミドフィルム
JPH06350212A (ja) * 1993-06-11 1994-12-22 Denki Kagaku Kogyo Kk 金属ベース回路基板とその製造方法
JPH06350213A (ja) * 1993-06-14 1994-12-22 Denki Kagaku Kogyo Kk 金属ベース基板
JPH0946011A (ja) * 1995-08-03 1997-02-14 Hitachi Chem Co Ltd 電気回路用基板及びその製造法
JPH0977937A (ja) * 1995-09-12 1997-03-25 Idemitsu Petrochem Co Ltd プリント配線板用プリプレグ及びプリント配線用基板
JPH09153665A (ja) * 1995-11-30 1997-06-10 Matsushita Electric Works Ltd 放熱型プリント回路基板、及びその製法
JPH10107391A (ja) * 1996-09-30 1998-04-24 O K Print:Kk 配線基板および配線基板用基材
US6020747A (en) * 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe

Also Published As

Publication number Publication date
CN1321407A (zh) 2001-11-07
TW493259B (en) 2002-07-01
DE60035855D1 (de) 2007-09-20
US6479136B1 (en) 2002-11-12
KR20010075684A (ko) 2001-08-09
EP1139703A1 (en) 2001-10-04
HK1041402A1 (en) 2002-07-05
EP1139703B1 (en) 2007-08-08
KR100740276B1 (ko) 2007-07-18
WO2001019145A1 (en) 2001-03-15
CN1195394C (zh) 2005-03-30
EP1139703A4 (en) 2005-09-14
ATE369725T1 (de) 2007-08-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090904