GB2533933A - Improvements in or relating to vacuum pumping arrangements - Google Patents
Improvements in or relating to vacuum pumping arrangements Download PDFInfo
- Publication number
- GB2533933A GB2533933A GB1500133.2A GB201500133A GB2533933A GB 2533933 A GB2533933 A GB 2533933A GB 201500133 A GB201500133 A GB 201500133A GB 2533933 A GB2533933 A GB 2533933A
- Authority
- GB
- United Kingdom
- Prior art keywords
- vacuum
- pumping
- common
- pump
- pumping line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005086 pumping Methods 0.000 title claims abstract description 237
- 238000000034 method Methods 0.000 claims abstract description 131
- 230000008569 process Effects 0.000 claims abstract description 130
- 238000004519 manufacturing process Methods 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 239000012530 fluid Substances 0.000 claims description 51
- 238000004891 communication Methods 0.000 claims description 47
- 238000004140 cleaning Methods 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 14
- 238000005137 deposition process Methods 0.000 claims description 9
- 238000011144 upstream manufacturing Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 description 58
- 239000006227 byproduct Substances 0.000 description 13
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 239000007800 oxidant agent Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 101100328843 Dictyostelium discoideum cofB gene Proteins 0.000 description 1
- 229910004014 SiF4 Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- IYRWEQXVUNLMAY-UHFFFAOYSA-N carbonyl fluoride Chemical compound FC(F)=O IYRWEQXVUNLMAY-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
- F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
- F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
- F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
- F04C23/003—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle having complementary function
-
- H01L21/205—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2220/00—Application
- F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K15/00—Check valves
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Drying Of Semiconductors (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
- Jet Pumps And Other Pumps (AREA)
Priority Applications (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1500133.2A GB2533933A (en) | 2015-01-06 | 2015-01-06 | Improvements in or relating to vacuum pumping arrangements |
| SG11201705287WA SG11201705287WA (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangements |
| JP2017553465A JP6924147B2 (ja) | 2015-01-06 | 2016-01-06 | 真空排気システム及びこの真空排気システムに使用されるチャネル切換弁 |
| PCT/GB2016/050018 WO2016110694A1 (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangements |
| EP16700506.5A EP3247907B1 (en) | 2015-01-06 | 2016-01-06 | Vacuum exhaust system and channel-switching valve used in this vacuum exhaust system |
| US15/541,083 US20170350395A1 (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangement |
| CN201680005146.2A CN107110162B (zh) | 2015-01-06 | 2016-01-06 | 真空排出系统以及在该真空排出系统中使用的通道切换阀 |
| PCT/GB2016/050019 WO2016110695A1 (en) | 2015-01-06 | 2016-01-06 | Vacuum exhaust system and channel-switching valve used in this vacuum exhaust system |
| GB1600201.6A GB2536336B (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangements |
| US15/541,085 US10309401B2 (en) | 2015-01-06 | 2016-01-06 | Vacuum exhaust system and channel-switching valve used in this vacuum exhaust system |
| JP2017553464A JP2018503027A (ja) | 2015-01-06 | 2016-01-06 | 真空ポンプ装置における又はそれに関連する改善 |
| CN201680005140.5A CN107110161B (zh) | 2015-01-06 | 2016-01-06 | 真空泵送布置中或与其相关的改善 |
| KR1020177018524A KR102504078B1 (ko) | 2015-01-06 | 2016-01-06 | 진공 배기 시스템 및 이 진공 배기 시스템에 사용되는 채널 전환 밸브 |
| EP16700505.7A EP3243005B1 (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangements |
| KR1020177018523A KR20170102256A (ko) | 2015-01-06 | 2016-01-06 | 진공 펌핑 장치에 있어서의 또는 그와 관련된 개선 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1500133.2A GB2533933A (en) | 2015-01-06 | 2015-01-06 | Improvements in or relating to vacuum pumping arrangements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2533933A true GB2533933A (en) | 2016-07-13 |
Family
ID=55129989
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1500133.2A Withdrawn GB2533933A (en) | 2015-01-06 | 2015-01-06 | Improvements in or relating to vacuum pumping arrangements |
| GB1600201.6A Expired - Fee Related GB2536336B (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangements |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1600201.6A Expired - Fee Related GB2536336B (en) | 2015-01-06 | 2016-01-06 | Improvements in or relating to vacuum pumping arrangements |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10309401B2 (enExample) |
| EP (2) | EP3243005B1 (enExample) |
| JP (2) | JP2018503027A (enExample) |
| KR (2) | KR102504078B1 (enExample) |
| CN (2) | CN107110161B (enExample) |
| GB (2) | GB2533933A (enExample) |
| SG (1) | SG11201705287WA (enExample) |
| WO (2) | WO2016110694A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018100342A1 (en) * | 2016-11-29 | 2018-06-07 | Edwards Limited | Vacuum pumping arrangement |
| DE102017214687A1 (de) * | 2017-08-22 | 2019-02-28 | centrotherm international AG | Behandlungsvorrichtung für Substrate und Verfahren zum Betrieb einer solchen Behandlungsvorrichtung |
| GB2606193A (en) * | 2021-04-29 | 2022-11-02 | Edwards Ltd | A valve module for a vacuum pumping system |
| US12129841B2 (en) | 2019-02-20 | 2024-10-29 | Edwards Limited | Vacuum pumping |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5808454B1 (ja) * | 2014-04-25 | 2015-11-10 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体 |
| WO2015182699A1 (ja) * | 2014-05-30 | 2015-12-03 | 株式会社 荏原製作所 | 真空排気システム |
| GB2561899B (en) | 2017-04-28 | 2020-11-04 | Edwards Ltd | Vacuum pumping system |
| GB2564399A (en) * | 2017-07-06 | 2019-01-16 | Edwards Ltd | Improvements in or relating to pumping line arrangements |
| CN107799445A (zh) * | 2017-11-01 | 2018-03-13 | 德淮半导体有限公司 | 用于半导体工艺腔的泵系统 |
| GB201718752D0 (en) | 2017-11-13 | 2017-12-27 | Edwards Ltd | Vacuum and abatement systems |
| CN108486543A (zh) * | 2018-03-02 | 2018-09-04 | 惠科股份有限公司 | 基板成膜机台及使用方法 |
| JP7472114B2 (ja) | 2018-09-28 | 2024-04-22 | ラム リサーチ コーポレーション | 堆積副生成物の蓄積からの真空ポンプの保護 |
| CN109185705B (zh) * | 2018-10-15 | 2024-04-16 | 苏州精濑光电有限公司 | 设备的吸真空气路系统 |
| GB2579360A (en) * | 2018-11-28 | 2020-06-24 | Edwards Ltd | Multiple chamber vacuum exhaust system |
| GB2584881B (en) * | 2019-06-19 | 2022-01-05 | Edwards Vacuum Llc | Multiple vacuum chamber exhaust system and method of evacuating multiple chambers |
| CN110435190A (zh) * | 2019-06-26 | 2019-11-12 | 中复连众风电科技有限公司 | 具有抽真空单元的模具真空加热设备 |
| KR102329548B1 (ko) * | 2019-10-17 | 2021-11-24 | 무진전자 주식회사 | 챔버 배기량 자동 조절 시스템 |
| GB2592346B (en) * | 2020-01-09 | 2022-11-02 | Edwards Ltd | Vacuum pump and vacuum pump set for evacuating a semiconductor processing chamber |
| GB2592043A (en) * | 2020-02-13 | 2021-08-18 | Edwards Ltd | Axial flow vacuum pump |
| FR3112177B1 (fr) * | 2020-07-09 | 2022-07-08 | Pfeiffer Vacuum | Ligne de vide et procédé de contrôle d’une ligne de vide |
| FR3112086B1 (fr) * | 2020-07-09 | 2022-07-08 | Pfeiffer Vacuum | Dispositif de traitement des gaz et ligne de vide |
| GB2603892A (en) * | 2021-02-03 | 2022-08-24 | Edwards Ltd | Pump apparatus and system |
| JP7374158B2 (ja) * | 2021-10-15 | 2023-11-06 | 株式会社荏原製作所 | 生成物除去装置、処理システム及び生成物除去方法 |
| US12391011B2 (en) * | 2022-11-10 | 2025-08-19 | The Boeing Company | Double vacuum debulk processing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5733104A (en) * | 1992-12-24 | 1998-03-31 | Balzers-Pfeiffer Gmbh | Vacuum pump system |
| WO2008017880A1 (en) * | 2006-08-08 | 2008-02-14 | Edwards Limited | Apparatus for conveying a waste stream |
| JP2010167338A (ja) * | 2009-01-20 | 2010-08-05 | Renesas Electronics Corp | 真空処理装置及び真空処理方法 |
| CN101922437A (zh) * | 2010-08-05 | 2010-12-22 | 友达光电股份有限公司 | 真空设备 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4021898A (en) * | 1976-05-20 | 1977-05-10 | Timex Corporation | Method of adjusting the frequency of vibration of piezoelectric resonators |
| JPS564069A (en) | 1979-06-22 | 1981-01-16 | Mitsubishi Electric Corp | Test of semiconductor device |
| US5010035A (en) * | 1985-05-23 | 1991-04-23 | The Regents Of The University Of California | Wafer base for silicon carbide semiconductor device |
| JPH07107388B2 (ja) | 1987-12-16 | 1995-11-15 | 株式会社日立製作所 | 複数真空容器の排気方法 |
| JPH02185681A (ja) * | 1989-01-11 | 1990-07-20 | Mitsubishi Electric Corp | 真空排気装置 |
| JPH03258976A (ja) * | 1990-03-08 | 1991-11-19 | Mitsubishi Electric Corp | 真空装置における真空の再生方法 |
| GB9614849D0 (en) * | 1996-07-15 | 1996-09-04 | Boc Group Plc | Processes for the scubbing of noxious substances |
| US6277347B1 (en) * | 1997-02-24 | 2001-08-21 | Applied Materials, Inc. | Use of ozone in process effluent abatement |
| JP4112659B2 (ja) * | 1997-12-01 | 2008-07-02 | 大陽日酸株式会社 | 希ガスの回収方法及び装置 |
| US6383300B1 (en) * | 1998-11-27 | 2002-05-07 | Tokyo Electron Ltd. | Heat treatment apparatus and cleaning method of the same |
| JP3564069B2 (ja) | 1999-03-05 | 2004-09-08 | 忠弘 大見 | 真空装置 |
| JP2004218648A (ja) * | 1999-03-05 | 2004-08-05 | Tadahiro Omi | 真空装置 |
| JP2003083248A (ja) * | 2001-09-06 | 2003-03-19 | Ebara Corp | 真空排気システム |
| JP4180265B2 (ja) * | 2001-10-31 | 2008-11-12 | 株式会社アルバック | 真空排気装置の運転方法 |
| DE10159835B4 (de) * | 2001-12-06 | 2012-02-23 | Pfeiffer Vacuum Gmbh | Vakuumpumpsystem |
| WO2004036047A1 (en) * | 2002-10-14 | 2004-04-29 | The Boc Group Plc | Rotary piston vacuum pump with washing installation |
| US6761135B1 (en) * | 2003-08-27 | 2004-07-13 | Bryon Edward Becktold | Multipurpose assembly |
| US7278831B2 (en) * | 2003-12-31 | 2007-10-09 | The Boc Group, Inc. | Apparatus and method for control, pumping and abatement for vacuum process chambers |
| GB0505500D0 (en) * | 2005-03-17 | 2005-04-27 | Boc Group Plc | Vacuum pumping arrangement |
| US20070189356A1 (en) * | 2006-02-13 | 2007-08-16 | Jonathan Pettit | Exhaust buildup monitoring in semiconductor processing |
| GB2437968A (en) * | 2006-05-12 | 2007-11-14 | Boc Group Plc | Vacuum pumping arrangement for evacuating a plurality of process chambers |
| US20090242046A1 (en) * | 2008-03-31 | 2009-10-01 | Benjamin Riordon | Valve module |
| JP2010161150A (ja) * | 2009-01-07 | 2010-07-22 | Shimadzu Corp | ガス排気ライン切り換え機構およびガス排気ライン切り換え方法 |
| CN102713287B (zh) * | 2009-12-28 | 2015-04-15 | 株式会社爱发科 | 真空排气装置、真空排气方法及基板处理装置 |
| KR101427726B1 (ko) * | 2011-12-27 | 2014-08-07 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반도체 장치의 제조 방법 |
| KR101427719B1 (ko) * | 2012-07-16 | 2014-09-30 | (주)트리플코어스코리아 | 반도체 공정 펌프 및 배기라인의 부산물 제어 방법 |
| JP5808454B1 (ja) * | 2014-04-25 | 2015-11-10 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体 |
| WO2015182699A1 (ja) * | 2014-05-30 | 2015-12-03 | 株式会社 荏原製作所 | 真空排気システム |
| JP6522892B2 (ja) * | 2014-05-30 | 2019-05-29 | 株式会社荏原製作所 | 真空排気システム |
-
2015
- 2015-01-06 GB GB1500133.2A patent/GB2533933A/en not_active Withdrawn
-
2016
- 2016-01-06 US US15/541,085 patent/US10309401B2/en active Active
- 2016-01-06 WO PCT/GB2016/050018 patent/WO2016110694A1/en not_active Ceased
- 2016-01-06 KR KR1020177018524A patent/KR102504078B1/ko active Active
- 2016-01-06 EP EP16700505.7A patent/EP3243005B1/en active Active
- 2016-01-06 US US15/541,083 patent/US20170350395A1/en not_active Abandoned
- 2016-01-06 CN CN201680005140.5A patent/CN107110161B/zh active Active
- 2016-01-06 WO PCT/GB2016/050019 patent/WO2016110695A1/en not_active Ceased
- 2016-01-06 CN CN201680005146.2A patent/CN107110162B/zh active Active
- 2016-01-06 JP JP2017553464A patent/JP2018503027A/ja active Pending
- 2016-01-06 SG SG11201705287WA patent/SG11201705287WA/en unknown
- 2016-01-06 GB GB1600201.6A patent/GB2536336B/en not_active Expired - Fee Related
- 2016-01-06 JP JP2017553465A patent/JP6924147B2/ja active Active
- 2016-01-06 EP EP16700506.5A patent/EP3247907B1/en active Active
- 2016-01-06 KR KR1020177018523A patent/KR20170102256A/ko not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5733104A (en) * | 1992-12-24 | 1998-03-31 | Balzers-Pfeiffer Gmbh | Vacuum pump system |
| WO2008017880A1 (en) * | 2006-08-08 | 2008-02-14 | Edwards Limited | Apparatus for conveying a waste stream |
| JP2010167338A (ja) * | 2009-01-20 | 2010-08-05 | Renesas Electronics Corp | 真空処理装置及び真空処理方法 |
| CN101922437A (zh) * | 2010-08-05 | 2010-12-22 | 友达光电股份有限公司 | 真空设备 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018100342A1 (en) * | 2016-11-29 | 2018-06-07 | Edwards Limited | Vacuum pumping arrangement |
| CN110199122A (zh) * | 2016-11-29 | 2019-09-03 | 爱德华兹有限公司 | 真空泵送布置 |
| TWI745498B (zh) * | 2016-11-29 | 2021-11-11 | 英商愛德華有限公司 | 真空泵之配置及製造總成 |
| US11187222B2 (en) | 2016-11-29 | 2021-11-30 | Edwards Limited | Vacuum pumping arrangement |
| DE102017214687A1 (de) * | 2017-08-22 | 2019-02-28 | centrotherm international AG | Behandlungsvorrichtung für Substrate und Verfahren zum Betrieb einer solchen Behandlungsvorrichtung |
| WO2019038327A1 (de) * | 2017-08-22 | 2019-02-28 | centrotherm international AG | Behandlungsvorrichtung für substrate und verfahren zum betrieb einer solchen behandlungsvorrichtung |
| US12129841B2 (en) | 2019-02-20 | 2024-10-29 | Edwards Limited | Vacuum pumping |
| GB2606193A (en) * | 2021-04-29 | 2022-11-02 | Edwards Ltd | A valve module for a vacuum pumping system |
| GB2606193B (en) * | 2021-04-29 | 2023-09-06 | Edwards Ltd | A valve module for a vacuum pumping system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6924147B2 (ja) | 2021-08-25 |
| US20170350395A1 (en) | 2017-12-07 |
| GB201600201D0 (en) | 2016-02-17 |
| EP3247907A1 (en) | 2017-11-29 |
| CN107110161B (zh) | 2019-09-13 |
| GB2536336A (en) | 2016-09-14 |
| WO2016110695A1 (en) | 2016-07-14 |
| WO2016110694A1 (en) | 2016-07-14 |
| KR102504078B1 (ko) | 2023-02-24 |
| CN107110162B (zh) | 2019-07-16 |
| EP3243005B1 (en) | 2019-08-28 |
| JP2018501437A (ja) | 2018-01-18 |
| GB2536336B (en) | 2018-06-20 |
| EP3247907B1 (en) | 2019-05-01 |
| JP2018503027A (ja) | 2018-02-01 |
| US10309401B2 (en) | 2019-06-04 |
| KR20170102256A (ko) | 2017-09-08 |
| US20180003178A1 (en) | 2018-01-04 |
| KR20170102257A (ko) | 2017-09-08 |
| SG11201705287WA (en) | 2017-07-28 |
| EP3243005A1 (en) | 2017-11-15 |
| CN107110162A (zh) | 2017-08-29 |
| CN107110161A (zh) | 2017-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |