SG11201705287WA - Improvements in or relating to vacuum pumping arrangements - Google Patents

Improvements in or relating to vacuum pumping arrangements

Info

Publication number
SG11201705287WA
SG11201705287WA SG11201705287WA SG11201705287WA SG11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA
Authority
SG
Singapore
Prior art keywords
relating
vacuum pumping
pumping arrangements
arrangements
vacuum
Prior art date
Application number
SG11201705287WA
Inventor
Nigel Paul Schofield
Andrew Seeley
Jack Raymond Tattersall
Neil Turner
Original Assignee
Edwards Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edwards Ltd filed Critical Edwards Ltd
Publication of SG11201705287WA publication Critical patent/SG11201705287WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F04C23/003—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle having complementary function
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/205—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00—Check valves
SG11201705287WA 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements SG11201705287WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1500133.2A GB2533933A (en) 2015-01-06 2015-01-06 Improvements in or relating to vacuum pumping arrangements
PCT/GB2016/050018 WO2016110694A1 (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements
GB1600201.6A GB2536336B (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements

Publications (1)

Publication Number Publication Date
SG11201705287WA true SG11201705287WA (en) 2017-07-28

Family

ID=55129989

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705287WA SG11201705287WA (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements

Country Status (8)

Country Link
US (2) US20170350395A1 (en)
EP (2) EP3247907B1 (en)
JP (2) JP6924147B2 (en)
KR (2) KR20170102256A (en)
CN (2) CN107110162B (en)
GB (2) GB2533933A (en)
SG (1) SG11201705287WA (en)
WO (2) WO2016110695A1 (en)

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* Cited by examiner, † Cited by third party
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JP5808454B1 (en) 2014-04-25 2015-11-10 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, program, and recording medium
US10978315B2 (en) * 2014-05-30 2021-04-13 Ebara Corporation Vacuum evacuation system
GB201620225D0 (en) * 2016-11-29 2017-01-11 Edwards Ltd Vacuum pumping arrangement
GB2561899B (en) 2017-04-28 2020-11-04 Edwards Ltd Vacuum pumping system
GB2564399A (en) * 2017-07-06 2019-01-16 Edwards Ltd Improvements in or relating to pumping line arrangements
DE102017214687A1 (en) * 2017-08-22 2019-02-28 centrotherm international AG Processing apparatus for substrates and method for operating such a treatment apparatus
CN107799445A (en) * 2017-11-01 2018-03-13 德淮半导体有限公司 Pumping system for technological cavities of semiconductor
GB201718752D0 (en) 2017-11-13 2017-12-27 Edwards Ltd Vacuum and abatement systems
CN108486543A (en) * 2018-03-02 2018-09-04 惠科股份有限公司 Substrate film forming board and application method
US11031215B2 (en) * 2018-09-28 2021-06-08 Lam Research Corporation Vacuum pump protection against deposition byproduct buildup
GB2579360A (en) * 2018-11-28 2020-06-24 Edwards Ltd Multiple chamber vacuum exhaust system
GB2581503A (en) * 2019-02-20 2020-08-26 Edwards Ltd Vacuum pumping
GB2584881B (en) * 2019-06-19 2022-01-05 Edwards Vacuum Llc Multiple vacuum chamber exhaust system and method of evacuating multiple chambers
CN110435190A (en) * 2019-06-26 2019-11-12 中复连众风电科技有限公司 Mold vacuum heating apparatus with vacuum unit
KR102329548B1 (en) * 2019-10-17 2021-11-24 무진전자 주식회사 Chamber Exhaust Automatic Control System
GB2592346B (en) * 2020-01-09 2022-11-02 Edwards Ltd Vacuum pump and vacuum pump set for evacuating a semiconductor processing chamber
GB2592043A (en) * 2020-02-13 2021-08-18 Edwards Ltd Axial flow vacuum pump
FR3112086B1 (en) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Gas treatment device and vacuum line
FR3112177B1 (en) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Vacuum line and method for controlling a vacuum line
GB2606193B (en) * 2021-04-29 2023-09-06 Edwards Ltd A valve module for a vacuum pumping system

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Also Published As

Publication number Publication date
US20180003178A1 (en) 2018-01-04
EP3243005A1 (en) 2017-11-15
KR102504078B1 (en) 2023-02-24
GB2536336B (en) 2018-06-20
WO2016110694A1 (en) 2016-07-14
KR20170102256A (en) 2017-09-08
JP6924147B2 (en) 2021-08-25
WO2016110695A1 (en) 2016-07-14
CN107110161A (en) 2017-08-29
KR20170102257A (en) 2017-09-08
JP2018503027A (en) 2018-02-01
US10309401B2 (en) 2019-06-04
GB201600201D0 (en) 2016-02-17
GB2536336A (en) 2016-09-14
GB2533933A (en) 2016-07-13
CN107110162A (en) 2017-08-29
JP2018501437A (en) 2018-01-18
CN107110161B (en) 2019-09-13
CN107110162B (en) 2019-07-16
EP3243005B1 (en) 2019-08-28
US20170350395A1 (en) 2017-12-07
EP3247907B1 (en) 2019-05-01
EP3247907A1 (en) 2017-11-29

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