CN107110161B - 真空泵送布置中或与其相关的改善 - Google Patents

真空泵送布置中或与其相关的改善 Download PDF

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Publication number
CN107110161B
CN107110161B CN201680005140.5A CN201680005140A CN107110161B CN 107110161 B CN107110161 B CN 107110161B CN 201680005140 A CN201680005140 A CN 201680005140A CN 107110161 B CN107110161 B CN 107110161B
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CN
China
Prior art keywords
vacuum
pump
pumping
valve module
pumping line
Prior art date
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Active
Application number
CN201680005140.5A
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English (en)
Chinese (zh)
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CN107110161A (zh
Inventor
N.P.肖菲尔德
A.西利
J.R.塔特索尔
N.特纳
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BOC Group Ltd
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BOC Group Ltd
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Publication of CN107110161A publication Critical patent/CN107110161A/zh
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F04C23/003—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle having complementary function
    • H01L21/205—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00—Check valves

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Jet Pumps And Other Pumps (AREA)
CN201680005140.5A 2015-01-06 2016-01-06 真空泵送布置中或与其相关的改善 Active CN107110161B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1500133.2A GB2533933A (en) 2015-01-06 2015-01-06 Improvements in or relating to vacuum pumping arrangements
GB1500133.2 2015-01-06
PCT/GB2016/050018 WO2016110694A1 (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements

Publications (2)

Publication Number Publication Date
CN107110161A CN107110161A (zh) 2017-08-29
CN107110161B true CN107110161B (zh) 2019-09-13

Family

ID=55129989

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201680005146.2A Active CN107110162B (zh) 2015-01-06 2016-01-06 真空排出系统以及在该真空排出系统中使用的通道切换阀
CN201680005140.5A Active CN107110161B (zh) 2015-01-06 2016-01-06 真空泵送布置中或与其相关的改善

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201680005146.2A Active CN107110162B (zh) 2015-01-06 2016-01-06 真空排出系统以及在该真空排出系统中使用的通道切换阀

Country Status (8)

Country Link
US (2) US20170350395A1 (enExample)
EP (2) EP3243005B1 (enExample)
JP (2) JP6924147B2 (enExample)
KR (2) KR102504078B1 (enExample)
CN (2) CN107110162B (enExample)
GB (2) GB2533933A (enExample)
SG (1) SG11201705287WA (enExample)
WO (2) WO2016110694A1 (enExample)

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JP5808454B1 (ja) 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
KR102154082B1 (ko) * 2014-05-30 2020-09-09 가부시키가이샤 에바라 세이사꾸쇼 진공 배기 시스템
GB201620225D0 (en) * 2016-11-29 2017-01-11 Edwards Ltd Vacuum pumping arrangement
GB2561899B (en) 2017-04-28 2020-11-04 Edwards Ltd Vacuum pumping system
GB2564399A (en) * 2017-07-06 2019-01-16 Edwards Ltd Improvements in or relating to pumping line arrangements
DE102017214687A1 (de) * 2017-08-22 2019-02-28 centrotherm international AG Behandlungsvorrichtung für Substrate und Verfahren zum Betrieb einer solchen Behandlungsvorrichtung
CN107799445A (zh) * 2017-11-01 2018-03-13 德淮半导体有限公司 用于半导体工艺腔的泵系统
GB201718752D0 (en) 2017-11-13 2017-12-27 Edwards Ltd Vacuum and abatement systems
CN108486543A (zh) * 2018-03-02 2018-09-04 惠科股份有限公司 基板成膜机台及使用方法
US11031215B2 (en) 2018-09-28 2021-06-08 Lam Research Corporation Vacuum pump protection against deposition byproduct buildup
CN109185705B (zh) * 2018-10-15 2024-04-16 苏州精濑光电有限公司 设备的吸真空气路系统
GB2579360A (en) * 2018-11-28 2020-06-24 Edwards Ltd Multiple chamber vacuum exhaust system
GB2581503A (en) 2019-02-20 2020-08-26 Edwards Ltd Vacuum pumping
GB2584881B (en) * 2019-06-19 2022-01-05 Edwards Vacuum Llc Multiple vacuum chamber exhaust system and method of evacuating multiple chambers
CN110435190A (zh) * 2019-06-26 2019-11-12 中复连众风电科技有限公司 具有抽真空单元的模具真空加热设备
KR102329548B1 (ko) * 2019-10-17 2021-11-24 무진전자 주식회사 챔버 배기량 자동 조절 시스템
GB2592346B (en) * 2020-01-09 2022-11-02 Edwards Ltd Vacuum pump and vacuum pump set for evacuating a semiconductor processing chamber
GB2592043A (en) * 2020-02-13 2021-08-18 Edwards Ltd Axial flow vacuum pump
FR3112177B1 (fr) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Ligne de vide et procédé de contrôle d’une ligne de vide
FR3112086B1 (fr) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Dispositif de traitement des gaz et ligne de vide
GB2603892A (en) * 2021-02-03 2022-08-24 Edwards Ltd Pump apparatus and system
GB2606193B (en) 2021-04-29 2023-09-06 Edwards Ltd A valve module for a vacuum pumping system
JP7374158B2 (ja) * 2021-10-15 2023-11-06 株式会社荏原製作所 生成物除去装置、処理システム及び生成物除去方法
US12391011B2 (en) * 2022-11-10 2025-08-19 The Boeing Company Double vacuum debulk processing

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DE10159835A1 (de) * 2001-12-06 2003-06-18 Pfeiffer Vacuum Gmbh Vakuumpumpsystem
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US4021898A (en) * 1976-05-20 1977-05-10 Timex Corporation Method of adjusting the frequency of vibration of piezoelectric resonators
US6277347B1 (en) * 1997-02-24 2001-08-21 Applied Materials, Inc. Use of ozone in process effluent abatement
US6217633B1 (en) * 1997-12-01 2001-04-17 Nippon Sanso Corporation Method and apparatus for recovering rare gas
JP2003139054A (ja) * 2001-10-31 2003-05-14 Ulvac Japan Ltd 真空排気装置
DE10159835A1 (de) * 2001-12-06 2003-06-18 Pfeiffer Vacuum Gmbh Vakuumpumpsystem
US6761135B1 (en) * 2003-08-27 2004-07-13 Bryon Edward Becktold Multipurpose assembly
CN1637283A (zh) * 2003-12-31 2005-07-13 波克股份有限公司 用于真空加工腔室的控制、抽吸和去除的设备和方法
WO2006097679A1 (en) * 2005-03-17 2006-09-21 Edwards Limited Vacuum pumping arrangement
WO2008017880A1 (en) * 2006-08-08 2008-02-14 Edwards Limited Apparatus for conveying a waste stream
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CN102713287A (zh) * 2009-12-28 2012-10-03 株式会社爱发科 真空排气装置、真空排气方法及基板处理装置
CN101922437A (zh) * 2010-08-05 2010-12-22 友达光电股份有限公司 真空设备

Also Published As

Publication number Publication date
KR20170102257A (ko) 2017-09-08
US10309401B2 (en) 2019-06-04
GB2536336B (en) 2018-06-20
CN107110161A (zh) 2017-08-29
WO2016110694A1 (en) 2016-07-14
GB201600201D0 (en) 2016-02-17
EP3247907B1 (en) 2019-05-01
WO2016110695A1 (en) 2016-07-14
JP2018503027A (ja) 2018-02-01
US20170350395A1 (en) 2017-12-07
EP3243005A1 (en) 2017-11-15
JP6924147B2 (ja) 2021-08-25
SG11201705287WA (en) 2017-07-28
KR102504078B1 (ko) 2023-02-24
GB2536336A (en) 2016-09-14
GB2533933A (en) 2016-07-13
EP3243005B1 (en) 2019-08-28
JP2018501437A (ja) 2018-01-18
CN107110162A (zh) 2017-08-29
US20180003178A1 (en) 2018-01-04
KR20170102256A (ko) 2017-09-08
CN107110162B (zh) 2019-07-16
EP3247907A1 (en) 2017-11-29

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