JP6924147B2 - 真空排気システム及びこの真空排気システムに使用されるチャネル切換弁 - Google Patents

真空排気システム及びこの真空排気システムに使用されるチャネル切換弁 Download PDF

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Publication number
JP6924147B2
JP6924147B2 JP2017553465A JP2017553465A JP6924147B2 JP 6924147 B2 JP6924147 B2 JP 6924147B2 JP 2017553465 A JP2017553465 A JP 2017553465A JP 2017553465 A JP2017553465 A JP 2017553465A JP 6924147 B2 JP6924147 B2 JP 6924147B2
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Japan
Prior art keywords
pump
channel
gas
exhaust system
branch
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Active
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JP2017553465A
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Japanese (ja)
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JP2018501437A (ja
Inventor
ナイジェル ポール スコフィールド
ナイジェル ポール スコフィールド
アンドリュー シーリー
アンドリュー シーリー
克己 西村
克己 西村
高橋　克典
克典 高橋
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Edwards Ltd
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Edwards Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F04C23/003—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle having complementary function
    • H01L21/205—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00—Check valves

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Jet Pumps And Other Pumps (AREA)
JP2017553465A 2015-01-06 2016-01-06 真空排気システム及びこの真空排気システムに使用されるチャネル切換弁 Active JP6924147B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1500133.2 2015-01-06
GB1500133.2A GB2533933A (en) 2015-01-06 2015-01-06 Improvements in or relating to vacuum pumping arrangements
PCT/GB2016/050019 WO2016110695A1 (en) 2015-01-06 2016-01-06 Vacuum exhaust system and channel-switching valve used in this vacuum exhaust system

Publications (2)

Publication Number Publication Date
JP2018501437A JP2018501437A (ja) 2018-01-18
JP6924147B2 true JP6924147B2 (ja) 2021-08-25

Family

ID=55129989

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017553465A Active JP6924147B2 (ja) 2015-01-06 2016-01-06 真空排気システム及びこの真空排気システムに使用されるチャネル切換弁
JP2017553464A Pending JP2018503027A (ja) 2015-01-06 2016-01-06 真空ポンプ装置における又はそれに関連する改善

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017553464A Pending JP2018503027A (ja) 2015-01-06 2016-01-06 真空ポンプ装置における又はそれに関連する改善

Country Status (8)

Country Link
US (2) US20170350395A1 (enExample)
EP (2) EP3247907B1 (enExample)
JP (2) JP6924147B2 (enExample)
KR (2) KR102504078B1 (enExample)
CN (2) CN107110162B (enExample)
GB (2) GB2533933A (enExample)
SG (1) SG11201705287WA (enExample)
WO (2) WO2016110694A1 (enExample)

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JP5808454B1 (ja) 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
KR102154082B1 (ko) * 2014-05-30 2020-09-09 가부시키가이샤 에바라 세이사꾸쇼 진공 배기 시스템
GB201620225D0 (en) 2016-11-29 2017-01-11 Edwards Ltd Vacuum pumping arrangement
GB2561899B (en) 2017-04-28 2020-11-04 Edwards Ltd Vacuum pumping system
GB2564399A (en) * 2017-07-06 2019-01-16 Edwards Ltd Improvements in or relating to pumping line arrangements
DE102017214687A1 (de) * 2017-08-22 2019-02-28 centrotherm international AG Behandlungsvorrichtung für Substrate und Verfahren zum Betrieb einer solchen Behandlungsvorrichtung
CN107799445A (zh) * 2017-11-01 2018-03-13 德淮半导体有限公司 用于半导体工艺腔的泵系统
GB201718752D0 (en) * 2017-11-13 2017-12-27 Edwards Ltd Vacuum and abatement systems
CN108486543A (zh) * 2018-03-02 2018-09-04 惠科股份有限公司 基板成膜机台及使用方法
JP7472114B2 (ja) * 2018-09-28 2024-04-22 ラム リサーチ コーポレーション 堆積副生成物の蓄積からの真空ポンプの保護
CN109185705B (zh) * 2018-10-15 2024-04-16 苏州精濑光电有限公司 设备的吸真空气路系统
GB2579360A (en) * 2018-11-28 2020-06-24 Edwards Ltd Multiple chamber vacuum exhaust system
GB2581503A (en) * 2019-02-20 2020-08-26 Edwards Ltd Vacuum pumping
GB2584881B (en) * 2019-06-19 2022-01-05 Edwards Vacuum Llc Multiple vacuum chamber exhaust system and method of evacuating multiple chambers
CN110435190A (zh) * 2019-06-26 2019-11-12 中复连众风电科技有限公司 具有抽真空单元的模具真空加热设备
KR102329548B1 (ko) * 2019-10-17 2021-11-24 무진전자 주식회사 챔버 배기량 자동 조절 시스템
GB2592346B (en) * 2020-01-09 2022-11-02 Edwards Ltd Vacuum pump and vacuum pump set for evacuating a semiconductor processing chamber
GB2592043A (en) * 2020-02-13 2021-08-18 Edwards Ltd Axial flow vacuum pump
FR3112177B1 (fr) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Ligne de vide et procédé de contrôle d’une ligne de vide
FR3112086B1 (fr) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Dispositif de traitement des gaz et ligne de vide
GB2603892A (en) * 2021-02-03 2022-08-24 Edwards Ltd Pump apparatus and system
GB2606193B (en) * 2021-04-29 2023-09-06 Edwards Ltd A valve module for a vacuum pumping system
JP7374158B2 (ja) * 2021-10-15 2023-11-06 株式会社荏原製作所 生成物除去装置、処理システム及び生成物除去方法
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Also Published As

Publication number Publication date
SG11201705287WA (en) 2017-07-28
EP3247907A1 (en) 2017-11-29
CN107110162A (zh) 2017-08-29
GB2536336B (en) 2018-06-20
KR20170102256A (ko) 2017-09-08
GB2536336A (en) 2016-09-14
EP3247907B1 (en) 2019-05-01
US20180003178A1 (en) 2018-01-04
EP3243005A1 (en) 2017-11-15
CN107110162B (zh) 2019-07-16
KR102504078B1 (ko) 2023-02-24
CN107110161A (zh) 2017-08-29
GB201600201D0 (en) 2016-02-17
EP3243005B1 (en) 2019-08-28
JP2018501437A (ja) 2018-01-18
CN107110161B (zh) 2019-09-13
WO2016110695A1 (en) 2016-07-14
KR20170102257A (ko) 2017-09-08
US10309401B2 (en) 2019-06-04
JP2018503027A (ja) 2018-02-01
WO2016110694A1 (en) 2016-07-14
US20170350395A1 (en) 2017-12-07
GB2533933A (en) 2016-07-13

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