SG11201705287WA - Improvements in or relating to vacuum pumping arrangements - Google Patents

Improvements in or relating to vacuum pumping arrangements

Info

Publication number
SG11201705287WA
SG11201705287WA SG11201705287WA SG11201705287WA SG11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA SG 11201705287W A SG11201705287W A SG 11201705287WA
Authority
SG
Singapore
Prior art keywords
relating
vacuum pumping
pumping arrangements
arrangements
vacuum
Prior art date
Application number
SG11201705287WA
Other languages
English (en)
Inventor
Nigel Paul Schofield
Andrew Seeley
Jack Raymond Tattersall
Neil Turner
Original Assignee
Edwards Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edwards Ltd filed Critical Edwards Ltd
Publication of SG11201705287WA publication Critical patent/SG11201705287WA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405Cleaning of reactor or parts inside the reactor by using reactive gases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F04C23/003Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle having complementary function
    • H01L21/205
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00Application
    • F04C2220/30Use in a chemical vapor deposition [CVD] process or in a similar process
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00Check valves

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Jet Pumps And Other Pumps (AREA)
SG11201705287WA 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements SG11201705287WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1500133.2A GB2533933A (en) 2015-01-06 2015-01-06 Improvements in or relating to vacuum pumping arrangements
PCT/GB2016/050018 WO2016110694A1 (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements
GB1600201.6A GB2536336B (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements

Publications (1)

Publication Number Publication Date
SG11201705287WA true SG11201705287WA (en) 2017-07-28

Family

ID=55129989

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705287WA SG11201705287WA (en) 2015-01-06 2016-01-06 Improvements in or relating to vacuum pumping arrangements

Country Status (8)

Country Link
US (2) US20170350395A1 (enExample)
EP (2) EP3247907B1 (enExample)
JP (2) JP6924147B2 (enExample)
KR (2) KR102504078B1 (enExample)
CN (2) CN107110162B (enExample)
GB (2) GB2533933A (enExample)
SG (1) SG11201705287WA (enExample)
WO (2) WO2016110694A1 (enExample)

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JP5808454B1 (ja) 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
KR102154082B1 (ko) * 2014-05-30 2020-09-09 가부시키가이샤 에바라 세이사꾸쇼 진공 배기 시스템
GB201620225D0 (en) 2016-11-29 2017-01-11 Edwards Ltd Vacuum pumping arrangement
GB2561899B (en) 2017-04-28 2020-11-04 Edwards Ltd Vacuum pumping system
GB2564399A (en) * 2017-07-06 2019-01-16 Edwards Ltd Improvements in or relating to pumping line arrangements
DE102017214687A1 (de) * 2017-08-22 2019-02-28 centrotherm international AG Behandlungsvorrichtung für Substrate und Verfahren zum Betrieb einer solchen Behandlungsvorrichtung
CN107799445A (zh) * 2017-11-01 2018-03-13 德淮半导体有限公司 用于半导体工艺腔的泵系统
GB201718752D0 (en) * 2017-11-13 2017-12-27 Edwards Ltd Vacuum and abatement systems
CN108486543A (zh) * 2018-03-02 2018-09-04 惠科股份有限公司 基板成膜机台及使用方法
JP7472114B2 (ja) * 2018-09-28 2024-04-22 ラム リサーチ コーポレーション 堆積副生成物の蓄積からの真空ポンプの保護
CN109185705B (zh) * 2018-10-15 2024-04-16 苏州精濑光电有限公司 设备的吸真空气路系统
GB2579360A (en) * 2018-11-28 2020-06-24 Edwards Ltd Multiple chamber vacuum exhaust system
GB2581503A (en) * 2019-02-20 2020-08-26 Edwards Ltd Vacuum pumping
GB2584881B (en) * 2019-06-19 2022-01-05 Edwards Vacuum Llc Multiple vacuum chamber exhaust system and method of evacuating multiple chambers
CN110435190A (zh) * 2019-06-26 2019-11-12 中复连众风电科技有限公司 具有抽真空单元的模具真空加热设备
KR102329548B1 (ko) * 2019-10-17 2021-11-24 무진전자 주식회사 챔버 배기량 자동 조절 시스템
GB2592346B (en) * 2020-01-09 2022-11-02 Edwards Ltd Vacuum pump and vacuum pump set for evacuating a semiconductor processing chamber
GB2592043A (en) * 2020-02-13 2021-08-18 Edwards Ltd Axial flow vacuum pump
FR3112177B1 (fr) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Ligne de vide et procédé de contrôle d’une ligne de vide
FR3112086B1 (fr) * 2020-07-09 2022-07-08 Pfeiffer Vacuum Dispositif de traitement des gaz et ligne de vide
GB2603892A (en) * 2021-02-03 2022-08-24 Edwards Ltd Pump apparatus and system
GB2606193B (en) * 2021-04-29 2023-09-06 Edwards Ltd A valve module for a vacuum pumping system
JP7374158B2 (ja) * 2021-10-15 2023-11-06 株式会社荏原製作所 生成物除去装置、処理システム及び生成物除去方法
US12391011B2 (en) * 2022-11-10 2025-08-19 The Boeing Company Double vacuum debulk processing

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JP5808454B1 (ja) * 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
KR102154082B1 (ko) * 2014-05-30 2020-09-09 가부시키가이샤 에바라 세이사꾸쇼 진공 배기 시스템
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Also Published As

Publication number Publication date
EP3247907A1 (en) 2017-11-29
JP6924147B2 (ja) 2021-08-25
CN107110162A (zh) 2017-08-29
GB2536336B (en) 2018-06-20
KR20170102256A (ko) 2017-09-08
GB2536336A (en) 2016-09-14
EP3247907B1 (en) 2019-05-01
US20180003178A1 (en) 2018-01-04
EP3243005A1 (en) 2017-11-15
CN107110162B (zh) 2019-07-16
KR102504078B1 (ko) 2023-02-24
CN107110161A (zh) 2017-08-29
GB201600201D0 (en) 2016-02-17
EP3243005B1 (en) 2019-08-28
JP2018501437A (ja) 2018-01-18
CN107110161B (zh) 2019-09-13
WO2016110695A1 (en) 2016-07-14
KR20170102257A (ko) 2017-09-08
US10309401B2 (en) 2019-06-04
JP2018503027A (ja) 2018-02-01
WO2016110694A1 (en) 2016-07-14
US20170350395A1 (en) 2017-12-07
GB2533933A (en) 2016-07-13

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