FR2533047B1 - Carte a memoire avec un circuit integre incorpore - Google Patents

Carte a memoire avec un circuit integre incorpore

Info

Publication number
FR2533047B1
FR2533047B1 FR8314432A FR8314432A FR2533047B1 FR 2533047 B1 FR2533047 B1 FR 2533047B1 FR 8314432 A FR8314432 A FR 8314432A FR 8314432 A FR8314432 A FR 8314432A FR 2533047 B1 FR2533047 B1 FR 2533047B1
Authority
FR
France
Prior art keywords
integrated
memory card
integrated circuit
circuit
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8314432A
Other languages
English (en)
Other versions
FR2533047A1 (fr
Inventor
Masahiro Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57156982A external-priority patent/JPS5946085A/ja
Priority claimed from JP1982148913U external-priority patent/JPS5953468U/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of FR2533047A1 publication Critical patent/FR2533047A1/fr
Application granted granted Critical
Publication of FR2533047B1 publication Critical patent/FR2533047B1/fr
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/026—Spark gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
FR8314432A 1982-09-09 1983-09-09 Carte a memoire avec un circuit integre incorpore Expired FR2533047B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57156982A JPS5946085A (ja) 1982-09-09 1982-09-09 カ−ド
JP1982148913U JPS5953468U (ja) 1982-09-30 1982-09-30 デ−タカ−ド

Publications (2)

Publication Number Publication Date
FR2533047A1 FR2533047A1 (fr) 1984-03-16
FR2533047B1 true FR2533047B1 (fr) 1986-02-21

Family

ID=26478962

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8314432A Expired FR2533047B1 (fr) 1982-09-09 1983-09-09 Carte a memoire avec un circuit integre incorpore

Country Status (7)

Country Link
US (1) US4532419A (fr)
KR (1) KR910008393B1 (fr)
CA (1) CA1204213A (fr)
DE (1) DE3332453A1 (fr)
FR (1) FR2533047B1 (fr)
GB (1) GB2130142B (fr)
NL (1) NL8303112A (fr)

Families Citing this family (174)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062252A (ja) * 1983-09-16 1985-04-10 Toshiba Corp 暗号回路内蔵カード及びそのサービスセンター
JPS60176186A (ja) * 1984-02-23 1985-09-10 Omron Tateisi Electronics Co Ｉｃカ−ドシステム
JPS60252992A (ja) * 1984-05-30 1985-12-13 Toshiba Corp Ｉｃカ−ド
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
JPS625367U (fr) * 1985-03-16 1987-01-13
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
JPS61188871U (fr) * 1985-05-16 1986-11-25
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
US4889980A (en) * 1985-07-10 1989-12-26 Casio Computer Co., Ltd. Electronic memory card and method of manufacturing same
US4677520A (en) * 1985-09-13 1987-06-30 James Price Static charge protector for integrated circuits
JPH0530937Y2 (fr) * 1985-10-04 1993-08-09
FR2588695B1 (fr) * 1985-10-11 1988-07-29 Eurotechnique Sa Procede de fabrication d'un microboitier, microboitier a contacts effleurants et application aux cartes contenant des composants
JPS62121979A (ja) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp 集積回路メモリ
US4742215A (en) * 1986-05-07 1988-05-03 Personal Computer Card Corporation IC card system
JPH06104394B2 (ja) * 1986-06-11 1994-12-21 株式会社東芝 携帯可能記憶媒体
US4980856A (en) * 1986-10-20 1990-12-25 Brother Kogyo Kabushiki Kaisha IC memory cartridge and a method for providing external IC memory cartridges to an electronic device extending end-to-end
US4864116A (en) * 1987-03-12 1989-09-05 Mitsubishi Denki Kabushiki Kaisha Mechanism for connecting an IC card to an external device
JPH0657476B2 (ja) * 1987-03-27 1994-08-03 三菱電機株式会社 Ｉｃカ−ドの外部機器用コネクタ
WO1989001873A1 (fr) * 1987-08-26 1989-03-09 Matsushita Electric Industrial Co., Ltd. Dispositif a circuit integre et procede de fabrication dudit circuit
US4764666A (en) * 1987-09-18 1988-08-16 Gtech Corporation On-line wagering system with programmable game entry cards
US4882473A (en) * 1987-09-18 1989-11-21 Gtech Corporation On-line wagering system with programmable game entry cards and operator security cards
US5179517A (en) * 1988-09-22 1993-01-12 Bally Manufacturing Corporation Game machine data transfer system utilizing portable data units
FR2642543B1 (fr) * 1989-01-27 1991-04-05 Gemplus Card Int Dispositif de securite pour circuit integre
JPH0764143B2 (ja) * 1989-07-05 1995-07-12 セイコーエプソン株式会社 メモリカードの静電気除電構造
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
US5029041A (en) * 1989-08-31 1991-07-02 Northern Telecom Limited Electrostatic discharge protection for a printed circuit board
US5157244A (en) * 1989-12-19 1992-10-20 Amp Incorporated Smart key system
US5282113A (en) * 1990-03-05 1994-01-25 Hitachi Maxell, Ltd. Memory card with a plurality of contact spaces
US5822544A (en) * 1990-07-27 1998-10-13 Executone Information Systems, Inc. Patient care and communication system
US6958706B2 (en) * 1990-07-27 2005-10-25 Hill-Rom Services, Inc. Patient care and communication system
US5291399A (en) * 1990-07-27 1994-03-01 Executone Information Systems, Inc. Method and apparatus for accessing a portable personal database as for a hospital environment
JPH0832494B2 (ja) * 1990-08-18 1996-03-29 三菱電機株式会社 携帯形半導体記憶装置
US5495130A (en) * 1990-09-04 1996-02-27 Magnetrol International, Incorporated Point level switch
US5567169A (en) * 1990-09-27 1996-10-22 The Whitaker Corporation Electrostatic discharge conductor to shell continuity
US5567168A (en) * 1990-09-27 1996-10-22 The Whitaker Corporation Electrical connector having electrostatic discharge protection
JPH04263998A (ja) * 1991-02-19 1992-09-18 Mitsubishi Electric Corp メモリカード
US5219294A (en) * 1991-02-20 1993-06-15 Amp Incorporated Electrical docking connector
JPH0722943Y2 (ja) * 1991-06-25 1995-05-24 株式会社本田ロック 送信装置
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
FR2684235B1 (fr) * 1991-11-25 1999-12-10 Gemplus Card Int Carte a circuit integre comprenant des moyens de protection du circuit integre.
JPH05250864A (ja) * 1992-03-04 1993-09-28 Nec Corp メモリカード
US5333100A (en) * 1992-06-29 1994-07-26 Itt Corporation Data card perimeter shield
JPH0789282A (ja) * 1993-06-30 1995-04-04 Mitsubishi Electric Corp Ｉｃメモリカード、ホスト装置側コネクタ及びそれらを用いた接続システム
US5394121A (en) * 1993-10-15 1995-02-28 International Business Machines Corporation Wiring topology for transfer of electrical signals
US5630270A (en) * 1994-03-03 1997-05-20 Alcatel Network Systems, Inc. Circuit board identification method
US5521831A (en) * 1994-04-11 1996-05-28 Doyle Argosy Innovators Ltd. Method and system for the detection of counterfeit credit or debit cards and other counterfeit objects
JPH07290869A (ja) * 1994-04-26 1995-11-07 Mitsubishi Electric Corp Ｉｃカード
JPH07323686A (ja) * 1994-05-31 1995-12-12 Mitsubishi Electric Corp Ｉｃメモリカード
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
TW381236B (en) * 1995-07-07 2000-02-01 Docusystem Inc Integrated circuit chip card and the method and system for the manufacture same
JP3072707B2 (ja) * 1995-10-31 2000-08-07 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 液晶表示装置及びその製造方法
US5674083A (en) * 1995-11-22 1997-10-07 The Whitaker Corporation ESD protected electrical connector
DE19608513A1 (de) * 1996-03-05 1997-09-11 Siemens Ag Chipkarte mit ESD-Schutz
WO1998021693A1 (fr) * 1996-11-15 1998-05-22 Integrated Silicon Solution, Inc. Protection contre les decharges electrostatiques pour supports numeriques
JPH10198778A (ja) * 1997-01-14 1998-07-31 Rohm Co Ltd Ｉｃカード
US6786417B1 (en) * 1997-06-04 2004-09-07 Sony Corporation Memory card with write protection switch
US6000955A (en) * 1997-12-10 1999-12-14 Gabriel Technologies, Inc. Multiple terminal edge connector
US6040622A (en) * 1998-06-11 2000-03-21 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
US6002569A (en) * 1998-06-29 1999-12-14 Hewlett-Packard Company Electrostatic discharge protection apparatus
US6634561B1 (en) * 1999-06-24 2003-10-21 Sandisk Corporation Memory card electrical contact structure
JP2001118619A (ja) * 1999-10-18 2001-04-27 Jst Mfg Co Ltd コネクタ
TW452152U (en) * 1999-11-15 2001-08-21 Kinpo Elect Inc Seat commonly used for dual memory cards
JP3815936B2 (ja) * 2000-01-25 2006-08-30 株式会社ルネサステクノロジ Ｉｃカード
US6373719B1 (en) * 2000-04-13 2002-04-16 Surgx Corporation Over-voltage protection for electronic circuits
US7086600B2 (en) * 2001-02-02 2006-08-08 Renesas Technology Corporation Electronic device and method of manufacturing the same
US6858925B2 (en) * 2001-04-02 2005-02-22 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
US6632997B2 (en) * 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6967124B1 (en) 2001-06-19 2005-11-22 Amkor Technology, Inc. Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
JP3735553B2 (ja) * 2001-09-28 2006-01-18 株式会社東芝 カード型電子機器
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
US7399661B2 (en) * 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US6930257B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laminated laser-embedded circuit layers
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US20080043447A1 (en) * 2002-05-01 2008-02-21 Amkor Technology, Inc. Semiconductor package having laser-embedded terminals
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US6816032B1 (en) 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
TW556906U (en) * 2002-10-03 2003-10-01 C One Technology Corp Small electronic card structure
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US6998721B2 (en) * 2002-11-08 2006-02-14 Stmicroelectronics, Inc. Stacking and encapsulation of multiple interconnected integrated circuits
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7018224B2 (en) * 2003-05-22 2006-03-28 Tyco Electronics Corporation Charge-controlling system
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
JP2005322109A (ja) * 2004-05-11 2005-11-17 Renesas Technology Corp Ｉｃカードモジュール
US20060000914A1 (en) * 2004-06-30 2006-01-05 Chen Chien-Yuan Memory card capable of wireless transmission
US7324317B2 (en) * 2004-08-31 2008-01-29 Intel Corporation Control of breakdown voltage for microelectronic packaging
JP4564321B2 (ja) * 2004-09-30 2010-10-20 株式会社東芝 カード型電子機器
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
US20090021921A1 (en) * 2005-04-26 2009-01-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US7375975B1 (en) 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
WO2007056503A2 (fr) * 2005-11-08 2007-05-18 Macsema, Inc. Dispositifs d'informations
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US20070270040A1 (en) * 2006-05-05 2007-11-22 Jang Sang J Chamfered Memory Card
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
US20080106415A1 (en) * 2006-11-08 2008-05-08 Macsema, Inc. Information tag
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US7750250B1 (en) 2006-12-22 2010-07-06 Amkor Technology, Inc. Blind via capture pad structure
US7752752B1 (en) 2007-01-09 2010-07-13 Amkor Technology, Inc. Method of fabricating an embedded circuit pattern
TWI327803B (en) * 2007-03-02 2010-07-21 Giga Byte Tech Co Ltd Circuit for preventing surge, connector and electronic apparatus thereof
US8323771B1 (en) 2007-08-15 2012-12-04 Amkor Technology, Inc. Straight conductor blind via capture pad structure and fabrication method
US8947883B2 (en) * 2007-12-27 2015-02-03 Sandisk Technologies Inc. Low profile wire bonded USB device
JP2010160647A (ja) * 2009-01-07 2010-07-22 Toshiba Corp 半導体メモリカード
US8872329B1 (en) 2009-01-09 2014-10-28 Amkor Technology, Inc. Extended landing pad substrate package structure and method
US7960827B1 (en) 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
US8623753B1 (en) 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
US8222538B1 (en) 2009-06-12 2012-07-17 Amkor Technology, Inc. Stackable via package and method
US8471154B1 (en) 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
USD638431S1 (en) * 2009-10-20 2011-05-24 Sandisk Corporation MicroSD memory card with a semi-transparent color surface
US8690283B2 (en) 2009-10-20 2014-04-08 Sandisk Il Ltd. Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8536462B1 (en) 2010-01-22 2013-09-17 Amkor Technology, Inc. Flex circuit package and method
US8300423B1 (en) 2010-05-25 2012-10-30 Amkor Technology, Inc. Stackable treated via package and method
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
TWI388248B (zh) * 2010-06-25 2013-03-01 Pegatron Corp 電子裝置
US8338229B1 (en) 2010-07-30 2012-12-25 Amkor Technology, Inc. Stackable plasma cleaned via package and method
US8717775B1 (en) 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
US8337657B1 (en) 2010-10-27 2012-12-25 Amkor Technology, Inc. Mechanical tape separation package and method
US8482134B1 (en) 2010-11-01 2013-07-09 Amkor Technology, Inc. Stackable package and method
US9748154B1 (en) 2010-11-04 2017-08-29 Amkor Technology, Inc. Wafer level fan out semiconductor device and manufacturing method thereof
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8557629B1 (en) 2010-12-03 2013-10-15 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8535961B1 (en) 2010-12-09 2013-09-17 Amkor Technology, Inc. Light emitting diode (LED) package and method
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
KR101140113B1 (ko) 2011-04-26 2012-04-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스
US8653674B1 (en) 2011-09-15 2014-02-18 Amkor Technology, Inc. Electronic component package fabrication method and structure
US8633598B1 (en) 2011-09-20 2014-01-21 Amkor Technology, Inc. Underfill contacting stacking balls package fabrication method and structure
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
US8649820B2 (en) * 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
CN103515793A (zh) * 2012-06-16 2014-01-15 富士康(昆山)电脑接插件有限公司 电连接器及收容于电连接器内的印刷电路板
KR101366461B1 (ko) 2012-11-20 2014-02-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US9799592B2 (en) 2013-11-19 2017-10-24 Amkor Technology, Inc. Semicondutor device with through-silicon via-less deep wells
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
KR101488590B1 (ko) 2013-03-29 2015-01-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
TW201505496A (zh) * 2013-07-26 2015-02-01 Wintek Corp 電子裝置之連接結構
US9317802B2 (en) * 2013-08-14 2016-04-19 Globalfoundries Inc. Detecting water intrusion in electronic devices
US9830424B2 (en) 2013-09-18 2017-11-28 Hill-Rom Services, Inc. Bed/room/patient association systems and methods
KR101607981B1 (ko) 2013-11-04 2016-03-31 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
US10582630B1 (en) * 2015-12-28 2020-03-03 Roger Graham Method and apparatus for managing static electricity
US10263352B2 (en) * 2016-06-10 2019-04-16 Te Connectivity Corporation Electrical contact pad for electrically contacting a connector
US9960328B2 (en) 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US11911325B2 (en) 2019-02-26 2024-02-27 Hill-Rom Services, Inc. Bed interface for manual location
US11477881B2 (en) * 2019-06-26 2022-10-18 Sandisk Technologies Llc Spark gap electrostatic discharge (ESD) protection for memory cards
CN110418493B (zh) * 2019-07-04 2022-04-05 榆林学院 一种压敏电阻静电防护组件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
US3676742A (en) * 1971-05-24 1972-07-11 Signetics Corp Means including a spark gap for protecting an integrated circuit from electrical discharge
GB1532228A (en) * 1974-11-29 1978-11-15 Rca Corp Spark gap and discharge path arrangement for a television picture tube or other cathode ray tube
DE2713936A1 (de) * 1977-03-29 1978-10-12 Siemens Ag Verfahren zum herstellen einer halbleitervorrichtung
JPS55126983A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Discharge gap
US4349235A (en) * 1979-08-23 1982-09-14 Murata Manufacturing Co., Ltd. Cathode-ray tube socket substrate
FR2472330A1 (fr) * 1979-12-19 1981-06-26 Radiotechnique Compelec Carte electronique autoprotegee contre l'application fortuite de tensions sur ses contacts d'entrees-sorties
FR2480008A1 (fr) * 1980-04-04 1981-10-09 Flonic Sa Perfectionnements aux cartes a memoire
GB2084434B (en) * 1980-09-16 1984-03-28 Murata Manufacturing Co A cathode-ray tube socket substrate

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DE3332453A1 (de) 1984-04-05
GB2130142B (en) 1986-01-22
FR2533047A1 (fr) 1984-03-16
GB8323829D0 (en) 1983-10-05
US4532419A (en) 1985-07-30
GB2130142A (en) 1984-05-31
KR840006096A (ko) 1984-11-21
CA1204213A (fr) 1986-05-06
KR910008393B1 (ko) 1991-10-15
NL8303112A (nl) 1984-04-02

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