WO1998021693A1 - Protection contre les decharges electrostatiques pour supports numeriques - Google Patents

Protection contre les decharges electrostatiques pour supports numeriques

Info

Publication number
WO1998021693A1
WO1998021693A1 PCT/US1997/019312 US9719312W WO9821693A1 WO 1998021693 A1 WO1998021693 A1 WO 1998021693A1 US 9719312 W US9719312 W US 9719312W WO 9821693 A1 WO9821693 A1 WO 9821693A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
digital media
major surface
electrical contact
exposed
Prior art date
Application number
PCT/US1997/019312
Other languages
English (en)
Inventor
Robin J. Jigour
David K. Wong
Original Assignee
Integrated Silicon Solution, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Silicon Solution, Inc. filed Critical Integrated Silicon Solution, Inc.
Priority to AU49985/97A priority Critical patent/AU4998597A/en
Publication of WO1998021693A1 publication Critical patent/WO1998021693A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to electrostatic discharge protection for digital media, and more particularly to electrostatic discharge protection for digital media such as cards and modules.
  • Flash PC cards have become widely used for mass data storage applications, and are a popular alternative for conventional add-on card implemented non-volatile memory solutions such as rotating hard disks and battery-backed SRAM, especially for notebook computers, personal data assistants ("PDAs”), and some high-end digital cameras.
  • rotating hard disk PC cards flash PC cards are more rugged and space efficient, are silent, consume less power, provide higher performance (in most cases), and provide a removable form-factor.
  • battery-backed SRAM PC cards flash PC cards typically offer higher-densities and lower cost per bit and are not as limited by reliability and temperature issues associated with batteries used in the battery-backed SRAM PC cards.
  • CMOS complementary metal-oxide-semiconductor
  • SSFDC solid state floppy disk cards
  • MMC multiMediaCard
  • ROM read only memory
  • Some low memory capacity card formats also have enjoyed a measure of success in certain specific applications. For example, two commercially successful low memory capacity card formats are known as the IC and LD card formats and the GSM SIM card format.
  • IC and ID cards are commonly known as “smart cards,” and are commonly used as telephone calling cards and stored value cards.
  • the GSM SIM card is used inside the phone as a plug-in module and typically is removed only if a different GSM phone is to be used.
  • ESD electrostatic discharge
  • Various techniques have been devised for protecting removable media devices from damage due to ESD.
  • ESD protection circuits, devices and structures incorporated into the internal circuits are effective to varying degrees.
  • most digital integrated circuit standards specify an ESD tolerance in the range of from 1 kV to 3 kV applied through the pins
  • the smart card standard specifies an ESD tolerance of 1.5 kV applied through the pins
  • the MultiMediaCard which uses ROM memory, specifies an ESD tolerance of 4 kV applied through the pins.
  • An object of the various embodiments of the present invention is to achieve enhanced electrostatic discharge protection.
  • One embodiment of the present invention comprises a body having first and second opposing major surfaces; a plurality of electrical contact pads, the pads being integral with the body and at least generally disposed at the first major surface; a conductive path integral with the body and having exposed portions widely disposed upon the body; and a memory integrated circuit integral with the body.
  • Another embodiment of the present invention comprises a body having first and second opposing major surfaces; a plurality of electrical contact pads, the pads being integral with the body and at least generally disposed at the first major surface; a conductive path integral with the body and having portions exposed in areas likely to be touched by a user and areas likely to couple to ground potential during insertion; and a memory integrated circuit integral with the body.
  • Figure 1 is a perspective view of a family of digital media devices in accordance with the present invention.
  • Figure 2 is a top plan view of a digital media device having a contact pad array and an electrostatic discharge protection ring in accordance with the present invention
  • Figure 3 is a top plan view of a socket for receiving digital media devices of the Figure 1 family;
  • Figure 4 is a top plan view of the digital media device of Figure 2 in an intermediate stage of fabrication and showing a precursor to the electrostatic discharge protection ring;
  • Figure 5 is a bottom plan view of the digital media device of Figure 2 in an intermediate stage of fabrication and showing a precursor to the electrostatic discharge protection ring.
  • Digital media means insertable/removable memory media for storing and transferring large digital files, especially audio, data and image files, in personal, portable and mobile environments.
  • the storage requirement typically is high capacity, i.e. about one Megabit or greater.
  • a one Megabit flash device might store 1-2 minutes of digital voice recording, a 10 page fax, or 10-
  • digital media supports read, erase, and write at either 5 volt or 3 volt supply levels, and contains small sectors that can be programmed quickly to efficiently use battery-power and to keep pace with high-speed portable and mobile applications.
  • media elements stored or transferred include voice and sound clips, facsimile, pictures, writing, drawing, scanned images, maps, e-mail, data logging, 0 downloadable code, and general data files.
  • a few examples of emerging digital media storage applications include digital cameras, solid-state voice recorders, portable scanners and bar-code readers, voice/data pagers, cellular phone answering machines, portable pen-based tablets, handheld terminals and meters, and portable data acquisition equipment.
  • Figure 1 is a perspective view of a family 100 of removable digital media devices 110, 120, s 130, 140, 150 and 160, each of which when plugged into a host permits the host to store data in it or to retrieve data from it.
  • the form factors of the digital media devices in the family 100 and the connector system used by the digital media devices are compact for minimizing the volume of space occupied in portable devices and for easy storage.
  • Some embodiments, illustratively digital media devices 110, 120, 130, 150 and 160 provide an elongated compact form factor that o provides easy and firm grasping for insertion and removal.
  • the digital media devices of the family 100 have respective body portions 112, 122, 132, 142, 152 and 162 preferably of a rigid or semirigid material such as mylar, poly-vinyl chloride (“PVC") or PVCA material, which is commonly used in smart cards and modules, or FR4 epoxy glass, which is commonly used for printed circuit boards.
  • PVC poly-vinyl chloride
  • PVCA poly-vinyl chloride
  • the digital media devices of the family 100 use serial memory requiring few 5 power and signal lines, so that few electrical contacts are required.
  • a small number of durable contact pads form respective contact arrays 114, 124, 134, 144, 154 and 164 on the digital media devices 110, 120, 130, 140, 150 and 160, which in conjunction with corresponding contact pads mounted into a suitable socket provide for easy and convenient insertion and removal and for robust and reliable electrical contact over a long insertion lifetime.
  • the digital media o devices of the family 100 incorporate flash memory, which permits low voltage operation, low power consumption, and high capacity non- volatile data storage.
  • the digital media devices of the family 100 are fabricated using surface mount techniques, of which the digital media devices 110 and 120 are illustrative, or particularly inexpensive "Chip on Board” ("COB”) techniques, of which the digital media devices 130, 140, 150 and 160 are illustrative.
  • COB Chip on Board
  • the form factors of the digital media devices in the family 100 are compact for easy storage and transportation and for minimizing "insertion volume" in a host such as a laptop computer or PDA. Insertion volume is the volume required to house a card or module, or rather the connector of the card or module and as much of the card or module as is required to be contained by the host.
  • Some family members provide an elongated compact form factor that provides easy and firm grasping for insertion and removal, as well as space for additional memory ICs or chips.
  • a suitable elongated long form factors illustratively has a width of 15 mm, a length of 45 mm, and a thickness of 0.76 mm.
  • Other family members are of a length comparable with the length of certain common battery types such as AA and AAA batteries, and are therefor capable of insertion into the battery compartments of personal, portable and mobile equipment.
  • a suitable short form factor illustratively has a width of 15 mm, a length of 25 mm, and a thickness of 0.76 mm.
  • the long and short form factor dimensions are illustrative, and the optimal size of the form factors suitable for the digital media device family 100 is influenced by several factors, including, for example, the size of the host, the size of the electrical contact array required, the need for sufficient body surface and a suitable shape for a user to grasp the device for insertion, removal, and transport, convenience of transport and storage, and compatibility for insertion into compartments such as battery compartments commonly provided in personal, portable and mobile equipment.
  • the choice of form factor within the range of acceptable form factors is also influenced by other factors, including, for example, whether sufficient surface on the body is required for a user to grasp the digital media device for insertion and removal without touching the electrical contact array, which tends to favor a longer form factor; and whether the digital media device is intended for cost-sensitive applications, in which case the availability of low cost high volume manufacturing techniques is important.
  • An example of the latter is a digital media device having a length equal to the width of a standard ISO smart IC card, which permits manufacturing equipment suitable for standard ISO smart cards to be used in the manufacture of the digital media device.
  • the thickness of the digital media devices in the family 100 preferably achieves sufficient rigidity to permit good control over insertion and removal, and to prevent damage to the integrated circuit due to device stress under normal use.
  • the rigidity requirements may be relaxed where the die is small or is otherwise protected, as where the die is mounted using COB packaging techniques in which the die is mounted on a rigid substrate and encased with epoxy material.
  • the media device is made from PVC, PVCA, or FR4 epoxy glass, a convenient thickness is about 0.8 mm.
  • the digital media devices of the family 100 may be made in other shapes.
  • the digital media device 150 has a key-like shape which provides not only convenient handling but also more surface area for additional memory circuits and for the manufacturer's logo, use instructions, user written notes, and the like.
  • a small number of durable contact pads form respective contact arrays 1 14, 124, 134, 144, 154 and 164 on the digital media devices 110, 120, 130, 140, 150 and 160, which in conjunction with corresponding contact pads mounted into a suitable socket provide for easy and convenient insertion and removal and for robust and reliable electrical contact.
  • Contact pads are preferred to pins and sockets, since they are more durable and do not clog.
  • the contact pads both in the digital media device and in its corresponding socket are flat or generally flat and lie in a generally planar major surface of the digital media device. The number of contact pads in the array preferable is kept low, thereby permitting both a small form factor with the advantages mentioned above, as well as large contact pads to ensure durability and reliable electrical contact over many insertion-removal cycles.
  • a conductive path is provided through the digital media device.
  • the conductive path is exposed at least in areas of the digital media device likely to be touched by a person handling the device as well as in areas likely to contact or at least be proximate to grounded structures such as working surfaces during handling and portions of the socket during insertion.
  • the conductive path preferably also extends near the contact pads of the digital media device, and is s exposed there as well.
  • One suitable arrangement is an exposed conductive ring at the periphery of the digital media device.
  • ground planes are provided on both major surfaces, except over the contact pads.
  • FIG. 2 An illustrative digital media device based on the ISO IC card standard and having enhanced s ESD protection is shown in Figure 2.
  • the digital media device 200 of Figure 2 is 15 mm wide and 45 mm long.
  • ESD rings are provided in the periphery of both major surfaces of the digital media device 200.
  • ESD ring 240 provided on the major surface in which the contact pad array 210 is disposed is about 0.5 mm wide and spaced a few tenths of a millimeter from the edge of the digital media card 200, and is discontinuous in front of the contact 0 pad array 210 so as not to contact pads of a socket during insertion.
  • a similar ESD protection ring is provided on the other major surface (not shown) of the digital media device 200.
  • the ESD ring 240 and its counterpart on the opposite major surface preferably are gold plated portions of respective ground planes (not shown) provided on the two major surfaces of the digital media device 200.
  • the spacing of the ESD ring 240 from the edge of the digital media device 200 is an 5 artifact of the process for fabricating the conductive layer of the printed circuit board of which the ground plane is part.
  • the contact pad array 210 is set back from the head of the digital media device 200 by about 1.76 mm, and from the sides of the digital media device 200 by about 2.59 mm.
  • Each of the contact pads 211, 212, 213, 214, 217 and 218 is about 2.54 mm by 4.48 mm in size.
  • the contact l o pad 215 also has a portion that is about 2.54 mm by 4.48 mm in size, but has a first extension portion that extends about 4.10 mm toward contact pad 211, and a second extension portion that is about 1.66 mm wide and lies between pads 212 and 216.
  • Pad 216 is about 2.54 mm by 4.05 mm in size.
  • Pads 213 and 217 and pads 214 and 218 are spaced about 4.01 mm from one another, and pads 212 and 216 are spaced about 4.46 mm from one another.
  • the edge of the pad 216 toward the head is of the digital media device 200 is spaced about 2.80 mm from the second extension portion of the pad 215.
  • gaps between adjacent portions of the contact pads 211-218 are about 0.33 mm wide.
  • the contact pads 211-218 are made of any suitable contact pad material, such material being well known in the art.
  • the particular contact pad array 210 described herein is illustrative, and a various other eight pad contact arrays and contact arrays having fewer or more than eight pads may
  • the contact pads 211-218 of the digital media device 200 are assigned signal and power functions depending on the interface desired.
  • Preferred serial interface protocols are the Nexcom Serial Interface protocol, or NXS protocol, which specifies a two-wire interface, viz. Clock and Data I/O; and the Serial Peripheral Interface ("SPI") protocol, which specifies a four-wire 25 interface, viz. Clock, Data In, Data Out, and Chip Select.
  • NXS and SPI protocols are described in more detail in the aforementioned Jigour et al. patent application.
  • the NXS and SPI protocols are illustrative, and other protocols may be used if desired. While the use of eight contact pads is described, six pads would be entirely satisfactory for some applications and the interface protocols would be adjusted accordingly.
  • the socket base 310 is made of any suitable electrically insulative, durable and heat-resistant material, such material being well known in the art.
  • Eight electrical contact pads 321, 322, 323, 324, 325, 326, 327 and 328 (only terminal ends are shown in Figure 3)
  • each of the pads 321-328 is brought out beyond the base 310 as a terminal end for connection to external circuitry.
  • the other end of each of the pads 321-328 (not shown) is bent up from the base 310 and has a springy characteristic to press against and engage a corresponding contact pad on the digital media device 200.
  • a U-shaped metal envelope 330 is i o attached to the base 310 during the molding process, and rises therefrom over the bent ends of the pads 321-328 to provide a cavity for receiving the digital media device 200.
  • the envelope 330 preferably is grounded so that as the digital media device 200 is inserted, the ESD ring 240 becomes electrically proximate to the envelope 330 and shunts the electrostatic discharge from the user.
  • the particular socket 300 described herein is illustrative, and a various other eight
  • the digital media device 200 also includes a memory integrated circuit 220.
  • the memory integrated circuit 220 is high density serial flash memory, which requires few power and signal lines and permits low voltage operation, low power consumption, and high capacity nonvolatile data storage.
  • a suitable serial flash memory circuit is disclosed in United States Patent No. 20 5,291,584, issued March 1, 1994 to Challa et al. and entitled “Method and Apparatus for Hard Disk Emulation," which is hereby incorporated herein by reference in its entirety.
  • Other serial standards and specifications may also be suitable other than the specification set forth in the aforementioned Challa et al. patent, including, for example, SPI, I2C, COPS and MICROWIRE.
  • Optional write protection is provided by connecting a write protect port of the integrated 25 circuit 220 to an electrode 234 of the write-protect electrode set 230.
  • Electrode 232 of the electrode set 230 is simply device ground.
  • electrode 232 is shorted to electrode 234 using, for example, a conductive adhesive dot. If preferred, other electrode arrangements may be used, including arrangements suitable for being shorted with a conductive edge clip or an integrated mechanical switch.
  • the person's fingers touch the ESD ring 240 and the ESD ring 240 in turn becomes electrically proximate a grounded portion of the host device or the socket, most likely the envelope 330, thereby discharging the electrostatic potential harmlessly. If the person improperly grasps the digital media device 200 near the middle so as to be near to or touch one of the pads of the contact pad array 210, the presence of the ESD ring 240 near the contact pad array results in the ring 240 being touched even as the pads of the contact pad array 240 are touched, again ensuring that the electrostatic potential is harmlessly discharged. If desired, the ESD ring 240 may be extended to skirt the three sides of the contact pad array 210 away from the leading edge of the digital media device 200.
  • the digital media device 200 is fabricated using surface mount techniques standard in the industry.
  • Digital media devices 110 and 120 of Figure 1 also are illustrative of surface mount techniques.
  • the printed circuit board illustratively is an industry standard FR4 glass substrate copper clad board on which numerous digital media device substrates such as the substrate 202 are formed.
  • Other suitable materials for the printed circuit board is plastic, fiberglass, ceramic, PVC, PVCA, or any suitable rigid or semi-rigid, non-conductive, and durable material. Separation regions (not shown) are defined on both of the major surfaces of the printed circuit board using well know photolithographic techniques to delineate the substrates for each digital media device, including the substrate 202 for the digital media device 200.
  • gutters are defined in the copper layers on both of the major surfaces using well know photolithographic techniques to create various traces and vias, the contact pad array 210, the write-protect electrode set 230, and surface mount contact sets 410, 412, 414 and 416.
  • the width of the gutters is 0.2 mm, although other gutter widths are suitable as well.
  • the copper material remaining on the major surfaces of the printed circuit board forms two ground planes 400 and 500, as shown in Figure 4 and Figure 5. If the traces isolate any large copper regions from the ground plane (none shown), additional traces are included to connect the isolated regions to the ground plane.
  • insulating layer are formed on both major surfaces of the printed circuit board, including the substrate 202, to act as a solder mask and intermetal dielectric; one of these layers, insulating layer 250, is shown in Figure 2.
  • a suitable material is industry-standard insulating black solder mask, which is a photo-imaging polymer. However, any material that is heat resistant and a good insulator, that has good moisture resistance and wear resistance, and is capable of defining a pattern is suitable. While photo-imaging material is preferred because of its resolution properties, material that is applied using screening techniques are suitable in certain applications.
  • the printed circuit board is gold plated using well known techniques to create highly conductive and corrosion-resistant surfaces on the pads 211-218, the write-protect electrode set 230, the surface mount contact sets 410, 412, 414 and 416, and the ESD ring 240. While the copper features on the substrate 202 may also be gold plated prior to application of the solder mask, doing so would incur greater fabrication expense.
  • the integrated circuit 220 is mounted on the substrate 202, and identical integrated circuits are mounted on the other substrates formed on the printed circuit board, using well known surface mount techniques, which essentially involves placing dabs of solder on the contacts of the surface mount contact sets 410, 412, 414 and 416, and holding the integrated circuit 220 in place while reflowing the solder using, for example, an infrared reflow technique.
  • the integrated circuit 220 may be packaged in any convenient manner, low profile plastic dual flat pack packaging is preferred. While only a single integrated circuit is shown in Figure 2, multiple integrated circuits (not shown) may be used if desired, and may be mounted on opposite sides of the substrate 202 or, if space permits, on the same side of the substrate 202.
  • Well known surface mount techniques include protecting the surface mount contact sets 410, 412, 414 and 416 by applying a protective label, plastic epoxy material, or plastic frame around the edge of the integrated circuit 220.
  • a suitable label is made of paper with a plastic laminate or UV finish, although mylar and other well known label material are also suitable.
  • the result digital media device 200 is shown in Figure 2.
  • a suitable encasing material (not shown) may be placed about the integrated circuits 220 to provide protection and a gripping surface for manual handling of the digital media device 200.
  • the encasing material may encase the entire end of the digital media device, as shown by the digital media device 110 ( Figure 1), in which event the encasing material preferably is provided with a conductive surface portion electrically connected to the ESD ring 240.
  • the encasing material may be localized about the integrated circuit 220 as shown by the digital media device 120 ( Figure 1) so as to leave the long edges of the digital media device uncovered so that the ESD ring 240 remains fully exposed and the digital media device 120 may be inserted fully into a slot via edge guides (not shown).
  • COB Chip on Board
  • COB techniques include a chip-on-board modular technique, of which the digital media devices 130, 140 and 150 of Figure 1 are illustrative, and a chip-on-board direct technique, of which the digital media device 160 of Figure 1 are illustrative.
  • the COB techniques are advantageous in that they are particularly inexpensive.
  • the COB modular technique involves milling a cavity in a body for receiving a memory integrated circuit die.
  • the body may be made of laminated sheets, with the cavity being obtained by stamping out portions of some of the sheets.
  • the integrated circuit die is attached to a substrate, which contains a contact pad array on the other side.
  • the substrate is made of any suitable preferably insulative material such as plastic, fiberglass, ceramic, PVC, PVCA, FR4, or any suitable rigid or semi-rigid, non-conductive, and durable material.
  • a conductive material may be used provided insulative structures are provided where necessary for proper electrical operation. Wire bonds electrically connect bonding pads on the die to conductive material that fills vias underlying the contact pads of the contact pad array. Suitable electrically conductive material for the vias and techniques for filling the vias are well known in the art. A mass of epoxy, plastic or other suitable encapsulation material is placed over the die and the wire bonds to protect these elements.
  • the body is made of similar material as the substrate or, alternatively, a more flexible material or a thinner sheet of rigid or semi-rigid material in the event that the substrate, the encapsulation material, or both provide sufficient rigidity so that the die and the wire bonds do not fail due to mechanical stress during normal use.
  • One or more than one die may be mounted in a digital media device using this technique. Since the COB techniques do not involve etching a copper plate, an ESD ring and preferably an associated ground plane are provided using other techniques.
  • One suitable technique involves the use of a metalized adhesive-backed label (not shown) which when applied to a digital media device, exposes the contact pad array through a window but otherwise covers one or preferably both of the surfaces of the digital media device.
  • the label preferably is metalized throughout and has an exposed preferably gold-plated ESD ring through its periphery.
  • the surface of the interior region need not be conductive, and may include nonconductive markings for advertising or surface material suitable for user notes.
  • the body of the digital media device may be doped with a conductive material, or coated with a conductive ink.
  • the ESD ring may be an embedded trace on one or both surfaces, or a conductive trace or cladding on the edge of the digital media device. Moreover, these techniques may be used separately or in combination.
  • the digital media devices of the family 100 have numerous applications due to their various advantageous properties, which include good ESD protection, the ability to be inserted and removed frequently, easily, and in a fool-proof manner, a small and convenient size and form factor, a high memory capacity, non-volatile storage, low power consumption, low voltage operation, and general durability.
  • the digital media devices of the family 100 is useful in communications, consumer, office, desktop publishing, portable computing, and industrial applications.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention porte sur des dispositifs supports de données portatifs pouvant être branchés sur un ordinateur principal de sorte que ce dernier puisse y stocker ou y extraire des données. Les facteurs de forme de ces dispositifs supports numériques sont compacts de façon à réduire le volume occupé par les dispositifs portables et faciliter l'insertion, le retrait et le stockage. Un dispositif support numérique (200) de l'invention comprend un plan de sol partiellement découvert de façon à former un anneau conducteur (240) sur la périphérie de la surface principale dans laquelle est disposée une matrice de pastilles de contact électrique. Ce dispositif comprend également un autre plan de sol partiellement découvert qui forme un second anneau conducteur sur la périphérie de l'autre surface principale de façon à protéger le dispositif des dommages occasionnés par les décharges électrostatiques.
PCT/US1997/019312 1996-11-15 1997-11-04 Protection contre les decharges electrostatiques pour supports numeriques WO1998021693A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU49985/97A AU4998597A (en) 1996-11-15 1997-11-04 Electrostatic discharge protection for digital media

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74679396A 1996-11-15 1996-11-15
US08/746,793 1996-11-15

Publications (1)

Publication Number Publication Date
WO1998021693A1 true WO1998021693A1 (fr) 1998-05-22

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ID=25002351

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/019312 WO1998021693A1 (fr) 1996-11-15 1997-11-04 Protection contre les decharges electrostatiques pour supports numeriques

Country Status (2)

Country Link
AU (1) AU4998597A (fr)
WO (1) WO1998021693A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005011537A1 (de) * 2004-12-24 2006-07-06 Fujitsu Ltd., Kawasaki Elektronisches Gerät und Gehäuse
DE102006061300A1 (de) * 2006-12-22 2008-06-26 Conti Temic Microelectronic Gmbh Elektrische Leiterplatte mit elektronischen Bauelementen und Mitteln zum Schutz vor elektrostatischer Entladung
CN105279096A (zh) * 2014-07-04 2016-01-27 群联电子股份有限公司 系统级封装结构与其电镀模块及存储器存储装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2533047A1 (fr) * 1982-09-09 1984-03-16 Sony Corp Carte a memoire avec un circuit integre incorpore
GB2248973A (en) * 1990-10-18 1992-04-22 Mitsubishi Electric Corp Portable type memory device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2533047A1 (fr) * 1982-09-09 1984-03-16 Sony Corp Carte a memoire avec un circuit integre incorpore
GB2248973A (en) * 1990-10-18 1992-04-22 Mitsubishi Electric Corp Portable type memory device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005011537A1 (de) * 2004-12-24 2006-07-06 Fujitsu Ltd., Kawasaki Elektronisches Gerät und Gehäuse
US7433184B2 (en) 2004-12-24 2008-10-07 Fujitsu Limited Electronic device and housing
US7646598B2 (en) 2004-12-24 2010-01-12 Fujitsu Limited Electronic device and housing
DE102006061300A1 (de) * 2006-12-22 2008-06-26 Conti Temic Microelectronic Gmbh Elektrische Leiterplatte mit elektronischen Bauelementen und Mitteln zum Schutz vor elektrostatischer Entladung
CN105279096A (zh) * 2014-07-04 2016-01-27 群联电子股份有限公司 系统级封装结构与其电镀模块及存储器存储装置
CN105279096B (zh) * 2014-07-04 2019-04-02 群联电子股份有限公司 系统级封装结构与其电镀模块及存储器存储装置

Also Published As

Publication number Publication date
AU4998597A (en) 1998-06-03

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