ES8205269A1 - Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal - Google Patents

Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal

Info

Publication number
ES8205269A1
ES8205269A1 ES503645A ES503645A ES8205269A1 ES 8205269 A1 ES8205269 A1 ES 8205269A1 ES 503645 A ES503645 A ES 503645A ES 503645 A ES503645 A ES 503645A ES 8205269 A1 ES8205269 A1 ES 8205269A1
Authority
ES
Spain
Prior art keywords
palladium dichloride
electroless plating
metallized
diacetonitrile
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES503645A
Other languages
English (en)
Other versions
ES503645A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Publication of ES8205269A1 publication Critical patent/ES8205269A1/es
Publication of ES503645A0 publication Critical patent/ES503645A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

PROCEDIMIENTO PARA LA ACTIVACION DE SUPERFICIES METALICAS Y NO METALICAS PARA LA PRECIPITACION SIN CORRIENTE DE METAL. CONSISTE EN HUMECTAR LA SUPERFICIE A METALIZAR CON UN COMPUESTO ORGANOMETALICO, TAL COMO COMPLEJOS DE ORO MONOVALENTE, DEL PALDIO DIVALENTE O DEL PLATINO CON OLOFINAS, REPARTIDO EN UN DISOLVENTE ORGANICO, SEPARAR EL DISOLVENTE ORGANICO Y REDUCIR EL COMPUESTO ORGANICO ADHERIDO A LA SUPERFICIE A METALIZAR. TIENE APLICACIONES PARA LA OBTENCION DE RECUBRIMIENTOS DE METAL SIN CORRIENTE.
ES503645A 1980-07-04 1981-07-03 Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal Granted ES503645A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803025307 DE3025307A1 (de) 1980-07-04 1980-07-04 Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung

Publications (2)

Publication Number Publication Date
ES8205269A1 true ES8205269A1 (es) 1982-06-01
ES503645A0 ES503645A0 (es) 1982-06-01

Family

ID=6106372

Family Applications (1)

Application Number Title Priority Date Filing Date
ES503645A Granted ES503645A0 (es) 1980-07-04 1981-07-03 Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal

Country Status (6)

Country Link
EP (1) EP0043485B1 (es)
JP (1) JPS5743977A (es)
AT (1) ATE13319T1 (es)
CA (1) CA1169720A (es)
DE (2) DE3025307A1 (es)
ES (1) ES503645A0 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3146235A1 (de) * 1981-11-21 1983-05-26 Bayer Ag, 5090 Leverkusen Selbstklebende metallisierte textile flaechenmaterialien
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
JPS58189365A (ja) * 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk 化学メッキ用アンダーコート組成物
DE3239090A1 (de) * 1982-10-22 1984-04-26 Bayer Ag, 5090 Leverkusen Schwarz-metallisierte substratoberflaechen
DE3242162A1 (de) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von verbundwerkstoffen
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
JPS6079604A (ja) * 1983-10-05 1985-05-07 株式会社村田製作所 ポリアクリロニトリル導電性フイルムの製造方法
DE3337941A1 (de) * 1983-10-19 1985-05-09 Bayer Ag, 5090 Leverkusen Passive radarreflektoren
DE3421123A1 (de) * 1984-06-07 1985-12-12 Bayer Ag, 5090 Leverkusen Verbundmaterial
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
EP0214097B1 (de) * 1985-08-23 1989-12-27 Ciba-Geigy Ag Mischung aus Olefin und Dibenzalaceton-Palladiumkomplex und deren Verwendung
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
DE3914726A1 (de) * 1989-05-04 1990-11-08 Deutsche Automobilgesellsch Vorrichtung zur chemischen metallisierung von offenporigen schaeumen, vliesstoffen, nadelfilzen aus kunststoff- oder textilmaterial
DE3938710A1 (de) * 1989-11-17 1991-05-23 Schering Ag Komplexverbindungen mit oligomerem bis polymerem charakter
DE4209708A1 (de) * 1992-03-25 1993-09-30 Bayer Ag Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten
DE4418016A1 (de) * 1994-05-24 1995-11-30 Wilfried Neuschaefer Nichtleiter-Metallisierung
US7166152B2 (en) 2002-08-23 2007-01-23 Daiwa Fine Chemicals Co., Ltd. Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
GB2395365B8 (en) * 2002-11-13 2006-11-02 Peter Leslie Moran Electrical circuit board
JP4605074B2 (ja) * 2006-03-31 2011-01-05 Ｔｄｋ株式会社 無電解めっき液及びセラミック電子部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT286058B (de) * 1968-01-09 1970-11-25 Photocircuits Corp Verfahren zur Vorbereitung von in geformtem oder ungeformtem Zustand vorliegenden Materialien, vorzugsweise von Isolierstoffen für die stromlose Metallisierung
DE2451217C2 (de) * 1974-10-29 1982-12-23 Basf Ag, 6700 Ludwigshafen Aktivierung von Substraten für die stromlose Metallisierung

Also Published As

Publication number Publication date
ATE13319T1 (de) 1985-06-15
EP0043485A1 (de) 1982-01-13
DE3170482D1 (en) 1985-06-20
DE3025307A1 (de) 1982-01-28
EP0043485B1 (de) 1985-05-15
JPS5743977A (en) 1982-03-12
ES503645A0 (es) 1982-06-01
CA1169720A (en) 1984-06-26
JPS6354791B2 (es) 1988-10-31

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970505