DE3170482D1 - Method of activating surfaces for electroless plating - Google Patents

Method of activating surfaces for electroless plating

Info

Publication number
DE3170482D1
DE3170482D1 DE8181104782T DE3170482T DE3170482D1 DE 3170482 D1 DE3170482 D1 DE 3170482D1 DE 8181104782 T DE8181104782 T DE 8181104782T DE 3170482 T DE3170482 T DE 3170482T DE 3170482 D1 DE3170482 D1 DE 3170482D1
Authority
DE
Germany
Prior art keywords
palladium dichloride
electroless plating
metallized
diacetonitrile
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181104782T
Other languages
German (de)
Inventor
Henning Dr Giesecke
Gerhard Dieter Dr Wolf
Harold Dr Ebneth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Priority to DE8181104782T priority Critical patent/DE3170482D1/en
Application granted granted Critical
Publication of DE3170482D1 publication Critical patent/DE3170482D1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

1. Process for activating metallic and non-metallic surfaces for the purpose of currentless metal deposition, characterized in that a) the surface to be metallized is wetted with an organometallic compound from the series comprising butadiene palladium dichloride, diacetonitrile palladium dichloride, diacetonitrile platinum dichloride and dibenzonitrile palladium dichloride, which compound is stable towards air and moisture and is dispersed in an organic solvent, b) the organic solvent is removed and c) the organometallic compound adhering to the surface to be metallized is reduced.
DE8181104782T 1980-07-04 1981-06-22 Method of activating surfaces for electroless plating Expired DE3170482D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8181104782T DE3170482D1 (en) 1980-07-04 1981-06-22 Method of activating surfaces for electroless plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19803025307 DE3025307A1 (en) 1980-07-04 1980-07-04 METHOD FOR ACTIVATING SURFACES FOR ELECTRIC METALLIZATION
DE8181104782T DE3170482D1 (en) 1980-07-04 1981-06-22 Method of activating surfaces for electroless plating

Publications (1)

Publication Number Publication Date
DE3170482D1 true DE3170482D1 (en) 1985-06-20

Family

ID=6106372

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19803025307 Withdrawn DE3025307A1 (en) 1980-07-04 1980-07-04 METHOD FOR ACTIVATING SURFACES FOR ELECTRIC METALLIZATION
DE8181104782T Expired DE3170482D1 (en) 1980-07-04 1981-06-22 Method of activating surfaces for electroless plating

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19803025307 Withdrawn DE3025307A1 (en) 1980-07-04 1980-07-04 METHOD FOR ACTIVATING SURFACES FOR ELECTRIC METALLIZATION

Country Status (6)

Country Link
EP (1) EP0043485B1 (en)
JP (1) JPS5743977A (en)
AT (1) ATE13319T1 (en)
CA (1) CA1169720A (en)
DE (2) DE3025307A1 (en)
ES (1) ES8205269A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3146235A1 (en) * 1981-11-21 1983-05-26 Bayer Ag, 5090 Leverkusen Self-adhering metallised textile sheet materials
DE3150985A1 (en) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
JPS58189365A (en) * 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk Composition for chemical plating
DE3239090A1 (en) * 1982-10-22 1984-04-26 Bayer Ag, 5090 Leverkusen BLACK METALIZED SUBSTRATE SURFACES
DE3242162A1 (en) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen METHOD FOR PRODUCING COMPOSITES
DE3324767A1 (en) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION
JPS6079604A (en) * 1983-10-05 1985-05-07 株式会社村田製作所 Method of producing polyacrylonitrile conductive film
DE3337941A1 (en) * 1983-10-19 1985-05-09 Bayer Ag, 5090 Leverkusen Passive radar reflectors
DE3421123A1 (en) * 1984-06-07 1985-12-12 Bayer Ag, 5090 Leverkusen COMPOSITE MATERIAL
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
DE3667800D1 (en) * 1985-08-23 1990-02-01 Ciba Geigy Ag MIXTURE OF OLEFIN AND DIBENZALACETONE-PALLADIUM COMPLEX AND THEIR USE.
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
JPH0826462B2 (en) * 1987-11-30 1996-03-13 龍徳 四十宮 Method for producing molded product of surface metallized polymer
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
DE3914726A1 (en) * 1989-05-04 1990-11-08 Deutsche Automobilgesellsch DEVICE FOR CHEMICALLY METALLIZING OPEN-POROUS FOAMS, FLEECE MATERIALS, NEEDLE FELTS MADE OF PLASTIC OR TEXTILE MATERIAL
DE3938710A1 (en) * 1989-11-17 1991-05-23 Schering Ag COMPLEX CONNECTIONS WITH OLIGOMEREM TO POLYMERIC CHARACTER
DE4209708A1 (en) * 1992-03-25 1993-09-30 Bayer Ag Process for improving the adhesive strength of electrolessly deposited metal layers
DE4418016A1 (en) * 1994-05-24 1995-11-30 Wilfried Neuschaefer Metallisation of articles made of non-conductive materials
US7166152B2 (en) 2002-08-23 2007-01-23 Daiwa Fine Chemicals Co., Ltd. Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
GB2395365B8 (en) * 2002-11-13 2006-11-02 Peter Leslie Moran Electrical circuit board
JP4605074B2 (en) * 2006-03-31 2011-01-05 Ｔｄｋ株式会社 Electroless plating solution and method for manufacturing ceramic electronic component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT286058B (en) * 1968-01-09 1970-11-25 Photocircuits Corp Process for preparing materials in a molded or unshaped state, preferably insulating materials for electroless metallization
DE2451217C2 (en) * 1974-10-29 1982-12-23 Basf Ag, 6700 Ludwigshafen Activation of substrates for electroless metallization

Also Published As

Publication number Publication date
ES503645A0 (en) 1982-06-01
JPS6354791B2 (en) 1988-10-31
EP0043485B1 (en) 1985-05-15
JPS5743977A (en) 1982-03-12
CA1169720A (en) 1984-06-26
EP0043485A1 (en) 1982-01-13
ES8205269A1 (en) 1982-06-01
DE3025307A1 (en) 1982-01-28
ATE13319T1 (en) 1985-06-15

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee