JPS56169791A - Plating method - Google Patents

Plating method

Info

Publication number
JPS56169791A
JPS56169791A JP7260780A JP7260780A JPS56169791A JP S56169791 A JPS56169791 A JP S56169791A JP 7260780 A JP7260780 A JP 7260780A JP 7260780 A JP7260780 A JP 7260780A JP S56169791 A JPS56169791 A JP S56169791A
Authority
JP
Japan
Prior art keywords
rack
studds
workpiece
board
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7260780A
Other languages
Japanese (ja)
Other versions
JPS5742717B2 (en
Inventor
Yoshiaki Washio
Takanori Motoyama
Isamu Sakai
Yoji Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Mazda Motor Corp
Toyo Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mazda Motor Corp, Toyo Kogyo Co Ltd filed Critical Mazda Motor Corp
Priority to JP7260780A priority Critical patent/JPS56169791A/en
Publication of JPS56169791A publication Critical patent/JPS56169791A/en
Publication of JPS5742717B2 publication Critical patent/JPS5742717B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To plate a workpiece except its surface part in a certain distance from its one end, by hanging the workpiece to be plated while attracting its top end at an unplated side onto a magnet member, and surrounding a required part with a cover to form an air reservoir when the workpiece is dipped in a plating bath.
CONSTITUTION: The ball part 6a of a ball studd 6 is magnetically attracted onto a magnet member 3 arranged under the rack board 2 of a plating rack 1, and the studd 6 is hung from the rack board 2. Each rack board 2 hanging a plurality of studds 6, 6,... is horizontally transversely suspended between arms 12, 12 of the rack 1 horizontally opposing together, in a manner such that the top end (a contact for current supply) of each arm 12 comes in contact with the under surface of the rack board 2 positioning in a space 10, 10. Thereafter, the whole of the rack 1 is held vertically and dipped in a plating solution 13. During the dipping, each space 8, 10 acts as an air reservoir to inhibit the invasion of the solution 13. Under this condition, a current is supplied through the rack 1, the arms 12 and the rack boards 2 to the studds 6, and the studds are consequently electroplated.
COPYRIGHT: (C)1981,JPO&Japio
JP7260780A 1980-05-29 1980-05-29 Plating method Granted JPS56169791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7260780A JPS56169791A (en) 1980-05-29 1980-05-29 Plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7260780A JPS56169791A (en) 1980-05-29 1980-05-29 Plating method

Publications (2)

Publication Number Publication Date
JPS56169791A true JPS56169791A (en) 1981-12-26
JPS5742717B2 JPS5742717B2 (en) 1982-09-10

Family

ID=13494241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7260780A Granted JPS56169791A (en) 1980-05-29 1980-05-29 Plating method

Country Status (1)

Country Link
JP (1) JPS56169791A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0690151A3 (en) * 1994-06-08 1998-11-11 Mtu Motoren- Und Turbinen-Union MàœNchen Gmbh Electrode for electroplating components
KR100882596B1 (en) 2007-05-31 2009-02-12 주식회사 에스엠월드 Plating apparatus having a fixing mean using magnetic force
KR100995926B1 (en) 2008-10-01 2010-11-23 서병인 Coating apparatus of ferrite core electrode terminal for inductor and method for coating thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0690151A3 (en) * 1994-06-08 1998-11-11 Mtu Motoren- Und Turbinen-Union MàœNchen Gmbh Electrode for electroplating components
KR100882596B1 (en) 2007-05-31 2009-02-12 주식회사 에스엠월드 Plating apparatus having a fixing mean using magnetic force
KR100995926B1 (en) 2008-10-01 2010-11-23 서병인 Coating apparatus of ferrite core electrode terminal for inductor and method for coating thereof

Also Published As

Publication number Publication date
JPS5742717B2 (en) 1982-09-10

Similar Documents

Publication Publication Date Title
US5788829A (en) Method and apparatus for controlling plating thickness of a workpiece
KR890002623B1 (en) Method for electroplating non-metallic surfaces
ZA896403B (en) Plating
HUT46083A (en) Process and equipment for electroplating copper foil
DE3170482D1 (en) Method of activating surfaces for electroless plating
GB2067595B (en) Method and apparatus for replenishing an electroplating bath with metal to be deposited
GB1534429A (en) Silver plating electrolyte
JPS56169791A (en) Plating method
KR830002066A (en) How to remove copper ions from baths containing copper ions
ES2057445T3 (en) PROCESS AND APPARATUS FOR COPPERING ON ELECTRODES.
EP0294235A3 (en) Apparatus for continuously producing a base for a printed circuit board
IL82764A0 (en) Selective plating process for the electrolytic coating of circuit boards
DE20200554U1 (en) Nozzle for a soldering device
GB1300304A (en) Electroplated solder
JPS56119792A (en) Electroplating method
JPS6216266Y2 (en)
GB907950A (en) Electro-plating thin wire
JPS59129878U (en) Printed circuit board electroplating equipment
SU1222715A1 (en) Device for electrochemical machining of workpieces
JPS56169764A (en) Device for electroless copper plating
Karustis Palladium Electroplating Bath and Process for Plating
JPS556470A (en) One side hot dipping method
JPS59129877U (en) Electroplating equipment parts for printed circuit boards
JPS54149332A (en) Plating apparatus
ES8206670A1 (en) Composition and method for electrodeposition of black nickel