JPS56169764A - Device for electroless copper plating - Google Patents

Device for electroless copper plating

Info

Publication number
JPS56169764A
JPS56169764A JP7181980A JP7181980A JPS56169764A JP S56169764 A JPS56169764 A JP S56169764A JP 7181980 A JP7181980 A JP 7181980A JP 7181980 A JP7181980 A JP 7181980A JP S56169764 A JPS56169764 A JP S56169764A
Authority
JP
Japan
Prior art keywords
tank
solution
replenishing
plating
stirrer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7181980A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Tsuru
Takeshi Enokido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7181980A priority Critical patent/JPS56169764A/en
Publication of JPS56169764A publication Critical patent/JPS56169764A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To enable the titled device to be operated continuously for a long period of time by a method wherein a plating tank consisting of a main tank and a replenishing solution adding tank which is separated or partitioned from the main tank and is provided with a stirrer, and the plating solution is circulated between the two tanks.
CONSTITUTION: The plating tank consists of the main tank 1 for containing a body to be plated and the replenishing solution adding tank 12 which is separated from the main tank 1 and is provided with the stirrer 10, and the plating solution is circulated between the two tanks by a circulating pump 3. The replenishing solution is supplied into the tank 12 from a replenishing solution reservoir 7 above the plating solution in the tank 12 by a replenishing solution adding tank 5, and it is preferable to provide a defoaming device at the position where the replenishing tank falls into the plating solution in the tank 12. The replenishing solution thus fallen into the plating solution is stirred by the stirrer 10 to form a uniform liquid mixture.
COPYRIGHT: (C)1981,JPO&Japio
JP7181980A 1980-05-28 1980-05-28 Device for electroless copper plating Pending JPS56169764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7181980A JPS56169764A (en) 1980-05-28 1980-05-28 Device for electroless copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7181980A JPS56169764A (en) 1980-05-28 1980-05-28 Device for electroless copper plating

Publications (1)

Publication Number Publication Date
JPS56169764A true JPS56169764A (en) 1981-12-26

Family

ID=13471536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7181980A Pending JPS56169764A (en) 1980-05-28 1980-05-28 Device for electroless copper plating

Country Status (1)

Country Link
JP (1) JPS56169764A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243181A (en) * 1985-04-19 1986-10-29 Hitachi Ltd Chemical copper plating device
US4967690A (en) * 1986-02-10 1990-11-06 International Business Machines Corporation Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
JPH02298273A (en) * 1989-05-10 1990-12-10 Hitachi Aic Inc Mixer for electroless plating solution
US20130143060A1 (en) * 2011-12-06 2013-06-06 Alan J. Jacobsen Net-shape structure with micro-truss core

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243181A (en) * 1985-04-19 1986-10-29 Hitachi Ltd Chemical copper plating device
JPH0568550B2 (en) * 1985-04-19 1993-09-29 Hitachi Ltd
US4967690A (en) * 1986-02-10 1990-11-06 International Business Machines Corporation Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
JPH02298273A (en) * 1989-05-10 1990-12-10 Hitachi Aic Inc Mixer for electroless plating solution
US20130143060A1 (en) * 2011-12-06 2013-06-06 Alan J. Jacobsen Net-shape structure with micro-truss core
US9539773B2 (en) * 2011-12-06 2017-01-10 Hrl Laboratories, Llc Net-shape structure with micro-truss core
US10288359B2 (en) 2011-12-06 2019-05-14 Hrl Laboratories, Llc Net-shape structure with micro-truss core

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