JPS5711768A - Method for control of solder vessel - Google Patents

Method for control of solder vessel

Info

Publication number
JPS5711768A
JPS5711768A JP8711780A JP8711780A JPS5711768A JP S5711768 A JPS5711768 A JP S5711768A JP 8711780 A JP8711780 A JP 8711780A JP 8711780 A JP8711780 A JP 8711780A JP S5711768 A JPS5711768 A JP S5711768A
Authority
JP
Japan
Prior art keywords
solder
tin
vessel
tin content
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8711780A
Other languages
Japanese (ja)
Inventor
Hideo Goto
Masatoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP8711780A priority Critical patent/JPS5711768A/en
Publication of JPS5711768A publication Critical patent/JPS5711768A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE: To maintain the tin content of the molten solder in a solder vessel always ina correct range by replenishing tin or solder of a high tin content if the tin content is likely to lower below a correct in content.
CONSTITUTION: A hydrometer 1 is floated in a solder vessel, and whether the tin content of the solder 2 in said solder vessel is within a correct range or not is discriminated by whether a liquid surface 5 comes between the scale 3 of a lower limit marked on the hydrometer and the scale 4 of an upper limit or not. If the surface 5 of the solder liquid comes between both scales 3 and 4, plating is allowed to carry out on a substrate without replenishment. If it does not, tin or solder of a high tin content is replenished into that solder vessel, and the replenishment is continued until the surface 5 comes between the scales 3 and 4.
COPYRIGHT: (C)1982,JPO&Japio
JP8711780A 1980-06-26 1980-06-26 Method for control of solder vessel Pending JPS5711768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8711780A JPS5711768A (en) 1980-06-26 1980-06-26 Method for control of solder vessel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8711780A JPS5711768A (en) 1980-06-26 1980-06-26 Method for control of solder vessel

Publications (1)

Publication Number Publication Date
JPS5711768A true JPS5711768A (en) 1982-01-21

Family

ID=13906001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8711780A Pending JPS5711768A (en) 1980-06-26 1980-06-26 Method for control of solder vessel

Country Status (1)

Country Link
JP (1) JPS5711768A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6699306B2 (en) * 2000-02-24 2004-03-02 Nihon Superior Sha Co., Ltd. Control method for copper density in a solder dipping bath

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6699306B2 (en) * 2000-02-24 2004-03-02 Nihon Superior Sha Co., Ltd. Control method for copper density in a solder dipping bath
AU782095B2 (en) * 2000-02-24 2005-06-30 Matsushita Electric Industrial Co., Ltd. A control method for copper content in a solder dipping bath

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