JPS56169763A - Device for electroless copper plating - Google Patents
Device for electroless copper platingInfo
- Publication number
- JPS56169763A JPS56169763A JP7181880A JP7181880A JPS56169763A JP S56169763 A JPS56169763 A JP S56169763A JP 7181880 A JP7181880 A JP 7181880A JP 7181880 A JP7181880 A JP 7181880A JP S56169763 A JPS56169763 A JP S56169763A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- plating
- replenishing
- plating solution
- feed pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To prevent the clogging of a tip end of a feed pipe for a replenishing solution, by a method wherein a circulating pipe for a plating solution and the feed pipe for intermittently feeding the replenishing solution into the plating solution through one end thereof opening into the plating solution are provided for a plating tank, and a liquid which does not cause a bursting reaction even upon contact with the plating solution or the replenishing solution is flowed into the feed pipe.
CONSTITUTION: The device for electroless copper plating is provided with the circulating pipe 2 for circulating the plating solution as required, and a supplying device 8, 5 for replenishing solution which has the feed pipe for replenishing solution 6 opening into the plating solution and which supplies the replenishing solution intermittently into the plating solution. The liquid which does not cause the bursting reaction even when contacted with the plating solution or the replenishing solution, e.g. water, is constantly flowed from a tank 15 into the feed pipe 6 by a pump 16 used for adding the replenishing solution. Namely, the replenishing solution is intermittently added to the water flowing constantly, and the mixture of both liquids is added into the plating solution.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7181880A JPS589150B2 (en) | 1980-05-28 | 1980-05-28 | Electroless copper plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7181880A JPS589150B2 (en) | 1980-05-28 | 1980-05-28 | Electroless copper plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56169763A true JPS56169763A (en) | 1981-12-26 |
| JPS589150B2 JPS589150B2 (en) | 1983-02-19 |
Family
ID=13471507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7181880A Expired JPS589150B2 (en) | 1980-05-28 | 1980-05-28 | Electroless copper plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS589150B2 (en) |
-
1980
- 1980-05-28 JP JP7181880A patent/JPS589150B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS589150B2 (en) | 1983-02-19 |
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