JPH02298273A - Mixer for electroless plating solution - Google Patents
Mixer for electroless plating solutionInfo
- Publication number
- JPH02298273A JPH02298273A JP11692789A JP11692789A JPH02298273A JP H02298273 A JPH02298273 A JP H02298273A JP 11692789 A JP11692789 A JP 11692789A JP 11692789 A JP11692789 A JP 11692789A JP H02298273 A JPH02298273 A JP H02298273A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- soln
- plating solution
- tank
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims description 8
- 238000007747 plating Methods 0.000 claims abstract description 60
- 239000000126 substance Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract 1
- 150000002739 metals Chemical group 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は無電解めっき液の混合ＶＡ置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a mixed VA system for electroless plating solutions.
（従来の技術）
めつき槽中において無電解銅めっき等のめつき処理を行
なう場合、めっき反応の進行とともに、めっき反応に必
要とする薬品が不足してくるために、その薬品を供給し
なければならない。また、めっき反応をより効率的にす
るためにはめつき液を所定の温度に加熱する必要がある
。(Prior art) When performing plating processing such as electroless copper plating in a plating tank, as the plating reaction progresses, the chemicals required for the plating reaction become insufficient, so the chemicals must be supplied. Must be. Furthermore, in order to make the plating reaction more efficient, it is necessary to heat the plating solution to a predetermined temperature.
そのために、従来の混合装置は第２図に示す通り、めっ
き槽２０の上部からポンプ２１によってめっき液を循環
用の配管２２の一端から吸り込んで流し、その途中でフ
ィルタ２３によって不純物を除去するとともに必要な薬
品を供給タンク２４から供給し、熱交換Ｗｌｊ２５によ
ってこのめっき液を加熱する。そして配管２２の他端は
めつき栖２０の下部からめつき槽２０の内部に導かれ、
その他端に設しブられた孔２６から新なめつき液をめつ
き槽２０内に供給する＠洛となっている。For this purpose, as shown in Fig. 2, the conventional mixing device uses a pump 21 to draw the plating solution from the top of the plating tank 20 through one end of the circulation pipe 22 and flows it through, and a filter 23 removes impurities along the way. At the same time, necessary chemicals are supplied from the supply tank 24, and the plating solution is heated by the heat exchanger Wlj25. The other end of the piping 22 is led into the plating tank 20 from the lower part of the plating tank 20,
A new plating solution is supplied into the plating tank 20 from a hole 26 provided at the other end.
（発明が解決しようとする課題）
しかし、従来の混合装置では、めつき槽２０内のめつき
液よりも高濃度のめつき液を熱交換器２５により加熱す
ることになるために、めつき槽２０内よりも反応が活発
になり、金属がより多く析出する。このめっき液中に析
出した金属は、無電解めっき反応の際に、めっき析出が
必要とされる箇所以外の箇所に付着し不良の原因となる
欠点がある。(Problem to be Solved by the Invention) However, in the conventional mixing device, since the plating liquid having a higher concentration than the plating liquid in the plating tank 20 is heated by the heat exchanger 25, The reaction becomes more active than in the tank 20, and more metal is deposited. The metal deposited in this plating solution has the disadvantage that it adheres to locations other than those where plating deposition is required during the electroless plating reaction, causing defects.
本発明の目的は、以上の欠点を改良し、めっき不良を防
止しつる無電解めっき液の混合装置を提供するものであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide an electroless plating solution mixing device that improves the above-mentioned drawbacks and prevents plating defects.
（課題を解決するための手段）
本発明は、上記の目的を達成するために、薬品供給用の
循環装置と、めっき液加熱用の循環装置とを別々に設け
ることを特徴とする無電解めっき液の混合＠置を提供す
るものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides electroless plating characterized in that a circulation device for supplying chemicals and a circulation device for heating a plating solution are provided separately. It provides mixing of liquids.
（作用）
薬品供給用の循環装置と、めっき液加熱用の循環装置と
を別々に設けているために、後者の循環装置を流れるめ
っき液中の薬品の濃度が簿く、めっき液は途中で加熱さ
れても金属の析出が少なくてすむ。(Function) Because the circulation device for supplying chemicals and the circulation device for heating the plating solution are provided separately, the concentration of chemicals in the plating solution flowing through the latter circulation device is low. Even when heated, there is less metal precipitation.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
第１図において、１はめつき槽である。２は、薬品供給
用の配管であり、一端３は二股に分かれてめっき槽の上
部の両端に配置され、他端４は７本に分かれてめりき槽
１の下部からめフき槽１内に互いに等間隔に導かれてい
る。５は配管２の途中に設けられた、必要な薬品を供給
するためのタンクである。６は、タンク５の次に配管２
の途中に設けられたポンプであり、めっき１ｆｉｌ内の
めつき液を配管２に吸い込むものである。７は、ポンプ
６の次に配管２の途中に設けられたフィルタであり、配
管２を流れるめっき液から不純物を除去するものである
。８は、配管２の他端に設けられた直径１０φ程度の孔
であり、１０個以上設けられている。薬品供給用の循環
装置は、配管２、タンク５、ポンプ６及びフィルタ７か
らなる。In FIG. 1, 1 is a plating tank. 2 is a chemical supply pipe; one end 3 is divided into two and placed at both ends of the upper part of the plating tank, and the other end 4 is divided into seven pipes and is connected from the bottom of the plating tank 1 into the cleaning tank 1. They are led at equal intervals from each other. 5 is a tank provided in the middle of the pipe 2 for supplying necessary chemicals. 6 is the pipe 2 next to the tank 5
This is a pump installed in the middle of the pipe 2, which sucks the plating solution in one fil of plating into the pipe 2. A filter 7 is provided in the middle of the pipe 2 after the pump 6, and is used to remove impurities from the plating solution flowing through the pipe 2. Reference numeral 8 denotes holes with a diameter of about 10φ provided at the other end of the pipe 2, and there are ten or more holes. The circulation device for supplying chemicals consists of a pipe 2, a tank 5, a pump 6, and a filter 7.
また、９は、めっき液循環用の配管であり、一端１０は
二股に分かれてめりき槽１の上部の両端に配置され、他
端１１は７本に分かれてめつき槽１の下部から配管２の
他端４に沿ってめつき槽１内に導かれている。１２は、
配管９の途中に設けられたポンプであり、めっき液を配
管９内に吸い上げるものである。１３は、ポンプ１２の
次に配管９の途中に設けられたフィルタである。１４は
、フィルタ１３の次に配管９の途中に設けられた熱交換
器であり、配管９内を流れるめっき液を所定の温度に加
熱するものである。１５は配管９の他端に設けられた直
径１０φ程度の孔であり、１０個以上設けられている。Further, 9 is a piping for circulating the plating solution, one end 10 is divided into two and placed at both ends of the upper part of the plating tank 1, and the other end 11 is divided into seven pipes and piped from the bottom of the plating tank 1. 2 is led into the plating bath 1 along the other end 4. 12 is
This pump is installed in the middle of the pipe 9 and sucks up the plating solution into the pipe 9. 13 is a filter provided in the middle of the piping 9 next to the pump 12. A heat exchanger 14 is provided in the middle of the pipe 9 after the filter 13, and is used to heat the plating solution flowing in the pipe 9 to a predetermined temperature. Reference numeral 15 denotes holes having a diameter of about 10φ provided at the other end of the pipe 9, and ten or more holes are provided.
めっき液加熱用の循環装置に、上記実施例の作用を述べ
る。配！！２には、ポンプ６によって吸い上げられため
つき液が流れる。そしてその吸い上げられためつき液に
はタンク５により薬品が供給され、次いでフィルタ７に
よりめっき液から不純物が除かれる。フィルタ７を通っ
ためつき液は配管２の他端に設けられた孔８からめつき
槽１に注入される。The operation of the above embodiment will be described with respect to the circulation device for heating the plating solution. Delivery! ! 2, the piling liquid sucked up by the pump 6 flows. A tank 5 supplies chemicals to the sucked up plating solution, and then a filter 7 removes impurities from the plating solution. The plating liquid that has passed through the filter 7 is injected into the plating tank 1 through a hole 8 provided at the other end of the pipe 2.
また、配′ｇ９には、ポンプ１２により吸い上げられた
めつき液が流れる。このめっき液は配管９を流れる途中
で、フィルタ１３により不純物が除去され、熱交換器１
４により所定の温度に加熱される。加熱されためつき液
は孔１５かうめつき槽１内に注入される。Further, the piling liquid sucked up by the pump 12 flows through the pipe g9. While this plating solution flows through the pipe 9, impurities are removed by the filter 13, and the plating solution is passed through the heat exchanger 1.
4 to a predetermined temperature. The heated matting liquid is injected into the mating tank 1 through the hole 15.
すなわち、配管２により必要な薬品を供給し、配管９に
よりめっき液を加熱しているために、配管９中において
析出する金属不純物を減少できる。That is, since necessary chemicals are supplied through the piping 2 and the plating solution is heated through the piping 9, metal impurities precipitated in the piping 9 can be reduced.
（発明の効果）
以上の通り、めっき液への薬品の供給と加熱とを別々の
配管を通して行なっているために、金属不純物の析出を
減少でき、めっき不良を低減しうる無電解めっき液の混
合装置を提供するものである。(Effects of the invention) As described above, since the supply of chemicals to the plating solution and the heating are performed through separate pipes, the precipitation of metal impurities can be reduced, and the mixing of electroless plating solutions can reduce plating defects. It provides equipment.
第１図は本発明の実施例の正面西面図、第２図は従来の
混合装置の正面断・面図を示す。
１・・・めっき槽、 ２．９・・・配管、５・・・タン
ク、 １４・・・熱交換器。FIG. 1 shows a front west view of an embodiment of the present invention, and FIG. 2 shows a front cross-sectional view of a conventional mixing device. 1... Plating tank, 2.9... Piping, 5... Tank, 14... Heat exchanger.
Claims (1)
所定の温度に加熱して循環する無電解めつき液の混合装
置において、薬品供給用の循環装置と、めつき液加熱用
の循環装置とを別々に設けることを特徴とする無電解め
つき液の混合装置。(1) In an electroless plating solution mixing device that supplies chemicals into a plating tank and heats the plating solution to a predetermined temperature and circulates it, there is a circulation device for supplying chemicals and a circulation device for heating the plating solution. 1. An electroless plating solution mixing device, characterized in that it is provided separately from a mixing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11692789A JPH02298273A (en) | 1989-05-10 | 1989-05-10 | Mixer for electroless plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11692789A JPH02298273A (en) | 1989-05-10 | 1989-05-10 | Mixer for electroless plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02298273A true JPH02298273A (en) | 1990-12-10 |
Family
ID=14699132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11692789A Pending JPH02298273A (en) | 1989-05-10 | 1989-05-10 | Mixer for electroless plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02298273A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06280033A (en) * | 1992-12-24 | 1994-10-04 | Matsushita Electric Works Ltd | Electroless plating method |
| JP2004084020A (en) * | 2002-08-27 | 2004-03-18 | Ebara Corp | Substrate treatment apparatus and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169764A (en) * | 1980-05-28 | 1981-12-26 | Hitachi Chem Co Ltd | Device for electroless copper plating |
-
1989
- 1989-05-10 JP JP11692789A patent/JPH02298273A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169764A (en) * | 1980-05-28 | 1981-12-26 | Hitachi Chem Co Ltd | Device for electroless copper plating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06280033A (en) * | 1992-12-24 | 1994-10-04 | Matsushita Electric Works Ltd | Electroless plating method |
| JP2004084020A (en) * | 2002-08-27 | 2004-03-18 | Ebara Corp | Substrate treatment apparatus and method |
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