JPS5743977A - Surface activation for non-electric metallization - Google Patents
Surface activation for non-electric metallizationInfo
- Publication number
- JPS5743977A JPS5743977A JP56103474A JP10347481A JPS5743977A JP S5743977 A JPS5743977 A JP S5743977A JP 56103474 A JP56103474 A JP 56103474A JP 10347481 A JP10347481 A JP 10347481A JP S5743977 A JPS5743977 A JP S5743977A
- Authority
- JP
- Japan
- Prior art keywords
- palladium dichloride
- surface activation
- metallized
- diacetonitrile
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Abstract
1. Process for activating metallic and non-metallic surfaces for the purpose of currentless metal deposition, characterized in that a) the surface to be metallized is wetted with an organometallic compound from the series comprising butadiene palladium dichloride, diacetonitrile palladium dichloride, diacetonitrile platinum dichloride and dibenzonitrile palladium dichloride, which compound is stable towards air and moisture and is dispersed in an organic solvent, b) the organic solvent is removed and c) the organometallic compound adhering to the surface to be metallized is reduced.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803025307 DE3025307A1 (en) | 1980-07-04 | 1980-07-04 | METHOD FOR ACTIVATING SURFACES FOR ELECTRIC METALLIZATION |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5743977A true JPS5743977A (en) | 1982-03-12 |
JPS6354791B2 JPS6354791B2 (en) | 1988-10-31 |
Family
ID=6106372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56103474A Granted JPS5743977A (en) | 1980-07-04 | 1981-07-03 | Surface activation for non-electric metallization |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0043485B1 (en) |
JP (1) | JPS5743977A (en) |
AT (1) | ATE13319T1 (en) |
CA (1) | CA1169720A (en) |
DE (2) | DE3025307A1 (en) |
ES (1) | ES8205269A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079604A (en) * | 1983-10-05 | 1985-05-07 | 株式会社村田製作所 | Method of producing polyacrylonitrile conductive film |
US5183611A (en) * | 1987-11-30 | 1993-02-02 | Nisshinbo Industries, Inc. | Method of producing polymer article having metallized surface |
JP2007270301A (en) * | 2006-03-31 | 2007-10-18 | Tdk Corp | Electroless plating solution, and ceramic electronic component manufacturing method |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3146235A1 (en) * | 1981-11-21 | 1983-05-26 | Bayer Ag, 5090 Leverkusen | Self-adhering metallised textile sheet materials |
DE3150985A1 (en) * | 1981-12-23 | 1983-06-30 | Bayer Ag, 5090 Leverkusen | METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION |
JPS58189365A (en) * | 1982-04-28 | 1983-11-05 | Okuno Seiyaku Kogyo Kk | Composition for chemical plating |
DE3239090A1 (en) * | 1982-10-22 | 1984-04-26 | Bayer Ag, 5090 Leverkusen | BLACK METALIZED SUBSTRATE SURFACES |
DE3242162A1 (en) * | 1982-11-13 | 1984-05-17 | Bayer Ag, 5090 Leverkusen | METHOD FOR PRODUCING COMPOSITES |
DE3324767A1 (en) * | 1983-07-08 | 1985-01-17 | Bayer Ag, 5090 Leverkusen | METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION |
DE3337941A1 (en) * | 1983-10-19 | 1985-05-09 | Bayer Ag, 5090 Leverkusen | Passive radar reflectors |
DE3421123A1 (en) * | 1984-06-07 | 1985-12-12 | Bayer Ag, 5090 Leverkusen | COMPOSITE MATERIAL |
US4668533A (en) * | 1985-05-10 | 1987-05-26 | E. I. Du Pont De Nemours And Company | Ink jet printing of printed circuit boards |
EP0214097B1 (en) * | 1985-08-23 | 1989-12-27 | Ciba-Geigy Ag | Mixture of an olefin and dibenzal acetone palladium complex and its use |
US5182135A (en) * | 1986-08-12 | 1993-01-26 | Bayer Aktiengesellschaft | Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
US5200272A (en) * | 1988-04-29 | 1993-04-06 | Miles Inc. | Process for metallizing substrate surfaces |
US5238702A (en) * | 1988-10-27 | 1993-08-24 | Henning Giesecke | Electrically conductive patterns |
DE3914726A1 (en) * | 1989-05-04 | 1990-11-08 | Deutsche Automobilgesellsch | DEVICE FOR CHEMICALLY METALLIZING OPEN-POROUS FOAMS, FLEECE MATERIALS, NEEDLE FELTS MADE OF PLASTIC OR TEXTILE MATERIAL |
DE3938710A1 (en) * | 1989-11-17 | 1991-05-23 | Schering Ag | COMPLEX CONNECTIONS WITH OLIGOMEREM TO POLYMERIC CHARACTER |
DE4209708A1 (en) * | 1992-03-25 | 1993-09-30 | Bayer Ag | Process for improving the adhesive strength of electrolessly deposited metal layers |
DE4418016A1 (en) * | 1994-05-24 | 1995-11-30 | Wilfried Neuschaefer | Metallisation of articles made of non-conductive materials |
US7166152B2 (en) | 2002-08-23 | 2007-01-23 | Daiwa Fine Chemicals Co., Ltd. | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method |
GB2395365B8 (en) * | 2002-11-13 | 2006-11-02 | Peter Leslie Moran | Electrical circuit board |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT286058B (en) * | 1968-01-09 | 1970-11-25 | Photocircuits Corp | Process for preparing materials in a molded or unshaped state, preferably insulating materials for electroless metallization |
DE2451217C2 (en) * | 1974-10-29 | 1982-12-23 | Basf Ag, 6700 Ludwigshafen | Activation of substrates for electroless metallization |
-
1980
- 1980-07-04 DE DE19803025307 patent/DE3025307A1/en not_active Withdrawn
-
1981
- 1981-06-22 AT AT81104782T patent/ATE13319T1/en not_active IP Right Cessation
- 1981-06-22 EP EP81104782A patent/EP0043485B1/en not_active Expired
- 1981-06-22 DE DE8181104782T patent/DE3170482D1/en not_active Expired
- 1981-07-02 CA CA000380974A patent/CA1169720A/en not_active Expired
- 1981-07-03 ES ES503645A patent/ES8205269A1/en not_active Expired
- 1981-07-03 JP JP56103474A patent/JPS5743977A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079604A (en) * | 1983-10-05 | 1985-05-07 | 株式会社村田製作所 | Method of producing polyacrylonitrile conductive film |
JPH0379801B2 (en) * | 1983-10-05 | 1991-12-20 | Murata Manufacturing Co | |
US5183611A (en) * | 1987-11-30 | 1993-02-02 | Nisshinbo Industries, Inc. | Method of producing polymer article having metallized surface |
JP2007270301A (en) * | 2006-03-31 | 2007-10-18 | Tdk Corp | Electroless plating solution, and ceramic electronic component manufacturing method |
JP4605074B2 (en) * | 2006-03-31 | 2011-01-05 | Tdk株式会社 | Electroless plating solution and method for manufacturing ceramic electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPS6354791B2 (en) | 1988-10-31 |
ES503645A0 (en) | 1982-06-01 |
DE3170482D1 (en) | 1985-06-20 |
CA1169720A (en) | 1984-06-26 |
ES8205269A1 (en) | 1982-06-01 |
EP0043485B1 (en) | 1985-05-15 |
EP0043485A1 (en) | 1982-01-13 |
DE3025307A1 (en) | 1982-01-28 |
ATE13319T1 (en) | 1985-06-15 |
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