ES8104430A1 - Procedimiento para depositar estano quimicamente sobre una superficie catalitica - Google Patents

Procedimiento para depositar estano quimicamente sobre una superficie catalitica

Info

Publication number
ES8104430A1
ES8104430A1 ES486519A ES486519A ES8104430A1 ES 8104430 A1 ES8104430 A1 ES 8104430A1 ES 486519 A ES486519 A ES 486519A ES 486519 A ES486519 A ES 486519A ES 8104430 A1 ES8104430 A1 ES 8104430A1
Authority
ES
Spain
Prior art keywords
bath
substrates
depositing tin
tin
electroless depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES486519A
Other languages
English (en)
Other versions
ES486519A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES8104430A1 publication Critical patent/ES8104430A1/es
Publication of ES486519A0 publication Critical patent/ES486519A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Abstract

PROCEDIMIENTO PARA DEPOSITAR ESTAÑO QUIMICAMENTE SOBRE OBJETOS QUETIENEN UNA SUPERFICIE CATALITICA. SE REALIZA POR INMERSION DE LOS OBJETOS EN UN BAÑO COMPUESTO DE UNA SOLUCION ALCALINA QUE TIENE UN PH SUPERIOR A 14; DE UNA SAL ESTANNOSA CUYA CANTIDAD NO ES INFERIOR A 0,20 MOLES/LITRO, PERO CON PREFERENCIA DE 1 MOL/LITRO. EL TIEMPO DE INMERSION ESTA COMPRENDIDO ENTRE 30 MINUTOS Y 5 HORAS, DE MODO QUE SE DEPOSITE UNA CAPA DE ESTAÑO DE, AL MENOS, 0,4 MG. DE ESTAÑO POR CM CUBICO. LA TEMPERATURA DEL BAÑO ESTA COMPRENDIDA ENTRE 75 Y 90 GRADOS. PARA AUMENTAR LA SOLUBILIDAD DE LA SAL ESTANNOSA, AL BAÑO SE LE AÑADEN AGENTES FORMADORES DE COMPLEJOS, TALES COMO SALES POTASICAS O SOLIDAS DE ACIDOS CARBOXILICOS, Y TAMBIEN DISOLVENTES CON LA MISMA FINALIDAD, TALES COMO ETILENGLICOLES, GLICERINA O POLETILENGLICOLES.
ES486519A 1978-12-04 1979-12-01 Procedimiento para depositar estano quimicamente sobre una superficie catalitica Granted ES486519A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7811816,A NL184695C (nl) 1978-12-04 1978-12-04 Bad voor het stroomloos neerslaan van tin op substraten.

Publications (2)

Publication Number Publication Date
ES8104430A1 true ES8104430A1 (es) 1981-04-16
ES486519A0 ES486519A0 (es) 1981-04-16

Family

ID=19831991

Family Applications (1)

Application Number Title Priority Date Filing Date
ES486519A Granted ES486519A0 (es) 1978-12-04 1979-12-01 Procedimiento para depositar estano quimicamente sobre una superficie catalitica

Country Status (12)

Country Link
US (1) US4269625A (es)
JP (1) JPS5579864A (es)
AT (1) AT364890B (es)
CA (1) CA1124008A (es)
DE (1) DE2947821A1 (es)
ES (1) ES486519A0 (es)
FI (1) FI66026C (es)
FR (1) FR2443512A1 (es)
GB (1) GB2039534B (es)
IT (1) IT1126457B (es)
NL (1) NL184695C (es)
SE (1) SE445744B (es)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508601A (en) * 1982-09-07 1985-04-02 Toyo Kohan Co., Ltd. Process for producing a thin tin and zinc plated steel sheet
NL8403033A (nl) * 1984-10-05 1986-05-01 Philips Nv Werkwijze voor het autokatalytisch vertinnen van voorwerpen van koper of een koperlegering.
IL85555A (en) * 1988-02-25 1991-11-21 Bromine Compounds Ltd Method and medium for the coating of metals with tin
NO304746B1 (no) * 1989-05-04 1999-02-08 Ad Tech Holdings Ltd Gjenstand som motstÕr mikrobiologisk vekst bestÕende av et ikke-ledende subtrat som er belagt med et trat som er belagt medfremgangsmate for a avsette
WO1993025060A1 (en) * 1992-06-02 1993-12-09 Ibiden Co., Ltd. Solder-precoated wiring board and method for manufacturing the same
US5562950A (en) * 1994-03-24 1996-10-08 Novamax Technologies, Inc. Tin coating composition and method
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
WO2004073890A1 (en) * 1999-04-22 2004-09-02 Demaso Arthur J Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards
US6838114B2 (en) * 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6821347B2 (en) 2002-07-08 2004-11-23 Micron Technology, Inc. Apparatus and method for depositing materials onto microelectronic workpieces
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US6818249B2 (en) * 2003-03-03 2004-11-16 Micron Technology, Inc. Reactors, systems with reaction chambers, and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7282239B2 (en) * 2003-09-18 2007-10-16 Micron Technology, Inc. Systems and methods for depositing material onto microfeature workpieces in reaction chambers
US7323231B2 (en) * 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7647886B2 (en) * 2003-10-15 2010-01-19 Micron Technology, Inc. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) * 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US7584942B2 (en) * 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US7156470B1 (en) * 2004-06-28 2007-01-02 Wright James P Wheel trim hub cover
US20060237138A1 (en) * 2005-04-26 2006-10-26 Micron Technology, Inc. Apparatuses and methods for supporting microelectronic devices during plasma-based fabrication processes
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
FI123373B (fi) * 2008-06-06 2013-03-15 Outotec Oyj Tiivistyslaite
FI122225B (fi) 2009-08-04 2011-10-14 Outotec Oyj Tiivistyslaite
WO2012030566A2 (en) 2010-09-03 2012-03-08 Omg Electronic Chemicals, Llc Electroless nickel alloy plating bath and process for depositing thereof
CN102925878B (zh) * 2012-10-25 2014-09-24 南京大地冷冻食品有限公司 一种常温化学锡镀液
FI124937B (fi) 2012-12-20 2015-03-31 Outotec Oyj Tiivistyslaite
US10214823B2 (en) 2013-03-15 2019-02-26 United Technnologies Corporation Bimetallic zincating processing for enhanced adhesion of aluminum on aluminum alloys
US20150101935A1 (en) 2013-10-14 2015-04-16 United Technologies Corporation Apparatus and method for ionic liquid electroplating

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US921943A (en) * 1907-06-27 1909-05-18 Meaker Co Process for electrically coating with tin or allied metals.
CH284092A (de) * 1950-03-16 1952-07-15 Braunschweiger Huettenwerk Ges Verfahren zum Verzinnen der Lauffläche von Lagerschalen oder Lagerbüchsen.
US2822325A (en) * 1955-02-11 1958-02-04 Metal & Thermit Corp Process of, and composition for cleaning and tinning
US3072498A (en) * 1961-02-28 1963-01-08 Texaco Inc Method of tin plating copper
US3274021A (en) * 1962-04-27 1966-09-20 M & T Chemicals Inc Stannate coating bath and method of coating aluminum with tin
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3637386A (en) * 1967-05-02 1972-01-25 Philips Corp Metallizing solution for intensifying layers of metallic, imaged nuclei
US3616291A (en) * 1969-09-16 1971-10-26 Vulcan Materials Co Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
JPS54141341A (en) * 1978-04-26 1979-11-02 Shinko Electric Ind Co Nonelectrolytic tin plating solution

Also Published As

Publication number Publication date
FR2443512A1 (fr) 1980-07-04
IT1126457B (it) 1986-05-21
ATA761579A (de) 1981-04-15
NL7811816A (nl) 1980-06-06
JPS629670B2 (es) 1987-03-02
ES486519A0 (es) 1981-04-16
US4269625A (en) 1981-05-26
FI66026C (fi) 1984-08-10
FR2443512B1 (es) 1983-11-25
NL184695C (nl) 1989-10-02
GB2039534A (en) 1980-08-13
SE445744B (sv) 1986-07-14
FI66026B (fi) 1984-04-30
NL184695B (nl) 1989-05-01
SE7909906L (sv) 1980-06-05
GB2039534B (en) 1983-04-13
JPS5579864A (en) 1980-06-16
DE2947821A1 (de) 1980-06-19
CA1124008A (en) 1982-05-25
IT7927764A0 (it) 1979-11-30
AT364890B (de) 1981-11-25
DE2947821C2 (es) 1988-04-21
FI793761A (fi) 1980-06-05

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