GB1184123A - Process for Currentless Deposition of Copper Coatings - Google Patents

Process for Currentless Deposition of Copper Coatings

Info

Publication number
GB1184123A
GB1184123A GB1892168A GB1892168A GB1184123A GB 1184123 A GB1184123 A GB 1184123A GB 1892168 A GB1892168 A GB 1892168A GB 1892168 A GB1892168 A GB 1892168A GB 1184123 A GB1184123 A GB 1184123A
Authority
GB
United Kingdom
Prior art keywords
thio
sulphuric acid
ester
copper coatings
currentless deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1892168A
Inventor
Horst Burghardt
Siegfried Wagner
Helmut Walther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELEKTROGERAETEWERK GORNSDORF V
Original Assignee
ELEKTROGERAETEWERK GORNSDORF V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELEKTROGERAETEWERK GORNSDORF V filed Critical ELEKTROGERAETEWERK GORNSDORF V
Priority to GB1892168A priority Critical patent/GB1184123A/en
Publication of GB1184123A publication Critical patent/GB1184123A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1,184,123. Coating with copper. ELEKTROGER€TEWERK GORNSDORF VEB. April 22, 1968, No.18921/68. Heading C7F. An electroless copper plating bath contains a compound of the general formula:- R-S-SO 3 Me, where R is an aromatic, araliphatic or homo-or hetero-cyclo-aliphatic group and Me is an alkali metal, e. g. sodium salts of thio-sulphuric acid allyl ester, thio-sulphuric acid carboxy methyl ester, thio-sulphuric acid naphthoquinonyl ester, thio-sulphuric acid dioxyl naphthyl ester, and thio sulphuric acid-S-benzylester.
GB1892168A 1968-04-22 1968-04-22 Process for Currentless Deposition of Copper Coatings Expired GB1184123A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1892168A GB1184123A (en) 1968-04-22 1968-04-22 Process for Currentless Deposition of Copper Coatings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1892168A GB1184123A (en) 1968-04-22 1968-04-22 Process for Currentless Deposition of Copper Coatings

Publications (1)

Publication Number Publication Date
GB1184123A true GB1184123A (en) 1970-03-11

Family

ID=10120750

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1892168A Expired GB1184123A (en) 1968-04-22 1968-04-22 Process for Currentless Deposition of Copper Coatings

Country Status (1)

Country Link
GB (1) GB1184123A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
EP3467146A1 (en) * 2017-10-06 2019-04-10 Rohm and Haas Electronic Materials LLC Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) * 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN111621773A (en) * 2020-05-27 2020-09-04 广东东硕科技有限公司 Application of dithiocarbamate compounds in chemical palladium plating and chemical palladium plating composition

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
EP3467146A1 (en) * 2017-10-06 2019-04-10 Rohm and Haas Electronic Materials LLC Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN109628966A (en) * 2017-10-06 2019-04-16 罗门哈斯电子材料有限责任公司 Stablize electrodeless copper electroplating composition and method for electrodeless plating copper on substrate
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) * 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN109628966B (en) * 2017-10-06 2021-01-12 罗门哈斯电子材料有限责任公司 Stable electroless copper plating compositions and methods for electroless copper plating on substrates
CN111621773A (en) * 2020-05-27 2020-09-04 广东东硕科技有限公司 Application of dithiocarbamate compounds in chemical palladium plating and chemical palladium plating composition

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Legal Events

Date Code Title Description
PS Patent sealed