ES314564A2 - A procedure for the copper inelectric coating. (Machine-translation by Google Translate, not legally binding) - Google Patents

A procedure for the copper inelectric coating. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES314564A2
ES314564A2 ES0314564A ES314564A ES314564A2 ES 314564 A2 ES314564 A2 ES 314564A2 ES 0314564 A ES0314564 A ES 0314564A ES 314564 A ES314564 A ES 314564A ES 314564 A2 ES314564 A2 ES 314564A2
Authority
ES
Spain
Prior art keywords
inelectric
coating
translation
copper
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0314564A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US37747164 priority Critical patent/US3403035A/en
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES314564A2 publication Critical patent/ES314564A2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Abstract

Improvements introduced in the object of the main patent no. 266.074 by a procedure for the inelectric coating of copper, characterized in that to stabilize the autocatalytic metal coating solutions used to make non-electric metallic deposits on metallic or non-metallic surfaces, the addition is established to such solutions of a small effective amount of a cyanide compound, the amount of this cyanide compound being low enough to allow the operation of the bath. (Machine-translation by Google Translate, not legally binding)
ES0314564A 1964-06-24 1965-06-23 A procedure for the copper inelectric coating. (Machine-translation by Google Translate, not legally binding) Expired ES314564A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US37747164 US3403035A (en) 1964-06-24 1964-06-24 Process for stabilizing autocatalytic metal plating solutions

Publications (1)

Publication Number Publication Date
ES314564A2 true ES314564A2 (en) 1967-07-01

Family

ID=23489240

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0314564A Expired ES314564A2 (en) 1964-06-24 1965-06-23 A procedure for the copper inelectric coating. (Machine-translation by Google Translate, not legally binding)

Country Status (10)

Country Link
US (1) US3403035A (en)
AT (1) AT270330B (en)
BE (1) BE665911A (en)
CH (1) CH467342A (en)
DE (1) DE1521440B2 (en)
DK (1) DK129949C (en)
ES (1) ES314564A2 (en)
GB (1) GB1121282A (en)
NL (1) NL6508142A (en)
SE (1) SE316962B (en)

Families Citing this family (57)

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US3507681A (en) * 1967-06-02 1970-04-21 Mine Safety Appliances Co Metal plating of plastics
US3992211A (en) * 1968-07-15 1976-11-16 Trans-Metals Corporation Electroless plating composition
US3946126A (en) * 1968-11-22 1976-03-23 Rca Corporation Method of electroless nickel plating
US3547818A (en) * 1969-04-07 1970-12-15 Ventron Corp Alcoholic ionic compositions containing a metal selected from hg (ii),cu (ii),ag (i),cd (ii),ni (ii),zn (ii),and co (ii)
DE1920152B2 (en) * 1969-04-17 1975-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen
US3653953A (en) * 1970-01-26 1972-04-04 North American Rockwell Nonaqueous electroless plating
US3637472A (en) * 1970-03-16 1972-01-25 Ventron Corp Chemical plating baths containing an alkali metal cyanoborohydride
US3650708A (en) * 1970-03-30 1972-03-21 Hooker Chemical Corp Metal plating of substrates
US3645749A (en) * 1970-06-04 1972-02-29 Kollmorgen Corp Electroless plating baths with improved deposition rates
DE2028950B2 (en) * 1970-06-12 1976-05-13 electroless aqueous solution off from nickel, cobalt or alloys thereof
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions
US3893865A (en) * 1971-02-02 1975-07-08 Ppg Industries Inc Method for stabilizing a chemical filming composition
US3798050A (en) * 1971-05-28 1974-03-19 Ppg Industries Inc Catalytic sensitization of substrates for metallization
BE792310A (en) * 1971-12-08 1973-06-05 Kalle Ag Process for the copper layers deposited on castings polyimides
US3899617A (en) * 1973-07-19 1975-08-12 Enthone Process for conditioning ABS resin surface
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US3963842B1 (en) * 1974-06-20 1988-08-23
CA1093911A (en) * 1976-04-08 1981-01-20 George A. Butter Electroless copper plating
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4305997A (en) * 1977-06-06 1981-12-15 Surface Technology, Inc. Electrolessly metallized product of non-catalytic metal or alloy
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
JPS6018320B2 (en) * 1977-10-06 1985-05-09 Obata Sansho Kk
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
NL184695C (en) * 1978-12-04 1989-10-02 Philips Nv Bath for the streamless deposit of tin on substrates.
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
DE3152361A1 (en) * 1980-09-15 1983-01-13 Shipley Co Electroless alloy plating
DE3237394C2 (en) * 1982-10-08 1990-05-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
DE3622090C1 (en) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
JPH0331484A (en) * 1989-06-27 1991-02-12 Nippon Parkerizing Co Ltd Blackening treatment of zinc or zinc-based plating material
US5551994A (en) * 1990-05-17 1996-09-03 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5411606A (en) * 1990-05-17 1995-05-02 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5298092A (en) * 1990-05-17 1994-03-29 The Boeing Company Non-chromated oxide coating for aluminum substrates
US5472524A (en) * 1990-05-17 1995-12-05 The Boeing Company Non-chromated cobalt conversion coating method and coated articles
CA2087473C (en) * 1990-05-17 2001-10-16 Matthias P. Schriever Non-chromated oxide coating for aluminum substrates
US5468307A (en) * 1990-05-17 1995-11-21 Schriever; Matthias P. Non-chromated oxide coating for aluminum substrates
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation
US5873953A (en) * 1996-12-26 1999-02-23 The Boeing Company Non-chromated oxide coating for aluminum substrates
US6183546B1 (en) 1998-11-02 2001-02-06 Mccomas Industries International Coating compositions containing nickel and boron
US6432225B1 (en) 1999-11-02 2002-08-13 The Boeing Company Non-chromated oxide coating for aluminum substrates
US20030190426A1 (en) * 2002-04-03 2003-10-09 Deenesh Padhi Electroless deposition method
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
US6821909B2 (en) * 2002-10-30 2004-11-23 Applied Materials, Inc. Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
JP2004327229A (en) * 2003-04-24 2004-11-18 Konica Minolta Holdings Inc Composition for forming conductive pattern, forming method for conductive pattern, and manufacturing method of composition
US7064065B2 (en) * 2003-10-15 2006-06-20 Applied Materials, Inc. Silver under-layers for electroless cobalt alloys
TW200530427A (en) * 2003-10-17 2005-09-16 Applied Materials Inc Selective self-initiating electroless capping of copper with cobalt-containing alloys
US7205233B2 (en) 2003-11-07 2007-04-17 Applied Materials, Inc. Method for forming CoWRe alloys by electroless deposition
US7256111B2 (en) * 2004-01-26 2007-08-14 Applied Materials, Inc. Pretreatment for electroless deposition
SE0403042D0 (en) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Improved stabilization and performance of autocatalytic electroless process
WO2006102318A2 (en) 2005-03-18 2006-09-28 Applied Materials, Inc. Electroless deposition process on a contact containing silicon or silicide
TW200707640A (en) 2005-03-18 2007-02-16 Applied Materials Inc Contact metallization scheme using a barrier layer over a silicide layer
US7651934B2 (en) 2005-03-18 2010-01-26 Applied Materials, Inc. Process for electroless copper deposition
EP1734156B1 (en) * 2005-06-10 2017-03-01 Enthone, Inc. Process for the direct metallization of nonconductive substrates
US7306662B2 (en) * 2006-05-11 2007-12-11 Lam Research Corporation Plating solution for electroless deposition of copper
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
EP3017083A4 (en) * 2013-08-06 2017-01-04 Earthone Circuit Technologies Corporation Forming a conductive image using high speed electroless platin

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3096182A (en) * 1958-10-01 1963-07-02 Du Pont Chemical plating solution and process for plating therewith
US3063850A (en) * 1959-09-11 1962-11-13 Metal Hydrides Inc Metal plating by chemical reduction with amine boranes
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating

Also Published As

Publication number Publication date
SE316962B (en) 1969-11-03
US3403035A (en) 1968-09-24
BE665911A (en) 1965-10-18
NL6508142A (en) 1965-12-27
DE1521440A1 (en) 1970-01-08
DE1521440B2 (en) 1970-11-26
DK129949B (en) 1974-12-02
AT270330B (en) 1969-04-25
DK129949C (en) 1975-06-30
CH467342A (en) 1969-01-15
GB1121282A (en) 1968-07-24

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Legal Events

Date Code Title Description
FD2A Announcement of lapse in spain

Effective date: 20170628