JPS572876A - Formation of copper film on inorganic oxide substrate - Google Patents
Formation of copper film on inorganic oxide substrateInfo
- Publication number
- JPS572876A JPS572876A JP7668080A JP7668080A JPS572876A JP S572876 A JPS572876 A JP S572876A JP 7668080 A JP7668080 A JP 7668080A JP 7668080 A JP7668080 A JP 7668080A JP S572876 A JPS572876 A JP S572876A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- copper film
- formation
- inorganic oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Abstract
PURPOSE: To form a copper film with high adhesion on an inorg. oxide substate at a low treating temp. independently of the surface shape of the substrate by forming a copper film in close contact with the substrate and heat treating the film at 300°C W the melting temp. of the film in a nonreducing atmosphere.
CONSTITUTION: The inorg. oxide substrate is made of ceramic or glass, and the surface state may be complex. A copper film is formed on the surface of the substrate by chemical plating, electroplating, vapor deposition, sputtering or other means in close contact with the substrate, and the film is heat treated at 300°C W the melting temp. of the film, especially 600W950°C in a nonreducing atmosphere having ≤100ppm oxygen concn. The oxygen concn. of the atmosphere is regulated to ≤100ppm, yet ≥0.1ppm oxygen is required so as to increase the adhesion of the film.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7668080A JPS572876A (en) | 1980-06-09 | 1980-06-09 | Formation of copper film on inorganic oxide substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7668080A JPS572876A (en) | 1980-06-09 | 1980-06-09 | Formation of copper film on inorganic oxide substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS572876A true JPS572876A (en) | 1982-01-08 |
JPS6150920B2 JPS6150920B2 (en) | 1986-11-06 |
Family
ID=13612138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7668080A Granted JPS572876A (en) | 1980-06-09 | 1980-06-09 | Formation of copper film on inorganic oxide substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS572876A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS615178A (en) * | 1984-06-15 | 1986-01-10 | 東京マグネツト応用製品株式会社 | Unlocking method and apparatus utilizing magnet |
JPS6172181A (en) * | 1984-09-14 | 1986-04-14 | 国産金属工業株式会社 | Lock |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0351409U (en) * | 1989-09-26 | 1991-05-20 |
-
1980
- 1980-06-09 JP JP7668080A patent/JPS572876A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS615178A (en) * | 1984-06-15 | 1986-01-10 | 東京マグネツト応用製品株式会社 | Unlocking method and apparatus utilizing magnet |
JPS6172181A (en) * | 1984-09-14 | 1986-04-14 | 国産金属工業株式会社 | Lock |
Also Published As
Publication number | Publication date |
---|---|
JPS6150920B2 (en) | 1986-11-06 |
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