GB989624A - Improvements in or relating to methods of metallising holes - Google Patents

Improvements in or relating to methods of metallising holes

Info

Publication number
GB989624A
GB989624A GB458661A GB458661A GB989624A GB 989624 A GB989624 A GB 989624A GB 458661 A GB458661 A GB 458661A GB 458661 A GB458661 A GB 458661A GB 989624 A GB989624 A GB 989624A
Authority
GB
United Kingdom
Prior art keywords
hole
board
coated
metallising
relating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB458661A
Inventor
Lawrence John Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOUNG RES LAB Ltd
Original Assignee
YOUNG RES LAB Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOUNG RES LAB Ltd filed Critical YOUNG RES LAB Ltd
Priority to GB458661A priority Critical patent/GB989624A/en
Publication of GB989624A publication Critical patent/GB989624A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Abstract

A hole in a board, such as a printed circuit board, which is to be metallized, is aligned with a hole of another board, and a flexible metallic paste is introduced into the hole in the other board and then transferred to the hole to be coated so as to coat at least a substantial portion of the wall thereof. The boards may be slightly spaced apart so that a coating is formed on the surface around the rim of the coated hole. Suitable metallic pastes comprise finely divided silver or silver-coated copper dispersed in an organic vehicle, e.g. a solution of rosin and ethyl cellulose. The coated board may finally be baked to drive off organic materials.
GB458661A 1961-02-07 1961-02-07 Improvements in or relating to methods of metallising holes Expired GB989624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB458661A GB989624A (en) 1961-02-07 1961-02-07 Improvements in or relating to methods of metallising holes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB458661A GB989624A (en) 1961-02-07 1961-02-07 Improvements in or relating to methods of metallising holes

Publications (1)

Publication Number Publication Date
GB989624A true GB989624A (en) 1965-04-22

Family

ID=9779960

Family Applications (1)

Application Number Title Priority Date Filing Date
GB458661A Expired GB989624A (en) 1961-02-07 1961-02-07 Improvements in or relating to methods of metallising holes

Country Status (1)

Country Link
GB (1) GB989624A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983001886A1 (en) * 1981-11-17 1983-05-26 Grünwald, Werner Method for making through connections in a printed circuit
AT404207B (en) * 1996-02-16 1998-09-25 Mikroelektronik Ges M B H Ab METHOD FOR PRODUCING ELECTRICAL CIRCUITS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983001886A1 (en) * 1981-11-17 1983-05-26 Grünwald, Werner Method for making through connections in a printed circuit
AT404207B (en) * 1996-02-16 1998-09-25 Mikroelektronik Ges M B H Ab METHOD FOR PRODUCING ELECTRICAL CIRCUITS

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