ES503645A0 - Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal - Google Patents
Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metalInfo
- Publication number
- ES503645A0 ES503645A0 ES503645A ES503645A ES503645A0 ES 503645 A0 ES503645 A0 ES 503645A0 ES 503645 A ES503645 A ES 503645A ES 503645 A ES503645 A ES 503645A ES 503645 A0 ES503645 A0 ES 503645A0
- Authority
- ES
- Spain
- Prior art keywords
- metallic
- precipitation
- procedure
- activate
- metal current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electrolytic Production Of Metals (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803025307 DE3025307A1 (de) | 1980-07-04 | 1980-07-04 | Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8205269A1 ES8205269A1 (es) | 1982-06-01 |
ES503645A0 true ES503645A0 (es) | 1982-06-01 |
Family
ID=6106372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES503645A Granted ES503645A0 (es) | 1980-07-04 | 1981-07-03 | Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0043485B1 (es) |
JP (1) | JPS5743977A (es) |
AT (1) | ATE13319T1 (es) |
CA (1) | CA1169720A (es) |
DE (2) | DE3025307A1 (es) |
ES (1) | ES503645A0 (es) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3146235A1 (de) * | 1981-11-21 | 1983-05-26 | Bayer Ag, 5090 Leverkusen | Selbstklebende metallisierte textile flaechenmaterialien |
DE3150985A1 (de) * | 1981-12-23 | 1983-06-30 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
JPS58189365A (ja) * | 1982-04-28 | 1983-11-05 | Okuno Seiyaku Kogyo Kk | 化学メッキ用アンダーコート組成物 |
DE3239090A1 (de) * | 1982-10-22 | 1984-04-26 | Bayer Ag, 5090 Leverkusen | Schwarz-metallisierte substratoberflaechen |
DE3242162A1 (de) * | 1982-11-13 | 1984-05-17 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von verbundwerkstoffen |
DE3324767A1 (de) * | 1983-07-08 | 1985-01-17 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substraten fuer die stromlose metallisierung |
JPS6079604A (ja) * | 1983-10-05 | 1985-05-07 | 株式会社村田製作所 | ポリアクリロニトリル導電性フイルムの製造方法 |
DE3337941A1 (de) * | 1983-10-19 | 1985-05-09 | Bayer Ag, 5090 Leverkusen | Passive radarreflektoren |
DE3421123A1 (de) * | 1984-06-07 | 1985-12-12 | Bayer Ag, 5090 Leverkusen | Verbundmaterial |
US4668533A (en) * | 1985-05-10 | 1987-05-26 | E. I. Du Pont De Nemours And Company | Ink jet printing of printed circuit boards |
EP0214097B1 (de) * | 1985-08-23 | 1989-12-27 | Ciba-Geigy Ag | Mischung aus Olefin und Dibenzalaceton-Palladiumkomplex und deren Verwendung |
US5182135A (en) * | 1986-08-12 | 1993-01-26 | Bayer Aktiengesellschaft | Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
JPH0826462B2 (ja) * | 1987-11-30 | 1996-03-13 | 龍徳 四十宮 | 表面金属化重合体成形物の製造方法 |
US5200272A (en) * | 1988-04-29 | 1993-04-06 | Miles Inc. | Process for metallizing substrate surfaces |
US5238702A (en) * | 1988-10-27 | 1993-08-24 | Henning Giesecke | Electrically conductive patterns |
DE3914726A1 (de) * | 1989-05-04 | 1990-11-08 | Deutsche Automobilgesellsch | Vorrichtung zur chemischen metallisierung von offenporigen schaeumen, vliesstoffen, nadelfilzen aus kunststoff- oder textilmaterial |
DE3938710A1 (de) * | 1989-11-17 | 1991-05-23 | Schering Ag | Komplexverbindungen mit oligomerem bis polymerem charakter |
DE4209708A1 (de) * | 1992-03-25 | 1993-09-30 | Bayer Ag | Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten |
DE4418016A1 (de) * | 1994-05-24 | 1995-11-30 | Wilfried Neuschaefer | Nichtleiter-Metallisierung |
US7166152B2 (en) | 2002-08-23 | 2007-01-23 | Daiwa Fine Chemicals Co., Ltd. | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method |
GB2395365B8 (en) * | 2002-11-13 | 2006-11-02 | Peter Leslie Moran | Electrical circuit board |
JP4605074B2 (ja) * | 2006-03-31 | 2011-01-05 | Tdk株式会社 | 無電解めっき液及びセラミック電子部品の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT286058B (de) * | 1968-01-09 | 1970-11-25 | Photocircuits Corp | Verfahren zur Vorbereitung von in geformtem oder ungeformtem Zustand vorliegenden Materialien, vorzugsweise von Isolierstoffen für die stromlose Metallisierung |
DE2451217C2 (de) * | 1974-10-29 | 1982-12-23 | Basf Ag, 6700 Ludwigshafen | Aktivierung von Substraten für die stromlose Metallisierung |
-
1980
- 1980-07-04 DE DE19803025307 patent/DE3025307A1/de not_active Withdrawn
-
1981
- 1981-06-22 EP EP81104782A patent/EP0043485B1/de not_active Expired
- 1981-06-22 DE DE8181104782T patent/DE3170482D1/de not_active Expired
- 1981-06-22 AT AT81104782T patent/ATE13319T1/de not_active IP Right Cessation
- 1981-07-02 CA CA000380974A patent/CA1169720A/en not_active Expired
- 1981-07-03 ES ES503645A patent/ES503645A0/es active Granted
- 1981-07-03 JP JP56103474A patent/JPS5743977A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
ES8205269A1 (es) | 1982-06-01 |
DE3025307A1 (de) | 1982-01-28 |
EP0043485A1 (de) | 1982-01-13 |
CA1169720A (en) | 1984-06-26 |
DE3170482D1 (en) | 1985-06-20 |
EP0043485B1 (de) | 1985-05-15 |
ATE13319T1 (de) | 1985-06-15 |
JPS5743977A (en) | 1982-03-12 |
JPS6354791B2 (es) | 1988-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19970505 |