CA1169720A - Process for activating surfaces for currentless metallization - Google Patents

Process for activating surfaces for currentless metallization

Info

Publication number
CA1169720A
CA1169720A CA000380974A CA380974A CA1169720A CA 1169720 A CA1169720 A CA 1169720A CA 000380974 A CA000380974 A CA 000380974A CA 380974 A CA380974 A CA 380974A CA 1169720 A CA1169720 A CA 1169720A
Authority
CA
Canada
Prior art keywords
organo
metallic
nickel
solution
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000380974A
Other languages
English (en)
French (fr)
Inventor
Henning Giesecke
Gerhard D. Wolf
Harold Ebneth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Application granted granted Critical
Publication of CA1169720A publication Critical patent/CA1169720A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
CA000380974A 1980-07-04 1981-07-02 Process for activating surfaces for currentless metallization Expired CA1169720A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3025307.7 1980-07-04
DE19803025307 DE3025307A1 (de) 1980-07-04 1980-07-04 Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung

Publications (1)

Publication Number Publication Date
CA1169720A true CA1169720A (en) 1984-06-26

Family

ID=6106372

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000380974A Expired CA1169720A (en) 1980-07-04 1981-07-02 Process for activating surfaces for currentless metallization

Country Status (6)

Country Link
EP (1) EP0043485B1 (es)
JP (1) JPS5743977A (es)
AT (1) ATE13319T1 (es)
CA (1) CA1169720A (es)
DE (2) DE3025307A1 (es)
ES (1) ES8205269A1 (es)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657786A (en) * 1982-10-22 1987-04-14 Bayer Aktiengesellschaft Black-metallized substrate surfaces
US5076199A (en) * 1989-05-04 1991-12-31 Deutsche Automobilgesellschaft Mbh Apparatus for the chemical metallization of open-pored foams, nonwovens, needle felts of plastic or textile material
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
GB2395365A (en) * 2002-11-13 2004-05-19 Peter Leslie Moran Manufacturing process for electrical circuit board with integrally formed track and connection pins

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3146235A1 (de) * 1981-11-21 1983-05-26 Bayer Ag, 5090 Leverkusen Selbstklebende metallisierte textile flaechenmaterialien
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
JPS58189365A (ja) * 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk 化学メッキ用アンダーコート組成物
DE3242162A1 (de) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von verbundwerkstoffen
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
JPS6079604A (ja) * 1983-10-05 1985-05-07 株式会社村田製作所 ポリアクリロニトリル導電性フイルムの製造方法
DE3337941A1 (de) * 1983-10-19 1985-05-09 Bayer Ag, 5090 Leverkusen Passive radarreflektoren
DE3421123A1 (de) * 1984-06-07 1985-12-12 Bayer Ag, 5090 Leverkusen Verbundmaterial
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
DE3667800D1 (de) * 1985-08-23 1990-02-01 Ciba Geigy Ag Mischung aus olefin und dibenzalaceton-palladiumkomplex und deren verwendung.
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
DE3938710A1 (de) * 1989-11-17 1991-05-23 Schering Ag Komplexverbindungen mit oligomerem bis polymerem charakter
DE4209708A1 (de) * 1992-03-25 1993-09-30 Bayer Ag Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten
DE4418016A1 (de) * 1994-05-24 1995-11-30 Wilfried Neuschaefer Nichtleiter-Metallisierung
US7166152B2 (en) 2002-08-23 2007-01-23 Daiwa Fine Chemicals Co., Ltd. Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
JP4605074B2 (ja) * 2006-03-31 2011-01-05 Ｔｄｋ株式会社 無電解めっき液及びセラミック電子部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT286058B (de) * 1968-01-09 1970-11-25 Photocircuits Corp Verfahren zur Vorbereitung von in geformtem oder ungeformtem Zustand vorliegenden Materialien, vorzugsweise von Isolierstoffen für die stromlose Metallisierung
DE2451217C2 (de) * 1974-10-29 1982-12-23 Basf Ag, 6700 Ludwigshafen Aktivierung von Substraten für die stromlose Metallisierung

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657786A (en) * 1982-10-22 1987-04-14 Bayer Aktiengesellschaft Black-metallized substrate surfaces
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
US5076199A (en) * 1989-05-04 1991-12-31 Deutsche Automobilgesellschaft Mbh Apparatus for the chemical metallization of open-pored foams, nonwovens, needle felts of plastic or textile material
GB2395365A (en) * 2002-11-13 2004-05-19 Peter Leslie Moran Manufacturing process for electrical circuit board with integrally formed track and connection pins
GB2395365B (en) * 2002-11-13 2006-03-22 Peter Leslie Moran Electrical circuit board

Also Published As

Publication number Publication date
ES503645A0 (es) 1982-06-01
JPS6354791B2 (es) 1988-10-31
EP0043485B1 (de) 1985-05-15
DE3170482D1 (en) 1985-06-20
JPS5743977A (en) 1982-03-12
EP0043485A1 (de) 1982-01-13
ES8205269A1 (es) 1982-06-01
DE3025307A1 (de) 1982-01-28
ATE13319T1 (de) 1985-06-15

Similar Documents

Publication Publication Date Title
CA1169720A (en) Process for activating surfaces for currentless metallization
US4764401A (en) Process for activating substrate surfaces for electroless metallization
CA2069495C (en) Catalytic, water-soluble polymeric films for metal coatings
AU598055B2 (en) Selective catalytic activation of polymeric films
US5082734A (en) Catalytic, water-soluble polymeric films for metal coatings
US6902765B2 (en) Method for electroless metal plating
US5411795A (en) Electroless deposition of metal employing thermally stable carrier polymers
US4493861A (en) Process for activating substrate surfaces for currentless metallization
US4278435A (en) Process for the partial metallization of textile structures
US4568570A (en) Process for activating substrates for electroless metallization
US4835015A (en) Process for electroless metallization of sheetlike textile substrates
EP0765413B1 (en) A process for making electroless plated aramid surfaces
US5279899A (en) Sulfonated polyamides
US4568571A (en) Process for the adhesion-activation of polyamide substrates for electroless metallization
JPH0247547B2 (es)
JPH06157079A (ja) 金属被覆ガラス繊維体の製造方法
JPH03223469A (ja) 無電解メッキ材料の製造方法

Legal Events

Date Code Title Description
MKEX Expiry