ES2784236T3 - Direccionamiento tridimensional para memoria - Google Patents

Direccionamiento tridimensional para memoria Download PDF

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Publication number
ES2784236T3
ES2784236T3 ES14881146T ES14881146T ES2784236T3 ES 2784236 T3 ES2784236 T3 ES 2784236T3 ES 14881146 T ES14881146 T ES 14881146T ES 14881146 T ES14881146 T ES 14881146T ES 2784236 T3 ES2784236 T3 ES 2784236T3
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ES
Spain
Prior art keywords
eprom
data signal
row
address
column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES14881146T
Other languages
English (en)
Spanish (es)
Inventor
Boon Bing Ng
Hang Ru Goy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Application granted granted Critical
Publication of ES2784236T3 publication Critical patent/ES2784236T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/08—Address circuits; Decoders; Word-line control circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/24—Bit-line control circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/26—Sensing or reading circuits; Data output circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/24—Accessing extra cells, e.g. dummy cells or redundant cells
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/26—Accessing multiple arrays
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/04—Arrangements for selecting an address in a digital store using a sequential addressing device, e.g. shift register, counter
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/20—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the three-dimensional [3D] arrangements, e.g. with cells on different height levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H10D30/694—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/696—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes having at least one additional gate, e.g. program gate, erase gate or select gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/711—Insulated-gate field-effect transistors [IGFET] having floating bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Read Only Memory (AREA)
ES14881146T 2014-01-31 2014-01-31 Direccionamiento tridimensional para memoria Active ES2784236T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/014014 WO2015116129A1 (en) 2014-01-31 2014-01-31 Three-dimensional addressing for erasable programmable read only memory

Publications (1)

Publication Number Publication Date
ES2784236T3 true ES2784236T3 (es) 2020-09-23

Family

ID=53757530

Family Applications (1)

Application Number Title Priority Date Filing Date
ES14881146T Active ES2784236T3 (es) 2014-01-31 2014-01-31 Direccionamiento tridimensional para memoria

Country Status (19)

Country Link
US (3) US9773556B2 (enExample)
EP (5) EP3100273B1 (enExample)
JP (1) JP6262355B2 (enExample)
KR (1) KR101942164B1 (enExample)
CN (2) CN105940454B (enExample)
AU (2) AU2014380279B2 (enExample)
BR (1) BR112016017343B1 (enExample)
CA (1) CA2938125C (enExample)
DK (1) DK3100273T3 (enExample)
ES (1) ES2784236T3 (enExample)
HU (1) HUE048477T2 (enExample)
MX (1) MX367147B (enExample)
PH (1) PH12016501490B1 (enExample)
PL (1) PL3100273T3 (enExample)
PT (1) PT3100273T (enExample)
RU (1) RU2640631C1 (enExample)
SG (1) SG11201605665VA (enExample)
WO (1) WO2015116129A1 (enExample)
ZA (1) ZA201605059B (enExample)

Families Citing this family (11)

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CN105940454B (zh) * 2014-01-31 2020-01-17 惠普发展公司,有限责任合伙企业 对可擦除可编程只读存储器进行三维寻址
BR112019006948B1 (pt) 2016-10-06 2022-12-20 Hewlett-Packard Development Company, L.P. Aparelho de controle para um dispositivo de ejeção de fluido, dispositivo de ejeção de fluido e método
BR112019015681B1 (pt) 2017-01-31 2023-10-31 Hewlett-Packard Development Company, L.P Arranjo de memória para uma matriz de ejeção de fluido, matriz de ejeção de fluido e cartucho de fluido
CN113276561B (zh) * 2017-01-31 2022-10-11 惠普发展公司,有限责任合伙企业 用于流体喷射片的存储器库装置、流体喷射片及流体盒
US11090926B2 (en) 2017-07-06 2021-08-17 Hewlett-Packard Development Company, L.P. Decoders for memories of fluid ejection devices
PH12019501747B1 (en) 2017-07-06 2022-11-09 Hewlett Packard Development Co Selectors for nozzles and memory elements
US10913265B2 (en) 2017-07-06 2021-02-09 Hewlett-Packard Development Company, L.P. Data lines to fluid ejection devices
AU2019428071B2 (en) 2019-02-06 2023-01-19 Hewlett-Packard Development Company, L.P. Print component with memory circuit
MX2021008895A (es) 2019-02-06 2021-08-19 Hewlett Packard Development Co Componente de impresion de comunicacion.
WO2020162910A1 (en) 2019-02-06 2020-08-13 Hewlett-Packard Development Company, L.P. Memories of fluidic dies
US11787173B2 (en) 2019-02-06 2023-10-17 Hewlett-Packard Development Company, L.P. Print component with memory circuit

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JPS63136397A (ja) 1986-11-26 1988-06-08 Nec Corp シフトレジスタ回路
JP3081614B2 (ja) 1989-03-08 2000-08-28 富士通株式会社 部分書込み制御装置
JP2862287B2 (ja) * 1989-10-12 1999-03-03 キヤノン株式会社 画像記録装置
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Also Published As

Publication number Publication date
MX2016009841A (es) 2016-10-26
CN105940454A (zh) 2016-09-14
CN105940454B (zh) 2020-01-17
PH12016501490B1 (en) 2018-11-14
EP3100273B1 (en) 2020-03-25
JP2017507404A (ja) 2017-03-16
SG11201605665VA (en) 2016-08-30
EP3236471A3 (en) 2018-01-17
CA2938125C (en) 2018-10-23
CA2938125A1 (en) 2015-08-06
EP4468299A2 (en) 2024-11-27
PT3100273T (pt) 2020-04-13
EP3100273A1 (en) 2016-12-07
KR20160104700A (ko) 2016-09-05
EP3236471A2 (en) 2017-10-25
US9928912B2 (en) 2018-03-27
EP3100273A4 (en) 2017-12-13
EP4468299A3 (en) 2025-02-26
WO2015116129A1 (en) 2015-08-06
US9773556B2 (en) 2017-09-26
DK3100273T3 (da) 2020-04-06
AU2014380279A1 (en) 2016-08-11
US20170221566A1 (en) 2017-08-03
US10340011B2 (en) 2019-07-02
BR112016017343B1 (pt) 2022-01-04
US20180114579A1 (en) 2018-04-26
BR112016017343A2 (enExample) 2017-08-08
PH12016501490A1 (en) 2017-02-06
EP3896696A1 (en) 2021-10-20
US20160343439A1 (en) 2016-11-24
HUE048477T2 (hu) 2020-07-28
EP3258469A1 (en) 2017-12-20
RU2640631C1 (ru) 2018-01-10
CN111326202A (zh) 2020-06-23
ZA201605059B (en) 2017-09-27
AU2017210573A1 (en) 2017-08-24
JP6262355B2 (ja) 2018-01-17
PL3100273T3 (pl) 2020-06-29
MX367147B (es) 2019-08-06
AU2014380279B2 (en) 2017-05-04
AU2017210573B2 (en) 2019-04-11
KR101942164B1 (ko) 2019-01-24
EP3258469B1 (en) 2021-10-06

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