PL3100273T3 - Trójwymiarowe adresowanie pamięci eprom - Google Patents
Trójwymiarowe adresowanie pamięci epromInfo
- Publication number
- PL3100273T3 PL3100273T3 PL14881146T PL14881146T PL3100273T3 PL 3100273 T3 PL3100273 T3 PL 3100273T3 PL 14881146 T PL14881146 T PL 14881146T PL 14881146 T PL14881146 T PL 14881146T PL 3100273 T3 PL3100273 T3 PL 3100273T3
- Authority
- PL
- Poland
- Prior art keywords
- memory
- programmable read
- erasable programmable
- dimensional addressing
- addressing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17543—Cartridge presence detection or type identification
- B41J2/17546—Cartridge presence detection or type identification electronically
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/24—Bit-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/24—Accessing extra cells, e.g. dummy cells or redundant cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/26—Accessing multiple arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/04—Arrangements for selecting an address in a digital store using a sequential addressing device, e.g. shift register, counter
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/20—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the three-dimensional [3D] arrangements, e.g. with cells on different height levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
- H10D30/694—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/696—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes having at least one additional gate, e.g. program gate, erase gate or select gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/711—Insulated-gate field-effect transistors [IGFET] having floating bodies
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14881146.6A EP3100273B1 (en) | 2014-01-31 | 2014-01-31 | Three-dimensional addressing for erasable programmable read only memory |
| PCT/US2014/014014 WO2015116129A1 (en) | 2014-01-31 | 2014-01-31 | Three-dimensional addressing for erasable programmable read only memory |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3100273T3 true PL3100273T3 (pl) | 2020-06-29 |
Family
ID=53757530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL14881146T PL3100273T3 (pl) | 2014-01-31 | 2014-01-31 | Trójwymiarowe adresowanie pamięci eprom |
Country Status (19)
| Country | Link |
|---|---|
| US (3) | US9773556B2 (enExample) |
| EP (5) | EP3100273B1 (enExample) |
| JP (1) | JP6262355B2 (enExample) |
| KR (1) | KR101942164B1 (enExample) |
| CN (2) | CN105940454B (enExample) |
| AU (2) | AU2014380279B2 (enExample) |
| BR (1) | BR112016017343B1 (enExample) |
| CA (1) | CA2938125C (enExample) |
| DK (1) | DK3100273T3 (enExample) |
| ES (1) | ES2784236T3 (enExample) |
| HU (1) | HUE048477T2 (enExample) |
| MX (1) | MX367147B (enExample) |
| PH (1) | PH12016501490B1 (enExample) |
| PL (1) | PL3100273T3 (enExample) |
| PT (1) | PT3100273T (enExample) |
| RU (1) | RU2640631C1 (enExample) |
| SG (1) | SG11201605665VA (enExample) |
| WO (1) | WO2015116129A1 (enExample) |
| ZA (1) | ZA201605059B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105940454B (zh) * | 2014-01-31 | 2020-01-17 | 惠普发展公司,有限责任合伙企业 | 对可擦除可编程只读存储器进行三维寻址 |
| BR112019006948B1 (pt) | 2016-10-06 | 2022-12-20 | Hewlett-Packard Development Company, L.P. | Aparelho de controle para um dispositivo de ejeção de fluido, dispositivo de ejeção de fluido e método |
| BR112019015681B1 (pt) | 2017-01-31 | 2023-10-31 | Hewlett-Packard Development Company, L.P | Arranjo de memória para uma matriz de ejeção de fluido, matriz de ejeção de fluido e cartucho de fluido |
| CN113276561B (zh) * | 2017-01-31 | 2022-10-11 | 惠普发展公司,有限责任合伙企业 | 用于流体喷射片的存储器库装置、流体喷射片及流体盒 |
| US11090926B2 (en) | 2017-07-06 | 2021-08-17 | Hewlett-Packard Development Company, L.P. | Decoders for memories of fluid ejection devices |
| PH12019501747B1 (en) | 2017-07-06 | 2022-11-09 | Hewlett Packard Development Co | Selectors for nozzles and memory elements |
| US10913265B2 (en) | 2017-07-06 | 2021-02-09 | Hewlett-Packard Development Company, L.P. | Data lines to fluid ejection devices |
| AU2019428071B2 (en) | 2019-02-06 | 2023-01-19 | Hewlett-Packard Development Company, L.P. | Print component with memory circuit |
| MX2021008895A (es) | 2019-02-06 | 2021-08-19 | Hewlett Packard Development Co | Componente de impresion de comunicacion. |
| WO2020162910A1 (en) | 2019-02-06 | 2020-08-13 | Hewlett-Packard Development Company, L.P. | Memories of fluidic dies |
| US11787173B2 (en) | 2019-02-06 | 2023-10-17 | Hewlett-Packard Development Company, L.P. | Print component with memory circuit |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5641574A (en) | 1979-09-07 | 1981-04-18 | Nec Corp | Memory unit |
| JPS5694589A (en) * | 1979-12-27 | 1981-07-31 | Nec Corp | Memory device |
| CA1234224A (en) | 1985-05-28 | 1988-03-15 | Boleslav Sykora | Computer memory management system |
| JPS63136397A (ja) | 1986-11-26 | 1988-06-08 | Nec Corp | シフトレジスタ回路 |
| JP3081614B2 (ja) | 1989-03-08 | 2000-08-28 | 富士通株式会社 | 部分書込み制御装置 |
| JP2862287B2 (ja) * | 1989-10-12 | 1999-03-03 | キヤノン株式会社 | 画像記録装置 |
| US5029020A (en) * | 1989-11-17 | 1991-07-02 | Xerox Corporation | Scanner with slow scan image context processing |
| JPH06236680A (ja) * | 1992-12-15 | 1994-08-23 | Mitsubishi Electric Corp | シリアルアドレス入力用メモリ装置及びシリアルアドレス発生装置 |
| US5828814A (en) | 1996-09-10 | 1998-10-27 | Moore Business Forms, Inc. | Reduced cost high resolution real time raster image processing system and method |
| KR100313503B1 (ko) | 1999-02-12 | 2001-11-07 | 김영환 | 멀티-뱅크 메모리 어레이를 갖는 반도체 메모리 장치 |
| TW522099B (en) * | 1999-03-31 | 2003-03-01 | Seiko Epson Corp | Printing system, printing controller, printer, method for controlling printing operations, printing method, ink box, ink provider, and recording medium |
| JP2000349163A (ja) * | 1999-06-04 | 2000-12-15 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| US6883044B1 (en) | 2000-07-28 | 2005-04-19 | Micron Technology, Inc. | Synchronous flash memory with simultaneous access to one or more banks |
| US7444575B2 (en) | 2000-09-21 | 2008-10-28 | Inapac Technology, Inc. | Architecture and method for testing of an integrated circuit device |
| US6402279B1 (en) | 2000-10-30 | 2002-06-11 | Hewlett-Packard Company | Inkjet printhead and method for the same |
| US6552955B1 (en) * | 2001-10-30 | 2003-04-22 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device with reduced power consumption |
| US6983428B2 (en) * | 2002-09-24 | 2006-01-03 | Sandisk Corporation | Highly compact non-volatile memory and method thereof |
| US7549718B2 (en) * | 2004-05-27 | 2009-06-23 | Silverbrook Research Pty Ltd | Printhead module having operation controllable on basis of thermal sensors |
| KR100855861B1 (ko) * | 2005-12-30 | 2008-09-01 | 주식회사 하이닉스반도체 | 비휘발성 반도체 메모리 장치 |
| JP4802722B2 (ja) * | 2006-01-17 | 2011-10-26 | セイコーエプソン株式会社 | シーケンシャルアクセスメモリ |
| US7484138B2 (en) * | 2006-06-09 | 2009-01-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for improving reliability of memory device |
| EP2263146B3 (en) * | 2008-03-14 | 2018-09-05 | Hewlett-Packard Development Company, L.P. | Secure access to fluid cartridge memory |
| US20110002169A1 (en) | 2009-07-06 | 2011-01-06 | Yan Li | Bad Column Management with Bit Information in Non-Volatile Memory Systems |
| KR101879442B1 (ko) * | 2011-05-25 | 2018-07-18 | 삼성전자주식회사 | 휘발성 메모리 장치의 리프레쉬 방법, 리프레쉬 어드레스 생성기 및 휘발성 메모리 장치 |
| CN105940454B (zh) * | 2014-01-31 | 2020-01-17 | 惠普发展公司,有限责任合伙企业 | 对可擦除可编程只读存储器进行三维寻址 |
| WO2015160350A1 (en) * | 2014-04-17 | 2015-10-22 | Hewlett-Packard Development Company, L.P. | Addressing an eprom on a printhead |
| US9281045B1 (en) * | 2014-12-16 | 2016-03-08 | Globalfoundries Inc. | Refresh hidden eDRAM memory |
-
2014
- 2014-01-31 CN CN201480074342.6A patent/CN105940454B/zh active Active
- 2014-01-31 KR KR1020167020956A patent/KR101942164B1/ko active Active
- 2014-01-31 AU AU2014380279A patent/AU2014380279B2/en active Active
- 2014-01-31 US US15/114,823 patent/US9773556B2/en active Active
- 2014-01-31 JP JP2016545345A patent/JP6262355B2/ja not_active Expired - Fee Related
- 2014-01-31 WO PCT/US2014/014014 patent/WO2015116129A1/en not_active Ceased
- 2014-01-31 ES ES14881146T patent/ES2784236T3/es active Active
- 2014-01-31 RU RU2016135221A patent/RU2640631C1/ru active
- 2014-01-31 PT PT148811466T patent/PT3100273T/pt unknown
- 2014-01-31 DK DK14881146.6T patent/DK3100273T3/da active
- 2014-01-31 SG SG11201605665VA patent/SG11201605665VA/en unknown
- 2014-01-31 PL PL14881146T patent/PL3100273T3/pl unknown
- 2014-01-31 EP EP14881146.6A patent/EP3100273B1/en active Active
- 2014-01-31 BR BR112016017343-0A patent/BR112016017343B1/pt not_active IP Right Cessation
- 2014-01-31 EP EP17169580.2A patent/EP3236471A3/en not_active Ceased
- 2014-01-31 EP EP21178474.9A patent/EP3896696A1/en not_active Ceased
- 2014-01-31 EP EP17184129.9A patent/EP3258469B1/en not_active Not-in-force
- 2014-01-31 CA CA2938125A patent/CA2938125C/en active Active
- 2014-01-31 CN CN202010089674.9A patent/CN111326202A/zh active Pending
- 2014-01-31 EP EP24194311.7A patent/EP4468299A3/en active Pending
- 2014-01-31 HU HUE14881146A patent/HUE048477T2/hu unknown
- 2014-01-31 MX MX2016009841A patent/MX367147B/es active IP Right Grant
-
2016
- 2016-07-20 ZA ZA2016/05059A patent/ZA201605059B/en unknown
- 2016-07-28 PH PH12016501490A patent/PH12016501490B1/en unknown
-
2017
- 2017-04-17 US US15/489,272 patent/US9928912B2/en active Active
- 2017-08-03 AU AU2017210573A patent/AU2017210573B2/en not_active Ceased
- 2017-12-21 US US15/851,413 patent/US10340011B2/en active Active
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ZA201605059B (en) | Three-dimensional addressing for erasable programmable read only memory | |
| GB2559706B (en) | Non-volatile buffer for memory operations | |
| EP3195315A4 (en) | Swap operations in memory | |
| EP3146524A4 (en) | Read cache memory | |
| EP3164777A4 (en) | Memory card | |
| EP3161577A4 (en) | Memory card | |
| GB2525904B (en) | Memory unit | |
| GB2530175B (en) | Encoding scheme for non-volatile memory | |
| GB201510596D0 (en) | Memory watch unit | |
| IL267292B1 (en) | Non-volatile memory | |
| GB2565499B (en) | Memory unit | |
| GB201603590D0 (en) | Memory unit | |
| IL250300A0 (en) | Write operations to non-volatile memory | |
| EP3123474A4 (en) | 6f2 non-volatile memory bitcell | |
| GB2525713B (en) | Memory subsystem with wrapped-to-continuous read | |
| GB2542867B (en) | Data storage | |
| GB201603295D0 (en) | Data storage | |
| GB2529298B (en) | Memory address translation | |
| GB2565257B (en) | A memory unit | |
| IL267682A (en) | A method for managing virtual memory | |
| GB201409657D0 (en) | Graphically rendering account data | |
| GB201603589D0 (en) | Memory unit | |
| TWI563670B (en) | Non-volatile memory | |
| PL3239845T3 (pl) | Sposób przydzielania przestrzeni w pamięci | |
| SG10201705876TA (en) | Three-dimensional addressing for erasable programmable read only memory |