ES2304174T3 - Pasador de elevacion con apoyo de rodillos para reducir el rozamiento. - Google Patents

Pasador de elevacion con apoyo de rodillos para reducir el rozamiento. Download PDF

Info

Publication number
ES2304174T3
ES2304174T3 ES05742317T ES05742317T ES2304174T3 ES 2304174 T3 ES2304174 T3 ES 2304174T3 ES 05742317 T ES05742317 T ES 05742317T ES 05742317 T ES05742317 T ES 05742317T ES 2304174 T3 ES2304174 T3 ES 2304174T3
Authority
ES
Spain
Prior art keywords
pin
lifting
roller support
plate
assembly according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES05742317T
Other languages
English (en)
Spanish (es)
Inventor
Laurent Dubost
Sylvain Hernandez
Hans Jaeger
Karine Landry
Bertrand Vinel
Eugene Zapodeanu
Jacques Schmitt
Redouane El Bouchikhy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
OC Oerlikon Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OC Oerlikon Balzers AG filed Critical OC Oerlikon Balzers AG
Application granted granted Critical
Publication of ES2304174T3 publication Critical patent/ES2304174T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • User Interface Of Digital Computer (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Motorcycle And Bicycle Frame (AREA)
ES05742317T 2004-05-28 2005-05-26 Pasador de elevacion con apoyo de rodillos para reducir el rozamiento. Expired - Lifetime ES2304174T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57515804P 2004-05-28 2004-05-28
US575158P 2004-05-28

Publications (1)

Publication Number Publication Date
ES2304174T3 true ES2304174T3 (es) 2008-09-16

Family

ID=34968080

Family Applications (1)

Application Number Title Priority Date Filing Date
ES05742317T Expired - Lifetime ES2304174T3 (es) 2004-05-28 2005-05-26 Pasador de elevacion con apoyo de rodillos para reducir el rozamiento.

Country Status (9)

Country Link
US (1) US20060016398A1 (enExample)
EP (1) EP1754254B1 (enExample)
JP (1) JP4777345B2 (enExample)
KR (1) KR20070032960A (enExample)
AT (1) ATE397288T1 (enExample)
DE (1) DE602005007217D1 (enExample)
ES (1) ES2304174T3 (enExample)
TW (1) TWI393799B (enExample)
WO (1) WO2005117097A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing
JP2007207807A (ja) * 2006-01-31 2007-08-16 Hitachi Kokusai Electric Inc 試料位置決め装置
JP4855097B2 (ja) * 2006-02-14 2012-01-18 株式會社塩山製作所 半導体チップ分離装置
KR101404009B1 (ko) * 2007-12-21 2014-06-13 주성엔지니어링(주) 리프트 핀 어셈블리
KR100945178B1 (ko) * 2008-04-24 2010-03-03 이옥기 이송장치용 부싱
US9011602B2 (en) * 2009-01-29 2015-04-21 Lam Research Corporation Pin lifting system
WO2011009007A2 (en) * 2009-07-15 2011-01-20 Applied Materials, Inc. Improved lift pin guides
JP5549441B2 (ja) * 2010-01-14 2014-07-16 東京エレクトロン株式会社 保持体機構、ロードロック装置、処理装置及び搬送機構
KR101053565B1 (ko) * 2010-10-11 2011-08-03 (주) 에스디시 승강 핀 가이드
US9371584B2 (en) * 2011-03-09 2016-06-21 Applied Materials, Inc. Processing chamber and method for centering a substrate therein
WO2012157638A1 (ja) * 2011-05-19 2012-11-22 シャープ株式会社 基板載置台および基板処理装置
KR101549854B1 (ko) 2011-10-20 2015-09-03 어플라이드 머티어리얼스, 인코포레이티드 기판 지지 부싱
KR101432152B1 (ko) * 2012-11-13 2014-08-22 삼성디스플레이 주식회사 기판 지지 모듈
CN105039934A (zh) * 2015-09-15 2015-11-11 京东方科技集团股份有限公司 滚轮套筒
KR101764418B1 (ko) 2016-01-06 2017-08-02 (주)신산이엔지 기판 열처리용 내열 지지유닛
US10998219B2 (en) * 2016-06-13 2021-05-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer support device and method for removing lift pin therefrom
KR102492991B1 (ko) * 2018-03-27 2023-01-30 배트 홀딩 아게 지지 핀을 수용하고 해제하기 위한 커플링을 갖는 핀 리프팅 장치
CN111029236A (zh) * 2018-10-09 2020-04-17 北京北方华创微电子装备有限公司 支撑装置及反应腔室
JP7147527B2 (ja) 2018-12-10 2022-10-05 トヨタ自動車株式会社 支援装置、支援方法およびプログラム
WO2021101681A1 (en) * 2019-11-22 2021-05-27 Lam Research Corporation Coin-slot and ball-lock ceramic lift pin holders
CN113764328B (zh) * 2020-06-02 2024-06-21 拓荆科技股份有限公司 用于加工晶圆的装置及方法
DE102020120732A1 (de) * 2020-08-06 2022-02-10 Vat Holding Ag Stifthubvorrichtung
US20240332058A1 (en) * 2023-03-28 2024-10-03 Applied Materials, Inc. Substrate support assembly

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3887247A (en) * 1974-02-25 1975-06-03 Us Energy Bearing mounting for telescoping tubes
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
JP3354367B2 (ja) * 1995-12-19 2002-12-09 大日本スクリーン製造株式会社 基板洗浄装置
JP3940190B2 (ja) * 1996-09-30 2007-07-04 松下電器産業株式会社 真空処理装置
US5672010A (en) * 1996-11-18 1997-09-30 Macnicol; Allan E. Linear slide bearing apparatus
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
JP3456890B2 (ja) * 1998-01-16 2003-10-14 東京エレクトロン株式会社 基板処理装置
JPH11351250A (ja) * 1998-06-12 1999-12-24 Sony Corp ベアリング装置
JP3398936B2 (ja) * 1999-04-09 2003-04-21 日本エー・エス・エム株式会社 半導体処理装置
JP4402763B2 (ja) * 1999-05-13 2010-01-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 エピタキシャルウェーハ製造装置
JP2001093960A (ja) * 1999-09-22 2001-04-06 Hitachi Techno Eng Co Ltd 処理装置用ウエファ位置決め装置
US6958098B2 (en) * 2000-02-28 2005-10-25 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
JP4111703B2 (ja) * 2001-10-19 2008-07-02 アプライド マテリアルズ インコーポレイテッド ウエハリフト機構
JP2003197719A (ja) * 2001-12-21 2003-07-11 Komatsu Electronic Metals Co Ltd 半導体製造装置および基板支持構造
JP2004026365A (ja) * 2002-06-24 2004-01-29 Dainippon Printing Co Ltd 作業台
DE10232478A1 (de) * 2002-07-17 2004-02-12 Infineon Technologies Ag Waferhubvorrichtung
US6887317B2 (en) * 2002-09-10 2005-05-03 Applied Materials, Inc. Reduced friction lift pin
JP4175988B2 (ja) * 2002-10-25 2008-11-05 東京エレクトロン株式会社 基板アライメント装置及び基板処理装置及び基板搬送装置
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing

Also Published As

Publication number Publication date
JP2008500709A (ja) 2008-01-10
TWI393799B (zh) 2013-04-21
KR20070032960A (ko) 2007-03-23
DE602005007217D1 (de) 2008-07-10
EP1754254A1 (en) 2007-02-21
TW200624587A (en) 2006-07-16
EP1754254B1 (en) 2008-05-28
WO2005117097A1 (en) 2005-12-08
US20060016398A1 (en) 2006-01-26
ATE397288T1 (de) 2008-06-15
JP4777345B2 (ja) 2011-09-21

Similar Documents

Publication Publication Date Title
JP4777345B2 (ja) 摩擦を減らすための、ローラグライドを備えたリフトピン
KR101967272B1 (ko) 물품의 지지 장치 및 지지 방법
KR102025450B1 (ko) 웨이퍼 형상 물품 처리방법 및 디바이스
ES2220851T3 (es) Rodillo de transporte, dispositivo de retencion y sistema de transporte para material de transporte plano.
JP4723204B2 (ja) 統合された大型ガラス取り扱いシステム
ES2385755T3 (es) Guía de extracción para cajones
KR101361286B1 (ko) 공구 교환 장치와 공구 교환 장치를 구비하는 공작 기계
ES2594355T3 (es) Dispositivo de fijación
JP2006319261A (ja) 基板処理装置
KR20120109509A (ko) 웨이퍼 형상 물품의 액체 처리를 위한 디바이스 및 프로세스
JP2017163162A (ja) 基板保持装置
JP2015206558A (ja) 基板支持装置及び基板処理装置
KR100843107B1 (ko) 진공처리장치
JP2021158196A (ja) 基板処理装置および基板反転方法
ES2532251T3 (es) Dispositivo de impresión serigráfica con un accionador principal
JP2017119348A (ja) ホルダジョイント
TW200602280A (en) Method and apparatus for processing glass matrix for optical fiber
JP2009026859A (ja) 基板検査装置
KR101717680B1 (ko) 기판 안착장치
KR102040946B1 (ko) 노즐 교환 장치
KR20140062593A (ko) 기판 지지 모듈
KR100843106B1 (ko) 진공처리장치
KR101341208B1 (ko) 부양식 평판 이송장치
KR102517909B1 (ko) 리프트모듈 및 이를 이용한 기판이송로봇핸드
KR20150120750A (ko) 리프트핀 가이드 조립체