TWI393799B - 用於真空室中之基板的支持及升降裝置 - Google Patents

用於真空室中之基板的支持及升降裝置 Download PDF

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TWI393799B
TWI393799B TW094117365A TW94117365A TWI393799B TW I393799 B TWI393799 B TW I393799B TW 094117365 A TW094117365 A TW 094117365A TW 94117365 A TW94117365 A TW 94117365A TW I393799 B TWI393799 B TW I393799B
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pin
pin assembly
substrate
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ball
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Laurent Dubost
Sylvain Hernandez
Hans Jaeger
Karine Landry
Bertrand Vinel
Eugene Zapodeanu
Jacques Schmitt
Redouane El Bouchikhy
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Oerlikon Solar Ag
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices

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Description

用於真空室中之基板的支持及升降裝置
本發明係提出一種通常用於真空室中，特別地用於電漿輔助化學氣相沈積(PECVD)反應器中的銷系統。這些銷係用於在一反應器中升降及支撐基板。當該反應器開啟時，將舉升該等銷，以接收由一機器人叉引進之基板。當該基板已置於該等銷上時，將降下該等銷，直到該基板抵達其待處理之位置為止。技藝中亦已知有其他系統，其中底部可較該等銷相對較高。該等銷可在切削入該反應器底部中之一導孔內運行。典型地，設至該反應器內部中之導孔的上方末端係呈埋入者。額外地，可使該銷頭向外展開，以防止該等銷經由該導孔掉落。該銷系統之後兩特徵，將允許該等銷頭定位成接近齊平於該反應器底部。通常，由一升降臂與一升降機機構所組成之一升降機系統，可在需求之位置中升降該銷。
目前之銷的幾何及材料設計，已遭遇經常發生之銷自我固鎖及銷破壞。這兩種問題皆可造成不均勻沈積率、基板破裂，且甚至導致一反應器停機。
該銷自我固鎖係起因於施加至該銷上之複數個橫向力。該等橫向力可因該基板進入加熱室時產生之熱膨脹，及該升降機系統並未精確地沿導孔軸線推動該銷而引生。銷－基板、銷－升降機、及銷－導孔界面處之高摩擦結合不充份之導引(不足之銷對導件長度比)，將使銷固鎖之問題更為擴大。當該升降機推迫一自我固鎖銷時，該銷將發生破壞。
美國專利申請案第2004/0045509號係描述如何降低銷與其導孔之間的摩擦。解決方案係基於一種銷設計，其中該銷具有至少一較大直徑凸肩，以縮小該銷與其導孔之間的接觸面積，而得減少銷刮擦、微粒生成、及組件磨耗。
美國專利申請案第2003/0205329號中則描述另一種可使作用在銷上之橫向力減小的嘗試。其提出之一銷設計係將一升降臂所引生之橫向力分解。該銷系統主要係由三個部件構成：一升降銷、一致動器銷、及一升降臂。該升降銷與致動器銷各在兩襯套中由其引導。可同軸地定位該兩銷，如此該致動器銷將可用於使該升降銷在上方與下方末端位置中移動。一連接器係作為該等銷之間的一界面。這種連接器可在該致動器銷與該升降銷之間容許橫向間隙。該致動器銷本身係由包覆著複數個耐磨墊之一升降臂總成移動。該等致動器銷係設於這些直徑較該致動器銷者大的耐磨墊上。該等致動器銷可浮動橫越該等耐磨墊。
美國專利申請案第2004/0045509及2003/0205329號僅可部份地解決上述技術問題。第一種設計可減少沿銷運動方向上之摩擦，而第二種設計則可減小銷系統上由該升降機系統所引生之橫向力。
先前技藝並未提供一種可同時減小銷系統與其導孔之間摩擦及由升降機所引生之橫向力的解決方案。此外，並無任何可分解由基板所引生之橫向力的已知解決方案。
本發明係針對減小作用於一銷上之複數個橫向力及升降運動期間之導引摩擦。該等橫向力可由升降臂與基板引生。一升降機系統係由一升降臂及連附至該臂之一底板構成。該銷係鬆弛地站立於該底板上且駐存於可安裝至一反應器底部上之一襯套中。因此銷/基板、銷/底板、及銷/襯套接觸面積係最為重要者。
是以，本發明之一種用於升降及支撐基板之銷總成包括一升降銷(1)，其具有一頂端及一底端；該頂端係理解為，可接收且支撐一基板(4)者；該底端係理解為，可由一升降機系統(3a)致動者；該升降銷係由一導件以可運動式支承，其中該導件包括一滾子滑件，用於減小該銷沿一垂直軸運動時之摩擦。在又一具體實施例中，該滾子滑件包括六個滾子，其配置於一襯套中且安裝於一反應器底部上。更，該升降銷(1)之底端至少可在升降動作期間，經由一底板與該升降機系統相連接；該底板包括一頂部板(7)，可相關於該升降機系統橫向地運動。該底板尚包括一滾珠固持板(8)，其具有配置於該頂部板(7)上方之複數個滾珠(9)，該等滾珠又可相對於該升降機系統橫向地運動。在本發明之又一構想中，該升降銷(1)之頂端尚包括一間隙，其可理解為固持著由一滾珠軸承(13)所支撐且由一扣環緊固的一滾動滾珠(14)者。
第1a圖係顯示一銷系統之總成；一銷1係由一滾子滑件2導引且由安裝至一升降臂3a之一底板3致動。需使用至少三個這種銷系統來支撐及升降一基板4。假定該等銷係自一機器人叉(第1圖中未顯示)接收基板4，其中該機器人叉可將該基板置於該等舉升銷上。接著，該等銷可將基板4擺放於一反應器底部2a(第1b圖)上。該反應器底部係該基板在塗佈製程開始前所處之最終位置。當該塗佈製程已結束後，該等銷將在機器人叉自塗佈室移出該基板之前，抬升該基板至抬高位置(第1c圖)。
本發明之銷系統包括三元件：一滾子滑件、一滾珠軸承底板、及一滾珠承載銷頭。
第一個該等元件係滾子滑件2。這種滾子滑件之設計係用於減少該銷沿一垂直軸運動時之摩擦。該滾子滑件係安裝於反應器底部2a上且可導引該銷。該滑件(請參閱第2圖)包括譬如六個滾子6、6a、6b、6c，該等滾子係由允許與軸及襯套產生低摩擦及低磨耗、對製程氣體具有化學防護、且在製程溫度下仍可保持其特性的一材料製成。該等滾子本身係藉由以這種材料製成之一襯套(5)所固持著。
一第二元件可定義該銷與升降機之間的界面(請參閱第3圖)：一滾珠軸承底板。這種底板將使可作用於該銷上之複數個橫向力最小化。該等橫向力係因該升降臂未與該銷垂直運動軸完美匹配之抬升運動而由該升降臂引生。該底板包括四個主要元件：一頂部板7及一滾珠固持板8，該等者係彈性地承載於一底部板10上。複數個滾珠9可改善該等板之橫向運動自由程度，及因此使作用於該銷上之橫向力最小化。頂部板7與滾珠固持板8需要彈性軸承7a、8a，以在一銷運動循環週期後重新定心該兩板。譬如一彈簧等該彈性軸承之恢復力，係可傳遞至該銷上之橫向力的限制因素。因此，彈簧常數應相對較低，以容許頂部板7之浮動運動。
依據本發明之第三元件係一銷滾珠承載頭(第4圖)。這種經修飾之銷頭的功能在於，減小可作於該銷上之該等橫向力。這些力可由該基板引入。該銷頭係由具有一半球體間隙之一銷末端11與一扣環12構成，且其固持著一滾珠軸承13及一滾動滾珠14。滾動滾珠14之旋轉運動自由程度可由滾珠軸承13加強。因此，可由該基板引發之該等橫向力將得以最小化。該扣環(12)略粗於該銷桿，以防止該銷經由該滾子滑件掉落。
本發明之優點
本發明之銷設計可大幅降低自我固鎖之風險。較小導引摩擦搭配分解橫向力之新解決方案的特點，可使塗佈裝置達成一較高良率及較短停工期。額外之正面效應包括減少反應器中之微粒及降低刮擦該基板之風險。由於減少之銷摩擦，使得該等銷與其導孔之間、及該等銷與該基板之間的磨耗力可最小化。該反應器中之微粒污染及刮擦基板風險將可下降。
所有上述新特徵皆可提高塗佈製程之生產率及品質，且因此可提供這種裝置之使用者較高的經濟價值。
1．．．銷、升降銷
2．．．滾子滑件
2a．．．反應器底部
3．．．板
3a．．．升降臂、升降機系統
4．．．基板
5．．．襯套
6．．．滾子
6a、b、c．．．滾子
7．．．頂部板
7a．．．彈性軸承
8．．．滾珠固持板
8a．．．彈性軸承
9．．．滾珠
10．．．底部板
11．．．銷末端
12．．．扣環
13．．．滾珠軸承
14．．．滾動滾珠
第1(a)圖係顯示可具體實施本發明三構想之一本發明支撐及升降裝置；第1(b)圖係顯示該發明裝置上之一基板，其正處於一底部位置；第1(c)圖係顯示該發明裝置上之一基板，其正處於一頂部位置；第2圖係顯示橫貫依據本發明一構想之一滾動軸承襯套的截面及其上視圖；第3圖係顯示依據本發明又一構想之一滾珠軸承底板；及第4圖係顯示依據本發明又一構想之一滾珠承載頭。
1．．．銷、升降銷
2．．．滾子滑件
2a．．．反應器底部
3．．．板
3a．．．升降臂、升降機系統
4．．．基板

Claims (11)

  1. 一種用於升降及支撐基板之銷總成，其包括：-一升降銷(1)，具有一頂端及一底端；-該頂端係構造成接收且支撐一基板(4)；-該底端係構造成由一升降機系統(3a)致動，且至少在升降操作期間，經由一底板(3)與該升降機系統(3a)接觸；-該升降銷(1)係由一導件以可移動地支承，其中該導件包括一滾子滑件(2)，用於減小該銷在一垂直軸運動之摩擦；該滾子滑件(2)包括配置於一襯套(5)中之複數個滾子(6)，且該滾子滑件(2)及該襯套(5)係由相同材料製成；及該底板(3)包括可相對於該升降機系統(3a)側向移動的一頂部板(7)，及具有配置於該頂部板(7)下方之多個滾珠(9)的一滾珠固持板(8)。
  2. 如申請專利範圍第1項之銷總成，其中該滾子滑件(2)包括配置於該襯套(5)中之滾子(6)為六個。
  3. 如申請專利範圍第1項之銷總成，其中該滾子滑件(2)係安裝於一反應器底部(2a)上。
  4. 如申請專利範圍第2項之銷總成，其中該滾子滑件(2)係安裝於一反應器底部(2a)上。
  5. 如申請專利範圍第1項至第4項中任一項之銷總成，其中 該滾子滑件(2)包括由低磨耗及低摩擦之材料製成的多個滾子(6)。
  6. 如申請專利範圍第1項之銷總成，其中該滾珠固持板(8)可相對於該升降機系統(3a)側向移動。
  7. 如申請專利範圍第1項之銷總成，其中該頂部板(7)及該固持板(8)之側向移動係由彈性軸承(7a、8a)輔助達成。
  8. 如申請專利範圍第6項之銷總成，其中該頂部板(7)及該固持板(8)之側向移動係由彈性軸承(7a、8a)輔助達成。
  9. 如申請專利範圍第1項之銷總成，其中該升降銷(1)之頂端尚包括一間隙，構造成固持一滾動滾珠(14)。
  10. 如申請專利範圍第9項之銷總成，其中該滾動滾珠(14)係由一滾珠軸承(13)支撐。
  11. 如申請專利範圍第9項或第10項之銷總成，其中尚具有一扣環(12)，部份地覆蓋該間隙且防止該升降銷(1)經由該滾子滑件(2)掉落。
TW094117365A 2004-05-28 2005-05-27 用於真空室中之基板的支持及升降裝置 TWI393799B (zh)

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JP4777345B2 (ja) 2011-09-21
WO2005117097A1 (en) 2005-12-08
ES2304174T3 (es) 2008-09-16
KR20070032960A (ko) 2007-03-23
DE602005007217D1 (de) 2008-07-10
ATE397288T1 (de) 2008-06-15
EP1754254B1 (en) 2008-05-28
US20060016398A1 (en) 2006-01-26
JP2008500709A (ja) 2008-01-10
EP1754254A1 (en) 2007-02-21
TW200624587A (en) 2006-07-16

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