EP2205778B1 - Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques - Google Patents
Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques Download PDFInfo
- Publication number
- EP2205778B1 EP2205778B1 EP08804009A EP08804009A EP2205778B1 EP 2205778 B1 EP2205778 B1 EP 2205778B1 EP 08804009 A EP08804009 A EP 08804009A EP 08804009 A EP08804009 A EP 08804009A EP 2205778 B1 EP2205778 B1 EP 2205778B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- bath
- copper
- gold
- gold alloy
- cyanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- the invention relates to an electrolytic deposit in the form of a gold alloy in a thick layer and its production process.
- the object of the present invention is to overcome all or part of the disadvantages mentioned above by proposing a method for the deposition in thick layer of a yellow gold alloy having neither zinc nor cadmium as main constituents.
- the invention relates to an electrolytic deposit in the form of a gold alloy whose thickness is between 1 and 800 microns and comprises copper characterized in that it comprises indium as third main compound.
- the invention also relates to a method for the electroplating of a gold alloy on an electrode immersed in a bath comprising gold metal in the form of alkaline aurocyanide, organometallic compounds, a wetting agent, a complexing agent, a free cyanide characterized in that the alloying metals are copper in the form of copper and potassium double cyanide, and indium in aminocarboxylic or aminophosphonic complexed form for depositing on the electrode a yellow gold alloy brilliant mirror.
- the electrolysis is preferably followed by a heat treatment at least 450 degrees Celsius for at least 30 minutes to obtain an optimal quality deposit.
- the bath may further contain a brightener.
- a brightener This is preferably a butynediol derivative, a pyridinio-propanesulfonate or a mixture of both, a tin salt, sulfonated beaver oil, methylimidozole, dithiocarboxylic acid such as thiourea, thiobarbituric acid, imidazolidinthione or thiomalic acid.
- a gold alloy free of toxic metals or metalloids, in particular free of cadmium, of 2N color. yellow, with a thickness of 200 microns, excellent gloss and having a very high resistance to wear and tarnishing.
- the electrolytic bath is contained in a polypropylene or PVC tank with heat-insulating coating. Bath heating is achieved by thermo-plungers in quartz, PTFE, porcelain or stabilized stainless steel. Good cathodic stirring as well as a flow of the electrolyte must be maintained.
- the anodes are platinum titanium, stainless steel, ruthenium, iridium or alloys of the latter two.
- the bath may contain the following metals Ag, Cd, Zr, Se, Te, Sb, Sn, Ga, As, Sr, Be, Bi in negligible quantity.
- the wetting agent may be of any type capable of wetting in alkaline cyanide medium.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH01494/07A CH710184B1 (fr) | 2007-09-21 | 2007-09-21 | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
| PCT/EP2008/062042 WO2009037180A1 (fr) | 2007-09-21 | 2008-09-11 | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2205778A1 EP2205778A1 (fr) | 2010-07-14 |
| EP2205778B1 true EP2205778B1 (fr) | 2011-02-23 |
Family
ID=39967872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08804009A Active EP2205778B1 (fr) | 2007-09-21 | 2008-09-11 | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques |
Country Status (11)
| Country | Link |
|---|---|
| US (3) | US10233555B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2205778B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP5563462B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101280675B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN101815814B (cg-RX-API-DMAC7.html) |
| AT (1) | ATE499461T1 (cg-RX-API-DMAC7.html) |
| CH (1) | CH710184B1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE602008005184D1 (cg-RX-API-DMAC7.html) |
| IN (1) | IN2014CN02464A (cg-RX-API-DMAC7.html) |
| TW (2) | TWI507571B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009037180A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| CH710184B1 (fr) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
| EP2312021B1 (fr) | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques |
| EP2505691B1 (fr) * | 2011-03-31 | 2014-03-12 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N |
| ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
| WO2016020812A1 (en) * | 2014-08-04 | 2016-02-11 | Nutec International Srl | Electrolytic bath, electrolytic deposition method and item obtained with said method |
| CN109504991B (zh) * | 2019-01-21 | 2020-08-07 | 南京市产品质量监督检验院 | 一种无氰18k金电铸液、其制备方法及其应用 |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US2596454A (en) * | 1949-09-10 | 1952-05-13 | Metals & Controls Corp | Gold alloys |
| US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
| CH286123A (fr) * | 1952-05-08 | 1952-10-15 | Spreter Victor | Bain pour le dépôt par voie galvanique d'alliages d'or. |
| US2976180A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of silver plating by chemical reduction |
| FR1259407A (fr) | 1960-03-10 | 1961-04-28 | Maison Murat | Bain électrolytique pour dépôt épais d'alliage or-cuivre |
| CH455434A (de) * | 1963-08-15 | 1968-07-15 | Werner Fluehmann Galvanische A | Verfahren zur Herstellung von Weissgoldüberzügen |
| DE1460993A1 (de) | 1965-07-23 | 1970-07-23 | Kieninger & Obergfell | Elektrisches Programmsteuergeraet,vorzugsweise fuer elektrische Haushaltsgeraete,insbesondere Waschmaschinen und Geschirrspuelmaschinen |
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| GB1156186A (en) * | 1966-09-26 | 1969-06-25 | Sel Rex Corp | Gold Plating |
| DE1965768A1 (de) * | 1969-01-07 | 1970-07-30 | Western Electric Co | Elektroniederschlag von Edelmetallen |
| US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
| US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
| DE2121150C3 (de) | 1971-04-24 | 1980-08-21 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur galvanischen Abscheidung von Goldlegierungen |
| CH529843A (fr) | 1971-07-09 | 1972-10-31 | Oxy Metal Finishing Europ S A | Bain pour le dépôt électrolytique d'alliages d'or et son utilisation en galvanoplastie |
| FR2181455B1 (cg-RX-API-DMAC7.html) * | 1972-04-25 | 1974-08-30 | Parker Ste Continentale | |
| DE2244434C3 (de) * | 1972-09-06 | 1982-02-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
| US3902977A (en) * | 1973-12-13 | 1975-09-02 | Engelhard Min & Chem | Gold plating solutions and method |
| CH621367A5 (en) | 1977-07-08 | 1981-01-30 | Systemes Traitements Surfaces | Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty |
| CH622829A5 (cg-RX-API-DMAC7.html) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
| FR2405312A1 (fr) * | 1977-10-10 | 1979-05-04 | Oxy Metal Industries Corp | Bains electrolytiques pour le depot d'alliages d'or |
| US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
| DE3020765A1 (de) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten |
| GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
| US4626324A (en) | 1984-04-30 | 1986-12-02 | Allied Corporation | Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards |
| CH662583A5 (fr) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. |
| JPS62164890A (ja) | 1986-01-16 | 1987-07-21 | Seiko Instr & Electronics Ltd | 金銀銅合金めつき液 |
| EP0304315B1 (en) * | 1987-08-21 | 1993-03-03 | Engelhard Limited | Bath for electrolytic deposition of a gold-copper-zinc alloy |
| JPH01247540A (ja) | 1988-03-29 | 1989-10-03 | Seiko Instr Inc | 硬質金合金外装部品の製造方法 |
| GB8903818D0 (en) * | 1989-02-20 | 1989-04-05 | Engelhard Corp | Electrolytic deposition of gold-containing alloys |
| DE3929569C1 (cg-RX-API-DMAC7.html) * | 1989-09-06 | 1991-04-18 | Degussa Ag, 6000 Frankfurt, De | |
| GB2242200B (en) | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
| CH680927A5 (cg-RX-API-DMAC7.html) | 1990-10-08 | 1992-12-15 | Metaux Precieux Sa | |
| US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
| US5244593A (en) * | 1992-01-10 | 1993-09-14 | The Procter & Gamble Company | Colorless detergent compositions with enhanced stability |
| US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
| US5340529A (en) * | 1993-07-01 | 1994-08-23 | Dewitt Troy C | Gold jewelry alloy |
| CN1200774A (zh) * | 1995-11-03 | 1998-12-02 | 恩索恩Omi公司 | 电镀方法、组合物和沉积物 |
| DE19629658C2 (de) | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
| WO2000079031A1 (de) * | 1999-06-17 | 2000-12-28 | Degussa Galvanotechnik Gmbh | Saures bad zur galvanischen abscheidung von glänzenden gold- und goldlegierungsschichten und glanzzusatz hierfür |
| JP2001198693A (ja) | 2000-01-17 | 2001-07-24 | Ishifuku Metal Ind Co Ltd | 工業用及び宝飾用金ろう |
| JP4023138B2 (ja) * | 2001-02-07 | 2007-12-19 | 日立金属株式会社 | 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石 |
| FR2828889B1 (fr) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
| EP1548525B2 (fr) * | 2003-12-23 | 2017-08-16 | Rolex Sa | Elément en céramique pour boîte de montre et procédé de fabrication de cet élément |
| JP4566667B2 (ja) * | 2004-01-16 | 2010-10-20 | キヤノン株式会社 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
| JP2005214903A (ja) * | 2004-01-30 | 2005-08-11 | Kawaguchiko Seimitsu Co Ltd | 指標付き文字板の製造方法及びその製造方法を用いて製造した指標付き文字板。 |
| SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
-
2007
- 2007-09-21 CH CH01494/07A patent/CH710184B1/fr unknown
-
2008
- 2008-09-11 WO PCT/EP2008/062042 patent/WO2009037180A1/fr not_active Ceased
- 2008-09-11 CN CN200880107881XA patent/CN101815814B/zh active Active
- 2008-09-11 IN IN2464CHN2014 patent/IN2014CN02464A/en unknown
- 2008-09-11 EP EP08804009A patent/EP2205778B1/fr active Active
- 2008-09-11 AT AT08804009T patent/ATE499461T1/de not_active IP Right Cessation
- 2008-09-11 JP JP2010525308A patent/JP5563462B2/ja active Active
- 2008-09-11 DE DE602008005184T patent/DE602008005184D1/de active Active
- 2008-09-11 US US12/678,984 patent/US10233555B2/en active Active
- 2008-09-11 KR KR1020107008598A patent/KR101280675B1/ko active Active
- 2008-09-17 TW TW103113847A patent/TWI507571B/zh active
- 2008-09-17 TW TW097135667A patent/TWI441959B/zh active
-
2014
- 2014-04-03 US US14/244,071 patent/US9683303B2/en active Active
- 2014-06-12 JP JP2014121169A patent/JP5887381B2/ja active Active
-
2019
- 2019-01-28 US US16/259,444 patent/US10619260B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140299481A1 (en) | 2014-10-09 |
| DE602008005184D1 (de) | 2011-04-07 |
| TW201428143A (zh) | 2014-07-16 |
| EP2205778A1 (fr) | 2010-07-14 |
| TWI441959B (zh) | 2014-06-21 |
| HK1147782A1 (en) | 2011-08-19 |
| KR20100075935A (ko) | 2010-07-05 |
| US10619260B2 (en) | 2020-04-14 |
| JP5887381B2 (ja) | 2016-03-16 |
| ATE499461T1 (de) | 2011-03-15 |
| CN101815814B (zh) | 2012-05-16 |
| US9683303B2 (en) | 2017-06-20 |
| WO2009037180A1 (fr) | 2009-03-26 |
| JP2010539335A (ja) | 2010-12-16 |
| JP2014194087A (ja) | 2014-10-09 |
| US20100206739A1 (en) | 2010-08-19 |
| US10233555B2 (en) | 2019-03-19 |
| CN101815814A (zh) | 2010-08-25 |
| US20190153608A1 (en) | 2019-05-23 |
| KR101280675B1 (ko) | 2013-07-01 |
| TWI507571B (zh) | 2015-11-11 |
| TW200930844A (en) | 2009-07-16 |
| CH710184B1 (fr) | 2016-03-31 |
| JP5563462B2 (ja) | 2014-07-30 |
| IN2014CN02464A (cg-RX-API-DMAC7.html) | 2015-08-07 |
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