EP1918426A1 - Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten - Google Patents

Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten Download PDF

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Publication number
EP1918426A1
EP1918426A1 EP06021174A EP06021174A EP1918426A1 EP 1918426 A1 EP1918426 A1 EP 1918426A1 EP 06021174 A EP06021174 A EP 06021174A EP 06021174 A EP06021174 A EP 06021174A EP 1918426 A1 EP1918426 A1 EP 1918426A1
Authority
EP
European Patent Office
Prior art keywords
silver
electrolyte composition
sulfonic acid
composition according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06021174A
Other languages
German (de)
English (en)
French (fr)
Inventor
Stefan Schäfer
Thomas Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to EP06021174A priority Critical patent/EP1918426A1/de
Priority to JP2009531764A priority patent/JP5439181B2/ja
Priority to KR1020097009568A priority patent/KR101409701B1/ko
Priority to CN2007800454144A priority patent/CN101627150B/zh
Priority to PCT/EP2007/008780 priority patent/WO2008043528A2/de
Priority to EP07818853.9A priority patent/EP2089561B1/de
Priority to US12/445,049 priority patent/US9212427B2/en
Publication of EP1918426A1 publication Critical patent/EP1918426A1/de
Priority to US14/962,863 priority patent/US9657402B2/en
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver

Definitions

  • the present invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate. Moreover, the present invention relates to a method of depositing such layers using the cyanide-free electrolyte composition of the present invention.
  • Galvanic electrolyte compositions for the deposition of silver or silver alloy layers are known both for use in the field of decorative surfaces and in the technical field. It is customary in the prior art to use soluble silver compounds, usually in the form of cyanide compounds such as potassium silver cyanide or in the form of sulfur-containing complexes such as sulfite, thiosulfate or thiocyanate and ammonium complexes.
  • soluble silver compounds usually in the form of cyanide compounds such as potassium silver cyanide or in the form of sulfur-containing complexes such as sulfite, thiosulfate or thiocyanate and ammonium complexes.
  • electrolyte compositions are generally unstable without the addition of other complexing or stabilizing agents, it is customary to use the complexing agent components in excess, so that such electrolyte compositions often have very high cyanide, sulfur-containing complexing agent or ammonium concentrations.
  • the electrolyte compositions produced in this way are characterized by a wide range of applications. Cyanidic compositions are stable but toxic and therefore of environmental concern. The others mentioned have a lower risk potential, but tend to instability. Despite the significantly lower risk potential with respect to cyanides, the environmental relevance contained in such electrolyte compositions is not negligible and, because of their allergenic potential, can pose a threat to persons working with these electrolyte compositions.
  • a low-pollutant to pollutant-free aqueous electrolyte composition for the electrodeposition of noble metals and noble metal alloys, which have to be deposited noble metal and optionally used alloying metals in the form of water-soluble compounds of protein amino acids or their salts or in the form of sulfonic acid compounds.
  • the electrolyte compositions according to the DE 199 28 47 A1 have these water-soluble nitro compounds. These may be, for example, 3-nitrophthalic acid, 4-nitrophthalic acid or m-nitrobenzenesulfonic acid.
  • these may include organic acids such as nicotinic acid or succinic acid.
  • cyanide-free electrolyte compositions are known for depositing silver or silver alloys comprising silver in the form of imides of organic dicarboxylic acids.
  • the reaction products of water-soluble silver salts with pyrrolidinediones may serve as silver sources in corresponding electrolyte compositions.
  • silver can be used in the form of succinimides or maleimides.
  • U.S. Patent No. 4,246,077 discloses the use of silver in the form of pyrrolidinediones as silver source in corresponding electrolyte compositions for depositing silver or silver alloy layers.
  • the U.S. Patent 5,601,696 discloses the use of hydantoin as a complexing reagent in electrolyte compositions for depositing silver or silver alloy layers on substrates.
  • hydantoin as a complexing reagent in electrolyte compositions for depositing silver or silver alloy layers on substrates.
  • 1-methylhydantoin, 1,3-dimethylhydantoin, 5,5-dimethylhydantoin, 1-methanol-5,5-dimethylhydantoin or also 5,5-diphenylhydantoin can be used as complexing reagents.
  • WO 2005/083156 discloses a hydantoin-containing electrolyte composition for depositing also mirror-finished silver or silver alloy layers.
  • these electrolyte compositions have other environmentally harmful compounds such as 2,2'-bipyridine.
  • 2,2'-bipyridine can lead to an inhibition of carboxypeptidases, which play a crucial role, for example, in the digestion of proteins in the small intestine, which justifies the toxicity of this class of compounds and requires extremely careful handling of these compounds.
  • a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate containing at least a silver ion source, a sulfonic acid and / or a derivative of a sulfonic acid, a wetting agent and a hydantoin of the general formula wherein R 1 and R 2 independently of one another may be an H, an alkyl group having 1 to 5 carbon atoms or a substituted or unsubstituted aryl group.
  • the electrolyte composition according to the invention comprises the sulfonic acid and / or a derivative of a sulfonic acid in a concentration between 50 g / l and 500 g / l, preferably between 100 g / l and 300 g / l, more preferably between 130 g / l and 200 g / l ,
  • the electrolyte composition according to the invention preferably comprises potassium methanesulfonate.
  • methanesulfonates such as, for example, sodium methanesulfonate, but also sulfates and other compounds suitable as electrolyte salt are suitable for use in the electrolyte composition according to the invention.
  • the electrolyte composition of the invention may have a silver concentration between 10 to 50 g / l, preferably between 20 and 40 g / l, more preferably between 25 and 35 g / l.
  • the electrolyte composition of the present invention has at least one silver salt of a sulfonic acid.
  • other silver ion sources may include inorganic silver salts selected from the group consisting of silver oxide, silver nitrate and silver sulfate in the electrolyte composition.
  • the electrolyte composition of the present invention may have corresponding sources of alloy metal ions.
  • corresponding alloying metals are used in the form of their sulfonic acid salts, oxides, nitrates or sulfates.
  • the electrolyte composition according to the invention may for example comprise a naphthalenesulfonic acid-formaldehyde polycondensate and / or a sulfopropylated polyalkoxylated naphthol.
  • the electrolyte composition may comprise other wetting agents or surfactants.
  • the pH of the electrolyte composition of the invention is between pH 8 and pH 14, preferably between pH 9.0 and pH 12.5, more preferably between pH 9.5 and pH 12.0.
  • the object is achieved by a method for depositing a silver or silver alloy layer on a substrate , wherein the substrate to be coated at a set current density between 0.1 and 1 A / dm 2 , preferably 0.3 to 0.8 A. / dm 2 is contacted with the electrolyte composition according to the invention.
  • the deposition of lustrous, ductile silver or silver alloy layers in a wide range of applications is possible.
  • layers for applications in the jewelery, electronics or automotive industry can be deposited with the aid of the electrolyte composition according to the invention.
  • inventive method and the electrolyte composition of the invention are particularly applicable to suitable substrates such as gold-plated, nickel-plated and other, not prone to sedimentation sheets.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP06021174A 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten Withdrawn EP1918426A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
EP06021174A EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
JP2009531764A JP5439181B2 (ja) 2006-10-09 2007-10-09 基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法
KR1020097009568A KR101409701B1 (ko) 2006-10-09 2007-10-09 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법
CN2007800454144A CN101627150B (zh) 2006-10-09 2007-10-09 无氰电解液组合物及在基板沉积银或银合金镀层的方法
PCT/EP2007/008780 WO2008043528A2 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten
EP07818853.9A EP2089561B1 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten
US12/445,049 US9212427B2 (en) 2006-10-09 2007-10-09 Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
US14/962,863 US9657402B2 (en) 2006-10-09 2015-12-08 Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06021174A EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten

Publications (1)

Publication Number Publication Date
EP1918426A1 true EP1918426A1 (de) 2008-05-07

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
EP06021174A Withdrawn EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
EP07818853.9A Active EP2089561B1 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP07818853.9A Active EP2089561B1 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten

Country Status (6)

Country Link
US (2) US9212427B2 (enExample)
EP (2) EP1918426A1 (enExample)
JP (1) JP5439181B2 (enExample)
KR (1) KR101409701B1 (enExample)
CN (1) CN101627150B (enExample)
WO (1) WO2008043528A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009029558A1 (de) 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
RU2536127C2 (ru) * 2010-03-09 2014-12-20 Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" Кислый электролит для серебрения
DE102015008686A1 (de) 2015-07-02 2017-01-05 ORU e.V. Cyanidfreie, wässrige elektrolytische Zusammensetzung

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
EP2431501B1 (en) 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Method of electroplating silver strike over nickel
KR20150131346A (ko) * 2013-03-15 2015-11-24 엔쏜 인코포레이티드 플루오로중합체 나노입자로 은의 전착
CN105420770A (zh) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 一种防变色无氰镀银电镀液及其电镀方法
CN105350037A (zh) * 2015-12-17 2016-02-24 宏正(福建)化学品有限公司 一种碱性无氰镀锌镍合金镀液及其电镀工艺
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
EP3841233A1 (de) * 2018-08-21 2021-06-30 Umicore Galvanotechnik GmbH Elektrolyt für die cyanidfreie abscheidung von silber
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations
CN121472943A (zh) * 2024-08-06 2026-02-06 华为技术有限公司 电镀金银合金的电镀液及其应用

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JPH06330372A (ja) * 1993-05-20 1994-11-29 Electroplating Eng Of Japan Co ノンシアン銀めっき浴及びその銀めっき方法
JPH1121693A (ja) * 1997-07-01 1999-01-26 Daiwa Kasei Kenkyusho:Kk 錫−銀合金めっき浴及びめっき物
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
WO2005083156A1 (en) * 2004-02-24 2005-09-09 Technic, Inc. Non-cyanide silver plating bath composition

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JPH06330372A (ja) * 1993-05-20 1994-11-29 Electroplating Eng Of Japan Co ノンシアン銀めっき浴及びその銀めっき方法
JPH1121693A (ja) * 1997-07-01 1999-01-26 Daiwa Kasei Kenkyusho:Kk 錫−銀合金めっき浴及びめっき物
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
WO2005083156A1 (en) * 2004-02-24 2005-09-09 Technic, Inc. Non-cyanide silver plating bath composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009029558A1 (de) 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
EP2309035A1 (de) 2009-09-17 2011-04-13 SCHOTT Solar AG Elektrolytzusammensetzung
CN102021613A (zh) * 2009-09-17 2011-04-20 肖特太阳能控股公司 电解质组合物
CN102021613B (zh) * 2009-09-17 2015-09-30 肖特太阳能控股公司 电解质组合物
RU2536127C2 (ru) * 2010-03-09 2014-12-20 Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" Кислый электролит для серебрения
DE102015008686A1 (de) 2015-07-02 2017-01-05 ORU e.V. Cyanidfreie, wässrige elektrolytische Zusammensetzung

Also Published As

Publication number Publication date
JP5439181B2 (ja) 2014-03-12
US9657402B2 (en) 2017-05-23
EP2089561B1 (de) 2016-03-09
CN101627150B (zh) 2011-06-22
US20160122890A1 (en) 2016-05-05
US9212427B2 (en) 2015-12-15
JP2010506048A (ja) 2010-02-25
KR101409701B1 (ko) 2014-06-19
US20100044239A1 (en) 2010-02-25
EP2089561A2 (de) 2009-08-19
KR20090073220A (ko) 2009-07-02
WO2008043528A3 (de) 2009-04-16
WO2008043528A2 (de) 2008-04-17
CN101627150A (zh) 2010-01-13

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