WO2008043528A3 - Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten - Google Patents
Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten Download PDFInfo
- Publication number
- WO2008043528A3 WO2008043528A3 PCT/EP2007/008780 EP2007008780W WO2008043528A3 WO 2008043528 A3 WO2008043528 A3 WO 2008043528A3 EP 2007008780 W EP2007008780 W EP 2007008780W WO 2008043528 A3 WO2008043528 A3 WO 2008043528A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silver
- electrolyte composition
- cyanide
- substrates
- deposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/445,049 US9212427B2 (en) | 2006-10-09 | 2007-10-09 | Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates |
JP2009531764A JP5439181B2 (ja) | 2006-10-09 | 2007-10-09 | 基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法 |
EP07818853.9A EP2089561B1 (de) | 2006-10-09 | 2007-10-09 | Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten |
KR1020097009568A KR101409701B1 (ko) | 2006-10-09 | 2007-10-09 | 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법 |
CN2007800454144A CN101627150B (zh) | 2006-10-09 | 2007-10-09 | 无氰电解液组合物及在基板沉积银或银合金镀层的方法 |
US14/962,863 US9657402B2 (en) | 2006-10-09 | 2015-12-08 | Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06021174A EP1918426A1 (de) | 2006-10-09 | 2006-10-09 | Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten |
EP06021174.5 | 2006-10-09 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/445,049 A-371-Of-International US9212427B2 (en) | 2006-10-09 | 2007-10-09 | Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates |
US14/962,863 Continuation US9657402B2 (en) | 2006-10-09 | 2015-12-08 | Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008043528A2 WO2008043528A2 (de) | 2008-04-17 |
WO2008043528A3 true WO2008043528A3 (de) | 2009-04-16 |
Family
ID=37806683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/008780 WO2008043528A2 (de) | 2006-10-09 | 2007-10-09 | Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten |
Country Status (6)
Country | Link |
---|---|
US (2) | US9212427B2 (de) |
EP (2) | EP1918426A1 (de) |
JP (1) | JP5439181B2 (de) |
KR (1) | KR101409701B1 (de) |
CN (1) | CN101627150B (de) |
WO (1) | WO2008043528A2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1918426A1 (de) * | 2006-10-09 | 2008-05-07 | Enthone, Inc. | Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten |
DE102009029558A1 (de) * | 2009-09-17 | 2011-03-31 | Schott Solar Ag | Elektrolytzusammensetzung |
RU2536127C2 (ru) * | 2010-03-09 | 2014-12-20 | Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" | Кислый электролит для серебрения |
JP5854726B2 (ja) | 2010-09-21 | 2016-02-09 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | ニッケル上に銀ストライクを電気めっきする方法 |
EP2971263A1 (de) * | 2013-03-15 | 2016-01-20 | Enthone, Inc. | Elektrolytische abscheidung von silber mit fluorpolymernanopartikeln |
DE102015008686A1 (de) | 2015-07-02 | 2017-01-05 | ORU e.V. | Cyanidfreie, wässrige elektrolytische Zusammensetzung |
CN105420770A (zh) * | 2015-11-30 | 2016-03-23 | 苏州市金星工艺镀饰有限公司 | 一种防变色无氰镀银电镀液及其电镀方法 |
CN105350037A (zh) * | 2015-12-17 | 2016-02-24 | 宏正(福建)化学品有限公司 | 一种碱性无氰镀锌镍合金镀液及其电镀工艺 |
DE102019106004B4 (de) * | 2019-03-08 | 2023-11-30 | Umicore Galvanotechnik Gmbh | Additiv für die cyanidfreie Abscheidung von Silber |
CN112469847A (zh) | 2018-08-21 | 2021-03-09 | 优美科电镀技术有限公司 | 用于银的无氰化物沉积的电解质 |
US11578418B2 (en) * | 2021-03-29 | 2023-02-14 | Rohm And Haas Electronic Materials Llc (Rhem) | Silver electroplating compositions and methods for electroplating silver with low coefficients of friction |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU724606A1 (ru) * | 1978-03-20 | 1980-03-30 | Институт общей и неорганической химии АН Украинской ССР | Электролит серебрени |
JPH0361393A (ja) * | 1989-07-28 | 1991-03-18 | Daiichi Koushiyou Kk | 銀めっき法 |
JPH06330372A (ja) * | 1993-05-20 | 1994-11-29 | Electroplating Eng Of Japan Co | ノンシアン銀めっき浴及びその銀めっき方法 |
JPH1121693A (ja) * | 1997-07-01 | 1999-01-26 | Daiwa Kasei Kenkyusho:Kk | 錫−銀合金めっき浴及びめっき物 |
JPH11302893A (ja) * | 1998-04-22 | 1999-11-02 | Okuno Chem Ind Co Ltd | 非シアン系電気銀めっき液 |
WO2005083156A1 (en) * | 2004-02-24 | 2005-09-09 | Technic, Inc. | Non-cyanide silver plating bath composition |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126524A (en) | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
US4246077A (en) | 1975-03-12 | 1981-01-20 | Technic, Inc. | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds |
US4161432A (en) * | 1975-12-03 | 1979-07-17 | International Business Machines Corporation | Electroplating chromium and its alloys |
JPS5293638A (en) * | 1976-02-04 | 1977-08-06 | Hitachi Ltd | Silver plating solution |
US4461680A (en) * | 1983-12-30 | 1984-07-24 | The United States Of America As Represented By The Secretary Of Commerce | Process and bath for electroplating nickel-chromium alloys |
JPH08104993A (ja) * | 1994-10-04 | 1996-04-23 | Electroplating Eng Of Japan Co | 銀めっき浴及びその銀めっき方法 |
JP3481020B2 (ja) * | 1995-09-07 | 2003-12-22 | ディップソール株式会社 | Sn−Bi系合金めっき浴 |
US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
JPH10121289A (ja) * | 1996-10-18 | 1998-05-12 | Electroplating Eng Of Japan Co | 非シアン系銀めっき浴 |
CN1163633C (zh) | 1997-10-02 | 2004-08-25 | 戈尔德施米特股份公司 | 制备银化合物的方法 |
US6210556B1 (en) * | 1998-02-12 | 2001-04-03 | Learonal, Inc. | Electrolyte and tin-silver electroplating process |
US7628903B1 (en) * | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
DE10026680C1 (de) | 2000-05-30 | 2002-02-21 | Schloetter Fa Dr Ing Max | Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten |
DE10124631C1 (de) * | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
US20030159938A1 (en) * | 2002-02-15 | 2003-08-28 | George Hradil | Electroplating solution containing organic acid complexing agent |
JP3883561B2 (ja) * | 2003-03-05 | 2007-02-21 | Tdk株式会社 | 希土類磁石の製造方法 |
CN100355944C (zh) * | 2005-01-17 | 2007-12-19 | 上海大学 | 用于无氰镀银的光亮剂及其制备方法 |
EP1918426A1 (de) * | 2006-10-09 | 2008-05-07 | Enthone, Inc. | Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten |
-
2006
- 2006-10-09 EP EP06021174A patent/EP1918426A1/de not_active Withdrawn
-
2007
- 2007-10-09 WO PCT/EP2007/008780 patent/WO2008043528A2/de active Application Filing
- 2007-10-09 CN CN2007800454144A patent/CN101627150B/zh active Active
- 2007-10-09 US US12/445,049 patent/US9212427B2/en active Active
- 2007-10-09 JP JP2009531764A patent/JP5439181B2/ja active Active
- 2007-10-09 EP EP07818853.9A patent/EP2089561B1/de active Active
- 2007-10-09 KR KR1020097009568A patent/KR101409701B1/ko active IP Right Grant
-
2015
- 2015-12-08 US US14/962,863 patent/US9657402B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU724606A1 (ru) * | 1978-03-20 | 1980-03-30 | Институт общей и неорганической химии АН Украинской ССР | Электролит серебрени |
JPH0361393A (ja) * | 1989-07-28 | 1991-03-18 | Daiichi Koushiyou Kk | 銀めっき法 |
JPH06330372A (ja) * | 1993-05-20 | 1994-11-29 | Electroplating Eng Of Japan Co | ノンシアン銀めっき浴及びその銀めっき方法 |
JPH1121693A (ja) * | 1997-07-01 | 1999-01-26 | Daiwa Kasei Kenkyusho:Kk | 錫−銀合金めっき浴及びめっき物 |
JPH11302893A (ja) * | 1998-04-22 | 1999-11-02 | Okuno Chem Ind Co Ltd | 非シアン系電気銀めっき液 |
WO2005083156A1 (en) * | 2004-02-24 | 2005-09-09 | Technic, Inc. | Non-cyanide silver plating bath composition |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Week 198045, Derwent World Patents Index; AN 1980-80449C, XP002515484 * |
Also Published As
Publication number | Publication date |
---|---|
JP2010506048A (ja) | 2010-02-25 |
KR101409701B1 (ko) | 2014-06-19 |
US9657402B2 (en) | 2017-05-23 |
WO2008043528A2 (de) | 2008-04-17 |
JP5439181B2 (ja) | 2014-03-12 |
CN101627150A (zh) | 2010-01-13 |
EP1918426A1 (de) | 2008-05-07 |
EP2089561B1 (de) | 2016-03-09 |
EP2089561A2 (de) | 2009-08-19 |
KR20090073220A (ko) | 2009-07-02 |
US9212427B2 (en) | 2015-12-15 |
US20100044239A1 (en) | 2010-02-25 |
CN101627150B (zh) | 2011-06-22 |
US20160122890A1 (en) | 2016-05-05 |
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