KR101409701B1 - 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법 - Google Patents

은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법 Download PDF

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KR101409701B1
KR101409701B1 KR1020097009568A KR20097009568A KR101409701B1 KR 101409701 B1 KR101409701 B1 KR 101409701B1 KR 1020097009568 A KR1020097009568 A KR 1020097009568A KR 20097009568 A KR20097009568 A KR 20097009568A KR 101409701 B1 KR101409701 B1 KR 101409701B1
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electrolyte composition
silver
cyanide
free
potassium
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Korean (ko)
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KR20090073220A (ko
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스테판 샤퍼
토마스 리처드슨
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엔쏜 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020097009568A 2006-10-09 2007-10-09 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법 Active KR101409701B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06021174.5 2006-10-09
EP06021174A EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
PCT/EP2007/008780 WO2008043528A2 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten

Publications (2)

Publication Number Publication Date
KR20090073220A KR20090073220A (ko) 2009-07-02
KR101409701B1 true KR101409701B1 (ko) 2014-06-19

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KR1020097009568A Active KR101409701B1 (ko) 2006-10-09 2007-10-09 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법

Country Status (6)

Country Link
US (2) US9212427B2 (enExample)
EP (2) EP1918426A1 (enExample)
JP (1) JP5439181B2 (enExample)
KR (1) KR101409701B1 (enExample)
CN (1) CN101627150B (enExample)
WO (1) WO2008043528A2 (enExample)

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EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
DE102009029558A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
RU2536127C2 (ru) * 2010-03-09 2014-12-20 Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" Кислый электролит для серебрения
SG179381A1 (en) 2010-09-21 2012-04-27 Rohm & Haas Elect Mat Method of electroplating silver strike over nickel
WO2014144180A1 (en) * 2013-03-15 2014-09-18 Enthone Inc. Electrodeposition of silver with fluoropolymer nanoparticles
DE102015008686A1 (de) 2015-07-02 2017-01-05 ORU e.V. Cyanidfreie, wässrige elektrolytische Zusammensetzung
CN105420770A (zh) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 一种防变色无氰镀银电镀液及其电镀方法
CN105350037A (zh) * 2015-12-17 2016-02-24 宏正（福建）化学品有限公司 一种碱性无氰镀锌镍合金镀液及其电镀工艺
MY203013A (en) 2018-08-21 2024-06-04 Umicore Galvanotechnik Gmbh Electrolyte for the cyanide-free deposition of silver
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations
CN121472943A (zh) * 2024-08-06 2026-02-06 华为技术有限公司 电镀金银合金的电镀液及其应用

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JPH0361393A (ja) * 1989-07-28 1991-03-18 Daiichi Koushiyou Kk 銀めっき法
WO2005083156A1 (en) * 2004-02-24 2005-09-09 Technic, Inc. Non-cyanide silver plating bath composition

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US4246077A (en) 1975-03-12 1981-01-20 Technic, Inc. Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
US4161432A (en) * 1975-12-03 1979-07-17 International Business Machines Corporation Electroplating chromium and its alloys
JPS5293638A (en) * 1976-02-04 1977-08-06 Hitachi Ltd Silver plating solution
SU724606A1 (ru) * 1978-03-20 1980-03-30 Институт общей и неорганической химии АН Украинской ССР Электролит серебрени
US4461680A (en) * 1983-12-30 1984-07-24 The United States Of America As Represented By The Secretary Of Commerce Process and bath for electroplating nickel-chromium alloys
JP3224454B2 (ja) * 1993-05-20 2001-10-29 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン銀めっき浴及びその銀めっき方法
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法
JP3481020B2 (ja) * 1995-09-07 2003-12-22 ディップソール株式会社 Ｓｎ−Ｂｉ系合金めっき浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JPH10121289A (ja) * 1996-10-18 1998-05-12 Electroplating Eng Of Japan Co 非シアン系銀めっき浴
JP3782869B2 (ja) * 1997-07-01 2006-06-07 株式会社大和化成研究所 錫−銀合金めっき浴
CN1163633C (zh) 1997-10-02 2004-08-25 戈尔德施米特股份公司 制备银化合物的方法
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
DE10026680C1 (de) 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
US20030159938A1 (en) * 2002-02-15 2003-08-28 George Hradil Electroplating solution containing organic acid complexing agent
KR100738840B1 (ko) * 2003-03-05 2007-07-12 티디케이가부시기가이샤 희토류 자석의 제조방법 및 도금욕
CN100355944C (zh) * 2005-01-17 2007-12-19 上海大学 用于无氰镀银的光亮剂及其制备方法
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361393A (ja) * 1989-07-28 1991-03-18 Daiichi Koushiyou Kk 銀めっき法
WO2005083156A1 (en) * 2004-02-24 2005-09-09 Technic, Inc. Non-cyanide silver plating bath composition

Also Published As

Publication number Publication date
JP5439181B2 (ja) 2014-03-12
WO2008043528A2 (de) 2008-04-17
US9657402B2 (en) 2017-05-23
US20160122890A1 (en) 2016-05-05
JP2010506048A (ja) 2010-02-25
EP1918426A1 (de) 2008-05-07
KR20090073220A (ko) 2009-07-02
WO2008043528A3 (de) 2009-04-16
US9212427B2 (en) 2015-12-15
EP2089561B1 (de) 2016-03-09
CN101627150B (zh) 2011-06-22
EP2089561A2 (de) 2009-08-19
CN101627150A (zh) 2010-01-13
US20100044239A1 (en) 2010-02-25

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