CN101627150B - 无氰电解液组合物及在基板沉积银或银合金镀层的方法 - Google Patents

无氰电解液组合物及在基板沉积银或银合金镀层的方法 Download PDF

Info

Publication number
CN101627150B
CN101627150B CN2007800454144A CN200780045414A CN101627150B CN 101627150 B CN101627150 B CN 101627150B CN 2007800454144 A CN2007800454144 A CN 2007800454144A CN 200780045414 A CN200780045414 A CN 200780045414A CN 101627150 B CN101627150 B CN 101627150B
Authority
CN
China
Prior art keywords
silver
electrolyte composition
concentration
substrate
potassium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2007800454144A
Other languages
English (en)
Chinese (zh)
Other versions
CN101627150A (zh
Inventor
史蒂芬·谢弗
汤玛斯·理察德森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of CN101627150A publication Critical patent/CN101627150A/zh
Application granted granted Critical
Publication of CN101627150B publication Critical patent/CN101627150B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN2007800454144A 2006-10-09 2007-10-09 无氰电解液组合物及在基板沉积银或银合金镀层的方法 Active CN101627150B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06021174A EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
EP06021174.5 2006-10-09
PCT/EP2007/008780 WO2008043528A2 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten

Publications (2)

Publication Number Publication Date
CN101627150A CN101627150A (zh) 2010-01-13
CN101627150B true CN101627150B (zh) 2011-06-22

Family

ID=37806683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800454144A Active CN101627150B (zh) 2006-10-09 2007-10-09 无氰电解液组合物及在基板沉积银或银合金镀层的方法

Country Status (6)

Country Link
US (2) US9212427B2 (enExample)
EP (2) EP1918426A1 (enExample)
JP (1) JP5439181B2 (enExample)
KR (1) KR101409701B1 (enExample)
CN (1) CN101627150B (enExample)
WO (1) WO2008043528A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105350037A (zh) * 2015-12-17 2016-02-24 宏正（福建）化学品有限公司 一种碱性无氰镀锌镍合金镀液及其电镀工艺

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
DE102009029558A1 (de) 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
RU2536127C2 (ru) * 2010-03-09 2014-12-20 Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" Кислый электролит для серебрения
EP2431501B1 (en) 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Method of electroplating silver strike over nickel
KR20150131346A (ko) * 2013-03-15 2015-11-24 엔쏜 인코포레이티드 플루오로중합체 나노입자로 은의 전착
DE102015008686A1 (de) 2015-07-02 2017-01-05 ORU e.V. Cyanidfreie, wässrige elektrolytische Zusammensetzung
CN105420770A (zh) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 一种防变色无氰镀银电镀液及其电镀方法
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
EP3841233A1 (de) * 2018-08-21 2021-06-30 Umicore Galvanotechnik GmbH Elektrolyt für die cyanidfreie abscheidung von silber
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations
CN121472943A (zh) * 2024-08-06 2026-02-06 华为技术有限公司 电镀金银合金的电镀液及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1126250A (zh) * 1994-10-04 1996-07-10 日本电镀工程股份有限公司 镀银浴及使用该镀银浴的镀银方法
CN1676673A (zh) * 2005-01-17 2005-10-05 上海大学 用于无氰镀银的光亮剂及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4126524A (en) 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
US4246077A (en) * 1975-03-12 1981-01-20 Technic, Inc. Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
US4161432A (en) * 1975-12-03 1979-07-17 International Business Machines Corporation Electroplating chromium and its alloys
JPS5293638A (en) * 1976-02-04 1977-08-06 Hitachi Ltd Silver plating solution
SU724606A1 (ru) * 1978-03-20 1980-03-30 Институт общей и неорганической химии АН Украинской ССР Электролит серебрени
US4461680A (en) * 1983-12-30 1984-07-24 The United States Of America As Represented By The Secretary Of Commerce Process and bath for electroplating nickel-chromium alloys
JPH0361393A (ja) * 1989-07-28 1991-03-18 Daiichi Koushiyou Kk 銀めっき法
JP3224454B2 (ja) * 1993-05-20 2001-10-29 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン銀めっき浴及びその銀めっき方法
JP3481020B2 (ja) * 1995-09-07 2003-12-22 ディップソール株式会社 Ｓｎ−Ｂｉ系合金めっき浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JPH10121289A (ja) * 1996-10-18 1998-05-12 Electroplating Eng Of Japan Co 非シアン系銀めっき浴
JP3782869B2 (ja) * 1997-07-01 2006-06-07 株式会社大和化成研究所 錫−銀合金めっき浴
CN1163633C (zh) * 1997-10-02 2004-08-25 戈尔德施米特股份公司 制备银化合物的方法
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
DE10026680C1 (de) * 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
US20030159938A1 (en) * 2002-02-15 2003-08-28 George Hradil Electroplating solution containing organic acid complexing agent
WO2004079055A1 (ja) * 2003-03-05 2004-09-16 Tdk Corporation 希土類磁石の製造方法およびめっき浴
US20050183961A1 (en) * 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1126250A (zh) * 1994-10-04 1996-07-10 日本电镀工程股份有限公司 镀银浴及使用该镀银浴的镀银方法
CN1676673A (zh) * 2005-01-17 2005-10-05 上海大学 用于无氰镀银的光亮剂及其制备方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开平11-21693A 1999.01.26
JP特开平11-302893A 1999.11.02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105350037A (zh) * 2015-12-17 2016-02-24 宏正（福建）化学品有限公司 一种碱性无氰镀锌镍合金镀液及其电镀工艺

Also Published As

Publication number Publication date
JP5439181B2 (ja) 2014-03-12
US9657402B2 (en) 2017-05-23
EP2089561B1 (de) 2016-03-09
US20160122890A1 (en) 2016-05-05
US9212427B2 (en) 2015-12-15
JP2010506048A (ja) 2010-02-25
EP1918426A1 (de) 2008-05-07
KR101409701B1 (ko) 2014-06-19
US20100044239A1 (en) 2010-02-25
EP2089561A2 (de) 2009-08-19
KR20090073220A (ko) 2009-07-02
WO2008043528A3 (de) 2009-04-16
WO2008043528A2 (de) 2008-04-17
CN101627150A (zh) 2010-01-13

Similar Documents

Publication Publication Date Title
US9212427B2 (en) Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
CN101838828B (zh) 一种无氰镀金电镀液
US6165342A (en) Cyanide-free electroplating bath for the deposition of gold and gold alloys
JP2010506048A5 (enExample)
CN108138346B (zh) 用于电化学沉积Cu-Sn-Zn-Pd合金的电镀浴、所述合金的电化学沉积方法、包含所述合金的基材和基材的用途
CN103806060A (zh) 一种提高镀银层与基体结合力的电镀方法
CN101260549B (zh) 一种无预镀型无氰镀银电镀液
CN102021613A (zh) 电解质组合物
JP5887381B2 (ja) 有毒金属または半金属を使用することなく電気めっき法により黄色金合金析出物を得る方法
CN1294642A (zh) 镍－钨合金的延性剂
US4617096A (en) Bath and process for the electrolytic deposition of gold-indium alloys
CN101092724A (zh) 用于镀银的无氰型电镀液
EP2730682B1 (en) Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy
JP2005154902A (ja) ニッケルおよびクロム（ｖｉ）を含有しない金属皮膜を析出する方法
US3892638A (en) Electrolyte and method for electrodepositing rhodium-ruthenium alloys
EP1930478B1 (en) Electrolyte composition and method for the deposition of quaternary copper alloys
JPS6250560B2 (enExample)
CA1149324A (en) Silver electrodeposition composition and process
US3206382A (en) Electrodeposition of platinum or palladium
JPH10317183A (ja) 非シアンの電気金めっき浴
CN100585019C (zh) 一种无氰镀银电镀液
CN103806036A (zh) 一种宽电流密度无氰型铜锡合金电镀工艺
US4416740A (en) Method and bath for the electrodeposition of palladium/nickel alloys
CA1050471A (en) Electroplating of rhodium-ruthenium alloys
IE841268L (en) Bath for the galvanic deposition of gold alloys.

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant