JP5439181B2 - 基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法 - Google Patents

基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法 Download PDF

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JP5439181B2
JP5439181B2 JP2009531764A JP2009531764A JP5439181B2 JP 5439181 B2 JP5439181 B2 JP 5439181B2 JP 2009531764 A JP2009531764 A JP 2009531764A JP 2009531764 A JP2009531764 A JP 2009531764A JP 5439181 B2 JP5439181 B2 JP 5439181B2
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silver
electrolyte composition
cyanide
free electrolyte
composition according
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JP2010506048A5 (enExample
JP2010506048A (ja
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シェーファー，シュテファン
リチャードソン，トーマス
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エンソン インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2009531764A 2006-10-09 2007-10-09 基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法 Active JP5439181B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06021174A EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
EP06021174.5 2006-10-09
PCT/EP2007/008780 WO2008043528A2 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten

Publications (3)

Publication Number Publication Date
JP2010506048A JP2010506048A (ja) 2010-02-25
JP2010506048A5 JP2010506048A5 (enExample) 2010-10-21
JP5439181B2 true JP5439181B2 (ja) 2014-03-12

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ID=37806683

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JP2009531764A Active JP5439181B2 (ja) 2006-10-09 2007-10-09 基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法

Country Status (6)

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US (2) US9212427B2 (enExample)
EP (2) EP1918426A1 (enExample)
JP (1) JP5439181B2 (enExample)
KR (1) KR101409701B1 (enExample)
CN (1) CN101627150B (enExample)
WO (1) WO2008043528A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
DE102009029558A1 (de) 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
RU2536127C2 (ru) * 2010-03-09 2014-12-20 Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" Кислый электролит для серебрения
EP2431501B1 (en) 2010-09-21 2013-11-20 Rohm and Haas Electronic Materials LLC Method of electroplating silver strike over nickel
KR20150131346A (ko) * 2013-03-15 2015-11-24 엔쏜 인코포레이티드 플루오로중합체 나노입자로 은의 전착
DE102015008686A1 (de) 2015-07-02 2017-01-05 ORU e.V. Cyanidfreie, wässrige elektrolytische Zusammensetzung
CN105420770A (zh) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 一种防变色无氰镀银电镀液及其电镀方法
CN105350037A (zh) * 2015-12-17 2016-02-24 宏正（福建）化学品有限公司 一种碱性无氰镀锌镍合金镀液及其电镀工艺
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
EP3841233A1 (de) * 2018-08-21 2021-06-30 Umicore Galvanotechnik GmbH Elektrolyt für die cyanidfreie abscheidung von silber
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations
CN121472943A (zh) * 2024-08-06 2026-02-06 华为技术有限公司 电镀金银合金的电镀液及其应用

Family Cites Families (24)

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US4126524A (en) 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
US4246077A (en) * 1975-03-12 1981-01-20 Technic, Inc. Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
US4161432A (en) * 1975-12-03 1979-07-17 International Business Machines Corporation Electroplating chromium and its alloys
JPS5293638A (en) * 1976-02-04 1977-08-06 Hitachi Ltd Silver plating solution
SU724606A1 (ru) * 1978-03-20 1980-03-30 Институт общей и неорганической химии АН Украинской ССР Электролит серебрени
US4461680A (en) * 1983-12-30 1984-07-24 The United States Of America As Represented By The Secretary Of Commerce Process and bath for electroplating nickel-chromium alloys
JPH0361393A (ja) * 1989-07-28 1991-03-18 Daiichi Koushiyou Kk 銀めっき法
JP3224454B2 (ja) * 1993-05-20 2001-10-29 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン銀めっき浴及びその銀めっき方法
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法
JP3481020B2 (ja) * 1995-09-07 2003-12-22 ディップソール株式会社 Ｓｎ−Ｂｉ系合金めっき浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JPH10121289A (ja) * 1996-10-18 1998-05-12 Electroplating Eng Of Japan Co 非シアン系銀めっき浴
JP3782869B2 (ja) * 1997-07-01 2006-06-07 株式会社大和化成研究所 錫−銀合金めっき浴
CN1163633C (zh) * 1997-10-02 2004-08-25 戈尔德施米特股份公司 制备银化合物的方法
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
DE10026680C1 (de) * 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
US20030159938A1 (en) * 2002-02-15 2003-08-28 George Hradil Electroplating solution containing organic acid complexing agent
WO2004079055A1 (ja) * 2003-03-05 2004-09-16 Tdk Corporation 希土類磁石の製造方法およびめっき浴
US20050183961A1 (en) * 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
CN100355944C (zh) * 2005-01-17 2007-12-19 上海大学 用于无氰镀银的光亮剂及其制备方法
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten

Also Published As

Publication number Publication date
US9657402B2 (en) 2017-05-23
EP2089561B1 (de) 2016-03-09
CN101627150B (zh) 2011-06-22
US20160122890A1 (en) 2016-05-05
US9212427B2 (en) 2015-12-15
JP2010506048A (ja) 2010-02-25
EP1918426A1 (de) 2008-05-07
KR101409701B1 (ko) 2014-06-19
US20100044239A1 (en) 2010-02-25
EP2089561A2 (de) 2009-08-19
KR20090073220A (ko) 2009-07-02
WO2008043528A3 (de) 2009-04-16
WO2008043528A2 (de) 2008-04-17
CN101627150A (zh) 2010-01-13

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