EP1612285B1 - Method of manufacturing a copper-based alloy - Google Patents

Method of manufacturing a copper-based alloy Download PDF

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Publication number
EP1612285B1
EP1612285B1 EP05014228.0A EP05014228A EP1612285B1 EP 1612285 B1 EP1612285 B1 EP 1612285B1 EP 05014228 A EP05014228 A EP 05014228A EP 1612285 B1 EP1612285 B1 EP 1612285B1
Authority
EP
European Patent Office
Prior art keywords
rolling
cold
thickness
copper
annealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05014228.0A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1612285A1 (en
Inventor
Kouichi Hatakeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
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Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of EP1612285A1 publication Critical patent/EP1612285A1/en
Application granted granted Critical
Publication of EP1612285B1 publication Critical patent/EP1612285B1/en
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
EP05014228.0A 2004-07-01 2005-06-30 Method of manufacturing a copper-based alloy Active EP1612285B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004195984A JP4660735B2 (ja) 2004-07-01 2004-07-01 銅基合金板材の製造方法

Publications (2)

Publication Number Publication Date
EP1612285A1 EP1612285A1 (en) 2006-01-04
EP1612285B1 true EP1612285B1 (en) 2020-03-25

Family

ID=35134477

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05014228.0A Active EP1612285B1 (en) 2004-07-01 2005-06-30 Method of manufacturing a copper-based alloy

Country Status (4)

Country Link
US (2) US20060016528A1 (zh)
EP (1) EP1612285B1 (zh)
JP (1) JP4660735B2 (zh)
CN (1) CN100567531C (zh)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1296500C (zh) * 2003-03-03 2007-01-24 三宝伸铜工业株式会社 耐热铜合金
KR100702662B1 (ko) * 2005-02-18 2007-04-02 엠케이전자 주식회사 반도체 패키징용 구리 본딩 와이어
JP4690868B2 (ja) * 2005-11-25 2011-06-01 株式会社東芝 回転陽極ｘ線管
JP4680765B2 (ja) * 2005-12-22 2011-05-11 株式会社神戸製鋼所 耐応力緩和特性に優れた銅合金
JP4157898B2 (ja) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 プレス打ち抜き性に優れた電気電子部品用銅合金板
WO2008041584A1 (fr) * 2006-10-02 2008-04-10 Kabushiki Kaisha Kobe Seiko Sho Plaque en alliage de cuivre pour composants électriques et électroniques
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP5075438B2 (ja) * 2007-03-20 2012-11-21 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金板材およびその製造法
US8287669B2 (en) 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
JP4981748B2 (ja) * 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
DE102007029991B4 (de) * 2007-06-28 2013-08-01 Wieland-Werke Ag Kupfer-Zink-Legierung, Verfahren zur Herstellung und Verwendung
JP4466688B2 (ja) * 2007-07-11 2010-05-26 日立電線株式会社 圧延銅箔
KR101227315B1 (ko) * 2007-08-07 2013-01-28 가부시키가이샤 고베 세이코쇼 구리 합금판
WO2009041194A1 (ja) * 2007-09-27 2009-04-02 Nippon Mining & Metals Co., Ltd. 熱間加工性に優れた高強度高導電性銅合金
CA2702358A1 (en) * 2007-10-10 2009-04-16 Gbc Metals, Llc Copper tin nickel phosphorus alloys with improved strength and formability
KR101138569B1 (ko) * 2007-12-21 2012-05-10 미쓰비시 신도 가부시키가이샤 고강도?고열전도 동합금관 및 그 제조방법
US9512506B2 (en) * 2008-02-26 2016-12-06 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US7928541B2 (en) * 2008-03-07 2011-04-19 Kobe Steel, Ltd. Copper alloy sheet and QFN package
JP5051927B2 (ja) * 2008-03-28 2012-10-17 三菱伸銅株式会社 高強度高導電銅合金管・棒・線材
JP5291494B2 (ja) * 2008-09-30 2013-09-18 株式会社神戸製鋼所 高強度高耐熱性銅合金板
RU2482204C2 (ru) * 2008-10-31 2013-05-20 Зундвигер Мессингверк Гмбх Унд Ко.Кг Медно-оловянный сплав, композитный материал и их применение
WO2010079708A1 (ja) 2009-01-09 2010-07-15 三菱伸銅株式会社 高強度高導電銅合金圧延板及びその製造方法
KR101291012B1 (ko) 2009-01-09 2013-07-30 미쓰비시 신도 가부시키가이샤 고강도 고도전 동합금 압연판 및 그 제조 방법
EP2451604B1 (en) * 2009-07-10 2017-08-30 Luvata Franklin, Inc. Copper alloy for heat exchanger tube
EP2706125A4 (en) * 2011-05-02 2014-11-19 Furukawa Electric Co Ltd COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME
JP6050588B2 (ja) * 2012-01-11 2016-12-21 住友電気工業株式会社 銅合金線
US10663294B2 (en) 2012-02-03 2020-05-26 Eagle View Technologies, Inc. Systems and methods for estimation of building wall area and producing a wall estimation report
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
CN102758100B (zh) * 2012-07-18 2014-03-19 宁波兴业盛泰集团有限公司 一种高强高弹锌白铜合金及其加工方法
WO2014016934A1 (ja) 2012-07-26 2014-01-30 三菱電機株式会社 銅合金及びその製造方法
JP2014077182A (ja) * 2012-10-12 2014-05-01 Sh Copper Products Corp 圧延銅箔
CN102983081B (zh) * 2012-11-07 2014-12-31 江苏威纳德照明科技有限公司 一种由集成电路组成的半导体器件的制造方法
TWI486970B (zh) * 2013-01-29 2015-06-01 Tung Han Chuang 銅基合金線材及其製造方法
JP5647703B2 (ja) * 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品
DE102013007274B4 (de) 2013-04-26 2020-01-16 Wieland-Werke Ag Konstruktionsteil aus einer Kupfergusslegierung
JP6080009B2 (ja) * 2013-05-13 2017-02-15 国立大学法人茨城大学 半導体集積回路装置及びその製造方法、並びに該半導体集積回路装置に使用する低抵抗率銅配線の探索方法
JP5453565B1 (ja) * 2013-06-13 2014-03-26 Ｊｘ日鉱日石金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
ES2596512T3 (es) * 2014-04-03 2017-01-10 Otto Fuchs Kg Aleación de bronce de aluminio, procedimiento de producción y producto de bronce de aluminio
DE102014014239B4 (de) * 2014-09-25 2024-04-11 Wieland-Werke Ag Elektrisches Verbindungselement
CN104294082A (zh) * 2014-11-03 2015-01-21 宁波博威合金材料股份有限公司 一种黄铜合金
CN105779808B (zh) * 2014-12-16 2018-06-22 北京有色金属研究总院 一种动力电池用高粘附性铜合金箔材及其加工方法
CN104831115A (zh) * 2015-04-27 2015-08-12 宁波博威合金材料股份有限公司 含锰黄铜合金及其制备方法
CN105039777B (zh) * 2015-05-05 2018-04-24 宁波博威合金材料股份有限公司 一种可切削加工黄铜合金及制备方法
CN105088006A (zh) * 2015-09-02 2015-11-25 宁波兴业盛泰集团有限公司 一种低成本、耐应力松弛铜合金引线框架材料及其制备方法
US20180245183A1 (en) * 2015-09-09 2018-08-30 Mitsubishi Materials Corporation Copper alloy for electronic and electric device, component for electronic and electric device, terminal, and bus bar
JP6593778B2 (ja) * 2016-02-05 2019-10-23 住友電気工業株式会社 被覆電線、端子付き電線、銅合金線、及び銅合金撚線
CN106636729A (zh) * 2016-10-05 2017-05-10 宁波兴业盛泰集团有限公司 一种动力电池连接器用多元铜合金板带材及其制备方法
EP3577247B1 (en) * 2017-02-04 2022-09-14 Materion Corporation A process for producing copper-nickel-tin alloys
CN107400796B (zh) * 2017-06-22 2019-04-30 安徽晋源铜业有限公司 一种耐高温高强无铍铜导线及其制备方法
WO2019088080A1 (ja) 2017-10-30 2019-05-09 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
CN107974574B (zh) * 2017-12-08 2020-05-26 宁波兴业盛泰集团有限公司 一种耐应力松弛的复杂黄铜合金及其制备方法
US11155899B2 (en) * 2018-04-16 2021-10-26 University Of Virginia Patent Foundation Antimicrobial, hypoallergenic, and tarnish-resistant Cu-based alloy and related methods thereof
CN109022900B (zh) * 2018-08-17 2020-05-08 宁波博威合金材料股份有限公司 一种综合性能优异的铜合金及其应用
CN109266877B (zh) * 2018-11-01 2019-11-08 福建紫金铜业有限公司 一种高性能铜合金的制备方法
CN111411258B (zh) * 2020-05-26 2021-07-23 江西理工大学 具有高强度和高电导率的Cu-Sn合金超细线材及其制备方法
CN113106293B (zh) * 2021-03-25 2022-04-22 北京科技大学 一种低钴含量高强中导Cu-Ni-Co-Si系合金及其制备工艺
CN113913642B (zh) * 2021-09-26 2022-07-05 宁波博威合金板带有限公司 一种铜合金带材及其制备方法
CN114196851B (zh) * 2021-12-20 2022-10-21 有研工程技术研究院有限公司 一种高强度导电铜合金材料及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312932A (ja) * 1987-06-15 1988-12-21 Mitsubishi Electric Corp ジグザグ・インライン・パッケ−ジ用銅基合金
JP2844120B2 (ja) * 1990-10-17 1999-01-06 同和鉱業株式会社 コネクタ用銅基合金の製造法
JP3550233B2 (ja) * 1995-10-09 2004-08-04 同和鉱業株式会社 高強度高導電性銅基合金の製造法
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US5820701A (en) * 1996-11-07 1998-10-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US6254702B1 (en) * 1997-02-18 2001-07-03 Dowa Mining Co., Ltd. Copper base alloys and terminals using the same
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass
JP3733548B2 (ja) * 1998-05-19 2006-01-11 同和鉱業株式会社 耐応力緩和特性に優れた銅基合金の製造方法
JP2000080428A (ja) 1998-08-31 2000-03-21 Kobe Steel Ltd 曲げ加工性が優れた銅合金板
US6471792B1 (en) * 1998-11-16 2002-10-29 Olin Corporation Stress relaxation resistant brass
JP2000256814A (ja) * 1999-03-03 2000-09-19 Sumitomo Metal Mining Co Ltd 端子用銅基合金条の製造方法
JP4009981B2 (ja) * 1999-11-29 2007-11-21 Ｄｏｗａホールディングス株式会社 プレス加工性に優れた銅基合金板
JP4396874B2 (ja) * 2000-03-17 2010-01-13 住友金属鉱山株式会社 端子用銅基合金条の製造方法
JP4393663B2 (ja) * 2000-03-17 2010-01-06 住友金属鉱山株式会社 端子用銅基合金条およびその製造方法
JP4729680B2 (ja) * 2000-12-18 2011-07-20 Ｄｏｗａメタルテック株式会社 プレス打ち抜き性に優れた銅基合金
US20030029532A1 (en) * 2001-05-24 2003-02-13 Olin Corporation Nickel containing high copper alloy
JP4615794B2 (ja) * 2001-09-27 2011-01-19 清峰金属工業株式会社 コネクター用銅基合金板の製造方法
CN1327016C (zh) * 2002-05-14 2007-07-18 同和矿业株式会社 具有改善的冲压冲制性能的铜基合金及其制备方法
JP3807387B2 (ja) * 2003-07-31 2006-08-09 日立電線株式会社 端子・コネクタ用銅合金及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
CN1800426A (zh) 2006-07-12
US20060016528A1 (en) 2006-01-26
JP2006016667A (ja) 2006-01-19
US20090014102A1 (en) 2009-01-15
US8293039B2 (en) 2012-10-23
CN100567531C (zh) 2009-12-09
JP4660735B2 (ja) 2011-03-30
EP1612285A1 (en) 2006-01-04

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