EP1430524A2 - Procede d'etablissement de contact pour des surfaces de contact electriques situees sur un substrat et dispositif constitue d'un substrat pourvu de surfaces de contact electriques - Google Patents
Procede d'etablissement de contact pour des surfaces de contact electriques situees sur un substrat et dispositif constitue d'un substrat pourvu de surfaces de contact electriquesInfo
- Publication number
- EP1430524A2 EP1430524A2 EP02774408A EP02774408A EP1430524A2 EP 1430524 A2 EP1430524 A2 EP 1430524A2 EP 02774408 A EP02774408 A EP 02774408A EP 02774408 A EP02774408 A EP 02774408A EP 1430524 A2 EP1430524 A2 EP 1430524A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- film
- contact
- substrate
- layer
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Definitions
- a mask is applied to the upper surface 301 of the film 3 facing away from the surface 20 of the substrate 1, which mask leaves the contact surfaces 210 and 112 and areas for the conductor tracks 5 free, and then the layer 4 is removed the electrically conductive material is applied to the entire surface of the mask and the contact surfaces 210 and 112 and the areas free of the mask. The mask with the layer 4 located thereon is then removed, so that only the flatly contacted contact surfaces 210 and 112 and the conductor tracks 5 remain on the mask-free regions.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Die Bonding (AREA)
Abstract
Procédé d'établissement de contact pour des surfaces de contact électriques (21, 112) situées sur une surface (20) d'un substrat (1), selon lequel une feuille (3) à base de polyimide ou d'époxy est appliquée sous vide sur ladite surface si bien que la feuille couvre de manière étroite la surface pourvue des surfaces de contact et adhère à cette dernière. Chacune des surfaces de contact pour laquelle un contact est à établir, située sur la surface, est mise à nu par l'ouverture de fenêtres (31) dans la feuille et un contact est établi de manière plane entre chaque surface de contact mise à nu et une couche (4) de métal. La présente invention est utilisée pour l'établissement d'un contact de grande surface, permettant une forte intensité de courant, pour des puces à semi-conducteur de puissance.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10147935 | 2001-09-28 | ||
DE10147935 | 2001-09-28 | ||
PCT/DE2002/003615 WO2003030247A2 (fr) | 2001-09-28 | 2002-09-25 | Procede d'etablissement de contact pour des surfaces de contact electriques situees sur un substrat et dispositif constitue d'un substrat pourvu de surfaces de contact electriques |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1430524A2 true EP1430524A2 (fr) | 2004-06-23 |
Family
ID=7700669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02774408A Withdrawn EP1430524A2 (fr) | 2001-09-28 | 2002-09-25 | Procede d'etablissement de contact pour des surfaces de contact electriques situees sur un substrat et dispositif constitue d'un substrat pourvu de surfaces de contact electriques |
Country Status (7)
Country | Link |
---|---|
US (1) | US7402457B2 (fr) |
EP (1) | EP1430524A2 (fr) |
JP (1) | JP2005515616A (fr) |
KR (1) | KR100896906B1 (fr) |
CN (1) | CN1575511A (fr) |
AU (1) | AU2002340750A1 (fr) |
WO (1) | WO2003030247A2 (fr) |
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- 2002-09-25 AU AU2002340750A patent/AU2002340750A1/en not_active Abandoned
- 2002-09-25 EP EP02774408A patent/EP1430524A2/fr not_active Withdrawn
- 2002-09-25 JP JP2003533338A patent/JP2005515616A/ja active Pending
- 2002-09-25 CN CNA028190637A patent/CN1575511A/zh active Pending
- 2002-09-25 US US10/491,137 patent/US7402457B2/en not_active Expired - Fee Related
- 2002-09-25 WO PCT/DE2002/003615 patent/WO2003030247A2/fr active Application Filing
- 2002-09-25 KR KR1020047004531A patent/KR100896906B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
AU2002340750A1 (en) | 2003-04-14 |
WO2003030247A3 (fr) | 2003-10-09 |
WO2003030247A2 (fr) | 2003-04-10 |
US7402457B2 (en) | 2008-07-22 |
JP2005515616A (ja) | 2005-05-26 |
KR100896906B1 (ko) | 2009-05-12 |
US20050032347A1 (en) | 2005-02-10 |
KR20040037173A (ko) | 2004-05-04 |
CN1575511A (zh) | 2005-02-02 |
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