DK2115069T3 - Varmehærdende sammensætning - Google Patents

Varmehærdende sammensætning Download PDF

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Publication number
DK2115069T3
DK2115069T3 DK08708402.6T DK08708402T DK2115069T3 DK 2115069 T3 DK2115069 T3 DK 2115069T3 DK 08708402 T DK08708402 T DK 08708402T DK 2115069 T3 DK2115069 T3 DK 2115069T3
Authority
DK
Denmark
Prior art keywords
heat
curing composition
curing
composition
Prior art date
Application number
DK08708402.6T
Other languages
English (en)
Inventor
Frans Setiabudi
Original Assignee
Huntsman Adv Mat Licensing Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Licensing Switzerland Gmbh
Application granted granted Critical
Publication of DK2115069T3 publication Critical patent/DK2115069T3/da

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/12Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • C08G73/0233Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/35Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357Six-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
DK08708402.6T 2007-02-08 2008-01-30 Varmehærdende sammensætning DK2115069T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07101986 2007-02-08
PCT/EP2008/051085 WO2008095837A1 (en) 2007-02-08 2008-01-30 Thermosetting composition

Publications (1)

Publication Number Publication Date
DK2115069T3 true DK2115069T3 (da) 2021-03-29

Family

ID=37986875

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08708402.6T DK2115069T3 (da) 2007-02-08 2008-01-30 Varmehærdende sammensætning

Country Status (11)

Country Link
US (1) US8852382B2 (da)
EP (1) EP2115069B1 (da)
JP (1) JP5590893B2 (da)
KR (1) KR101457449B1 (da)
CN (2) CN101605851B (da)
DK (1) DK2115069T3 (da)
ES (1) ES2855147T3 (da)
HU (1) HUE053812T2 (da)
PL (1) PL2115069T3 (da)
TW (1) TWI419926B (da)
WO (1) WO2008095837A1 (da)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2115034B1 (en) * 2007-02-08 2010-07-21 Huntsman Advanced Materials (Switzerland) GmbH Thermosetting composition
WO2012015604A1 (en) * 2010-07-28 2012-02-02 Huntsman Advanced Materials Americas Llc Solvent-free benzoxazine based thermosetting resin composition
WO2012135180A1 (en) 2011-03-28 2012-10-04 3M Innovative Properties Company Curable composition, article, method of curing, and tack-free reaction product
JP5972353B2 (ja) * 2011-03-28 2016-08-17 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物、物品、硬化方法、及び反応生成物
KR101942325B1 (ko) * 2012-02-10 2019-04-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 부식 방지 코팅
AT513190B9 (de) * 2012-08-08 2014-05-15 Berndorf Hueck Band Und Pressblechtechnik Gmbh Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs
US20140072800A1 (en) * 2012-09-07 2014-03-13 E I Du Pont De Nemours And Company Coated article comprising a curable composition comprising bis-benzoxazine and an amino-functionalized triazine
US20140073736A1 (en) * 2012-09-07 2014-03-13 E I Du Pont Nemours And Company Curable composition comprising bis-benzoxazine, method of curing, and the cured composition so formed
US20140069693A1 (en) * 2012-09-07 2014-03-13 E I Du Pont De Nemours And Company Multi-layer article comprising discrete conductive pathways contacting a curable composition comprising bis-benzoxazine
US9169393B2 (en) 2013-07-25 2015-10-27 3M Innovative Properties Company Anticorrosion coatings
CA2960646A1 (en) * 2014-09-12 2016-03-17 Henkel IP & Holding GmbH Cationically curable benzoxazine compositions
CN107735427B (zh) 2015-06-09 2021-06-04 3M创新有限公司 铵盐催化的苯并噁嗪聚合
ES2904813T3 (es) * 2015-08-10 2022-04-06 Cytec Ind Inc Material preimpregnado que puede proporcionar protección contra los relámpagos y resistencia a quemaduras penetrantes y método para su fabricación
US20230159705A1 (en) * 2020-04-15 2023-05-25 Kaneka Corporation Synthesis, purification, and properties of ring-opened benzoxazine thermoplastic
CN114015194B (zh) * 2021-10-19 2023-10-20 航天特种材料及工艺技术研究所 一种聚苯并噁嗪气凝胶及其制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507428A (en) * 1984-02-17 1985-03-26 Monsanto Company Aqueous dispersions of polyamines and poly(dihydrobenzoxazines)
US4501864A (en) * 1983-12-22 1985-02-26 Monsanto Company Polymerizable compositions comprising polyamines and poly(dihydrobenzoxazines)
JP3487083B2 (ja) * 1996-02-09 2004-01-13 日立化成工業株式会社 熱硬化性樹脂組成物及びその硬化物
JPH1112356A (ja) * 1997-06-20 1999-01-19 Shikoku Chem Corp 熱硬化性樹脂組成物
JPH11279310A (ja) * 1998-03-31 1999-10-12 Asahi Chem Ind Co Ltd フェノール樹脂発泡体用組成物及びその発泡体
US6207786B1 (en) 1998-11-10 2001-03-27 Edison Polymer Innovation Corporation Ternary systems of benzoxazine, epoxy, and phenolic resins
JP4207101B2 (ja) * 1999-05-25 2009-01-14 日立化成工業株式会社 半導体封止用樹脂組成物及び樹脂封止型半導体装置
US6376080B1 (en) * 1999-06-07 2002-04-23 Loctite Corporation Method for preparing polybenzoxazine
JP2001220445A (ja) 2000-02-07 2001-08-14 Hitachi Chem Co Ltd ポリシランの製造方法
JP2001220455A (ja) * 2000-02-10 2001-08-14 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2002047391A (ja) * 2000-07-31 2002-02-12 Hitachi Chem Co Ltd 封止用熱硬化性樹脂組成物および電子部品装置
TW583258B (en) * 2001-01-10 2004-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition and laminated board for wiring board using the same
JP2003147165A (ja) * 2001-08-29 2003-05-21 Osaka City 熱硬化性樹脂組成物
JP3911410B2 (ja) * 2001-11-30 2007-05-09 富士重工業株式会社 複合材製品の製造方法
JP3986445B2 (ja) * 2003-02-17 2007-10-03 東都化成株式会社 高純度エポキシ樹脂の製造方法およびエポキシ樹脂組成物
CN1207325C (zh) 2003-04-30 2005-06-22 四川大学 可用于树脂传递模塑的改性苯并噁嗪树脂及其制备方法
US20070191555A1 (en) * 2004-03-30 2007-08-16 Hatsuo Ishida Thermosetting resin composition and its article
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions

Also Published As

Publication number Publication date
TWI419926B (zh) 2013-12-21
CN101605837B (zh) 2013-06-12
CN101605851B (zh) 2013-05-08
CN101605851A (zh) 2009-12-16
PL2115069T3 (pl) 2021-07-05
TW200846410A (en) 2008-12-01
WO2008095837A1 (en) 2008-08-14
KR20090116697A (ko) 2009-11-11
JP5590893B2 (ja) 2014-09-17
EP2115069A1 (en) 2009-11-11
ES2855147T3 (es) 2021-09-23
CN101605837A (zh) 2009-12-16
US20100015343A1 (en) 2010-01-21
US8852382B2 (en) 2014-10-07
KR101457449B1 (ko) 2014-11-03
HUE053812T2 (hu) 2021-07-28
JP2010518207A (ja) 2010-05-27
EP2115069B1 (en) 2021-01-13

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