DE69933639D1 - Chipverbindungsdüse - Google Patents
ChipverbindungsdüseInfo
- Publication number
- DE69933639D1 DE69933639D1 DE69933639T DE69933639T DE69933639D1 DE 69933639 D1 DE69933639 D1 DE 69933639D1 DE 69933639 T DE69933639 T DE 69933639T DE 69933639 T DE69933639 T DE 69933639T DE 69933639 D1 DE69933639 D1 DE 69933639D1
- Authority
- DE
- Germany
- Prior art keywords
- chip junction
- junction
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Thermistors And Varistors (AREA)
- Measuring Arrangements Characterized By The Use Of Fluids (AREA)
- Arc Welding In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP37531498 | 1998-12-14 | ||
JP37531498A JP3556498B2 (ja) | 1998-12-14 | 1998-12-14 | チップ接合用ノズル |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933639D1 true DE69933639D1 (de) | 2006-11-30 |
DE69933639T2 DE69933639T2 (de) | 2007-03-01 |
Family
ID=18505319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69933639T Expired - Fee Related DE69933639T2 (de) | 1998-12-14 | 1999-12-14 | Chipverbindungsdüse |
Country Status (4)
Country | Link |
---|---|
US (2) | US6189760B1 (de) |
EP (1) | EP1011127B1 (de) |
JP (1) | JP3556498B2 (de) |
DE (1) | DE69933639T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69934243T2 (de) * | 1998-09-01 | 2007-06-28 | Matsushita Electric Industrial Co., Ltd., Kadoma | Gerät und methode zur auswertung eines lothöckerzusammenmbaus, und dazu gehörende halbleiterherstellungsvorrichtung und verfahren |
JP3556498B2 (ja) * | 1998-12-14 | 2004-08-18 | Tdk株式会社 | チップ接合用ノズル |
US6885522B1 (en) * | 1999-05-28 | 2005-04-26 | Fujitsu Limited | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation |
JP2003197686A (ja) * | 2001-10-18 | 2003-07-11 | Nec Corp | 電子部品実装装置及び電子部品実装方法 |
JP3855973B2 (ja) | 2002-08-29 | 2006-12-13 | 株式会社村田製作所 | 超音波接合方法および超音波接合装置 |
JP2005159061A (ja) * | 2003-11-27 | 2005-06-16 | Fujitsu Ltd | 超音波ツール及び超音波接合装置 |
JP4507941B2 (ja) * | 2005-03-28 | 2010-07-21 | パナソニック電工株式会社 | 超音波接合装置の製造方法 |
US7868440B2 (en) | 2006-08-25 | 2011-01-11 | Micron Technology, Inc. | Packaged microdevices and methods for manufacturing packaged microdevices |
JP5237900B2 (ja) * | 2009-08-11 | 2013-07-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5890960B2 (ja) * | 2011-02-21 | 2016-03-22 | 積水化学工業株式会社 | フリップチップ実装方法 |
JP5741299B2 (ja) * | 2011-08-02 | 2015-07-01 | 日産自動車株式会社 | 超音波溶接工具のローレット面再加工方法 |
JP5838637B2 (ja) * | 2011-08-02 | 2016-01-06 | 日産自動車株式会社 | 超音波溶接装置及び超音波溶接装置で使用される超音波接合工具のローレット面加工方法 |
US20140069989A1 (en) * | 2012-09-13 | 2014-03-13 | Texas Instruments Incorporated | Thin Semiconductor Chip Mounting |
JP6201373B2 (ja) * | 2013-03-29 | 2017-09-27 | 日本電気株式会社 | 吸着コレット、ピックアップ装置、及びピックアップ方法 |
JP6379447B2 (ja) * | 2013-04-16 | 2018-08-29 | 凸版印刷株式会社 | Icチップの実装方法 |
JP2021132138A (ja) * | 2020-02-20 | 2021-09-09 | 日機装株式会社 | 半導体発光装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3575333A (en) * | 1968-11-21 | 1971-04-20 | Kulicke & Soffa Ind Inc | Beam-lead bonding apparatus |
US3700155A (en) * | 1970-05-20 | 1972-10-24 | Mech El Ind Inc | Apparatus for improving alignment of beam leaded bonding tools |
JPS59208844A (ja) | 1983-05-13 | 1984-11-27 | Hitachi Ltd | フエイスダウンボンダ− |
US4667870A (en) * | 1984-09-20 | 1987-05-26 | American Telephone And Telegraph Company | Registering articles to sites with recessed ultrasonic bonding tool head |
US4628584A (en) * | 1985-01-28 | 1986-12-16 | The Dow Chemical Company | Method of removing fibers protruding into bores |
JPH01244630A (ja) * | 1988-03-26 | 1989-09-29 | Nec Corp | 半導体ペレットのボンディング方法 |
JPH04170035A (ja) * | 1990-11-02 | 1992-06-17 | Nec Yamagata Ltd | スクラブ用半導体チップ吸着ノズル |
JPH04216641A (ja) | 1990-12-17 | 1992-08-06 | Nippon Telegr & Teleph Corp <Ntt> | リードボンディング装置用ステージ |
JP2500778B2 (ja) | 1993-08-11 | 1996-05-29 | 日本電気株式会社 | ボンディングツ―ル及びボンディング方法 |
JPH07115109A (ja) | 1993-10-15 | 1995-05-02 | Nec Corp | フリップチップボンディング方法及び装置 |
EP0908932B1 (de) * | 1997-09-03 | 2003-11-19 | Nippon Pillar Packing Co., Ltd. | Halbleiterscheibenträger mit CVD-Filmbeschichtung aus Siliciumcarbid |
JP3556498B2 (ja) * | 1998-12-14 | 2004-08-18 | Tdk株式会社 | チップ接合用ノズル |
US6706130B1 (en) * | 1999-10-04 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Method and device for frictional connection and holding tool used for the frictional connection device |
-
1998
- 1998-12-14 JP JP37531498A patent/JP3556498B2/ja not_active Expired - Fee Related
-
1999
- 1999-12-13 US US09/460,109 patent/US6189760B1/en not_active Expired - Fee Related
- 1999-12-14 EP EP99124956A patent/EP1011127B1/de not_active Expired - Lifetime
- 1999-12-14 DE DE69933639T patent/DE69933639T2/de not_active Expired - Fee Related
-
2001
- 2001-02-01 US US09/774,624 patent/US6382495B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2000183115A (ja) | 2000-06-30 |
EP1011127A2 (de) | 2000-06-21 |
US6189760B1 (en) | 2001-02-20 |
EP1011127A3 (de) | 2001-08-22 |
DE69933639T2 (de) | 2007-03-01 |
US6382495B2 (en) | 2002-05-07 |
JP3556498B2 (ja) | 2004-08-18 |
EP1011127B1 (de) | 2006-10-18 |
US20010011668A1 (en) | 2001-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |