DE69810489T2 - Kostengünstiges, hochparalleles speicherprüfgerät - Google Patents

Kostengünstiges, hochparalleles speicherprüfgerät

Info

Publication number
DE69810489T2
DE69810489T2 DE69810489T DE69810489T DE69810489T2 DE 69810489 T2 DE69810489 T2 DE 69810489T2 DE 69810489 T DE69810489 T DE 69810489T DE 69810489 T DE69810489 T DE 69810489T DE 69810489 T2 DE69810489 T2 DE 69810489T2
Authority
DE
Germany
Prior art keywords
speed port
testing
inexpensive
highly parallel
parallel storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69810489T
Other languages
English (en)
Other versions
DE69810489D1 (de
Inventor
W Conner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Application granted granted Critical
Publication of DE69810489D1 publication Critical patent/DE69810489D1/de
Publication of DE69810489T2 publication Critical patent/DE69810489T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • G01R31/3191Calibration
DE69810489T 1997-09-09 1998-09-04 Kostengünstiges, hochparalleles speicherprüfgerät Expired - Fee Related DE69810489T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/926,117 US5794175A (en) 1997-09-09 1997-09-09 Low cost, highly parallel memory tester
PCT/US1998/018602 WO1999013475A1 (en) 1997-09-09 1998-09-04 Low cost, highly parallel memory tester

Publications (2)

Publication Number Publication Date
DE69810489D1 DE69810489D1 (de) 2003-02-06
DE69810489T2 true DE69810489T2 (de) 2003-10-30

Family

ID=25452781

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69810489T Expired - Fee Related DE69810489T2 (de) 1997-09-09 1998-09-04 Kostengünstiges, hochparalleles speicherprüfgerät

Country Status (6)

Country Link
US (1) US5794175A (de)
EP (1) EP1012849B1 (de)
JP (1) JP4937448B2 (de)
KR (1) KR100371953B1 (de)
DE (1) DE69810489T2 (de)
WO (1) WO1999013475A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19928981B4 (de) * 1998-06-24 2006-07-13 Advantest Corp. Vorrichtung und Verfahren zum Testen von Halbleiterspeichern
DE102007016622A1 (de) * 2007-04-05 2008-10-09 Qimonda Ag Halbleiter-Bauelement-Test-Verfahren und -Test-System mit reduzierter Anzahl an Test-Kanälen

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100216993B1 (ko) * 1997-07-11 1999-09-01 윤종용 병합 데이터 출력모드와 표준동작 모드로 동작하는 집적회로소자를 함께 검사할 수 있는 검사용 기판
DE19808664C2 (de) * 1998-03-02 2002-03-14 Infineon Technologies Ag Integrierte Schaltung und Verfahren zu ihrer Prüfung
US5991215A (en) * 1998-03-31 1999-11-23 Micron Electronics, Inc. Method for testing a memory chip in multiple passes
US6058055A (en) * 1998-03-31 2000-05-02 Micron Electronics, Inc. System for testing memory
JP4026945B2 (ja) * 1998-08-11 2007-12-26 株式会社アドバンテスト 混在ic試験装置及びこのic試験装置の制御方法
JP4018254B2 (ja) * 1998-08-20 2007-12-05 株式会社アドバンテスト 電子部品の試験方法
US6275962B1 (en) * 1998-10-23 2001-08-14 Teradyne, Inc. Remote test module for automatic test equipment
US6389525B1 (en) 1999-01-08 2002-05-14 Teradyne, Inc. Pattern generator for a packet-based memory tester
US6357018B1 (en) * 1999-01-26 2002-03-12 Dell Usa, L.P. Method and apparatus for determining continuity and integrity of a RAMBUS channel in a computer system
US6324485B1 (en) 1999-01-26 2001-11-27 Newmillennia Solutions, Inc. Application specific automated test equipment system for testing integrated circuit devices in a native environment
JP3918344B2 (ja) * 1999-01-29 2007-05-23 横河電機株式会社 半導体試験装置
US6480978B1 (en) * 1999-03-01 2002-11-12 Formfactor, Inc. Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons
US6452411B1 (en) 1999-03-01 2002-09-17 Formfactor, Inc. Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses
US6499121B1 (en) * 1999-03-01 2002-12-24 Formfactor, Inc. Distributed interface for parallel testing of multiple devices using a single tester channel
DE19917336C2 (de) * 1999-04-16 2002-07-11 Infineon Technologies Ag Schaltungsanordnung zum Burn-In-Test eines Halbleiterbausteins
US6347287B1 (en) * 1999-05-07 2002-02-12 International Business Machines Corporation Calibration system and method for receiver guardband reductions
KR100574479B1 (ko) * 1999-06-23 2006-04-27 주식회사 하이닉스반도체 램버스 디램의 테스트장치
US6476628B1 (en) * 1999-06-28 2002-11-05 Teradyne, Inc. Semiconductor parallel tester
US6292415B1 (en) * 1999-09-28 2001-09-18 Aehr Test Systems, Inc. Enhancements in testing devices on burn-in boards
US6392428B1 (en) * 1999-11-16 2002-05-21 Eaglestone Partners I, Llc Wafer level interposer
KR100394347B1 (ko) * 2000-04-19 2003-08-09 삼성전자주식회사 인터페이스 기판 및 이를 이용한 반도체 집적회로 소자테스트 방법
US6486693B1 (en) * 2000-05-19 2002-11-26 Teradyne, Inc. Method and apparatus for testing integrated circuit chips that output clocks for timing
US6603323B1 (en) * 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
US6537831B1 (en) * 2000-07-31 2003-03-25 Eaglestone Partners I, Llc Method for selecting components for a matched set using a multi wafer interposer
US6812048B1 (en) 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6466007B1 (en) * 2000-08-14 2002-10-15 Teradyne, Inc. Test system for smart card and indentification devices and the like
US6563298B1 (en) * 2000-08-15 2003-05-13 Ltx Corporation Separating device response signals from composite signals
US7509532B2 (en) * 2000-09-13 2009-03-24 Kingston Technology Corp. Robotic memory-module tester using adapter cards for vertically mounting PC motherboards
US6815712B1 (en) 2000-10-02 2004-11-09 Eaglestone Partners I, Llc Method for selecting components for a matched set from a wafer-interposer assembly
GB0026849D0 (en) * 2000-11-03 2000-12-20 Acuid Corp Ltd DDR SDRAM memory test system with fault strobe synchronization
US6686657B1 (en) * 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
JP2002168903A (ja) * 2000-12-01 2002-06-14 Mitsubishi Electric Corp 半導体製造検査装置および半導体装置
US6766486B2 (en) * 2000-12-05 2004-07-20 Intel Corporation Joint test action group (JTAG) tester, such as to test integrated circuits in parallel
US6819129B2 (en) * 2000-12-08 2004-11-16 Samsung Electronics Co., Ltd. Method and apparatus for testing a non-standard memory device under actual operating conditions
US20020078401A1 (en) * 2000-12-15 2002-06-20 Fry Michael Andrew Test coverage analysis system
US20020076854A1 (en) * 2000-12-15 2002-06-20 Pierce John L. System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates
US6524885B2 (en) * 2000-12-15 2003-02-25 Eaglestone Partners I, Llc Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
US6529022B2 (en) * 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
KR100408395B1 (ko) * 2001-01-26 2003-12-06 삼성전자주식회사 다 핀의 반도체 장치를 효율적으로 테스트할 수 있는반도체 테스트 시스템 및 테스트 방법
US6673653B2 (en) * 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
TW494516B (en) * 2001-03-14 2002-07-11 Winbond Electronics Corp Semiconductor multi-die testing system with automatic identification functions
US6545497B2 (en) * 2001-03-15 2003-04-08 Micron Technology, Inc. Method and apparatus of testing memory device power and ground pins in an array assembly platform
US6771087B1 (en) * 2001-06-04 2004-08-03 Advanced Micro Devices, Inc. System and method for testing integrated circuit modules
US20020199141A1 (en) * 2001-06-20 2002-12-26 Carol Lemlein Calibration apparatus and method for automatic test equipment
US6934900B1 (en) * 2001-06-25 2005-08-23 Global Unichip Corporation Test pattern generator for SRAM and DRAM
DE10131712B4 (de) * 2001-06-29 2009-04-09 Qimonda Ag Elektronisches Bauelement, Testereinrichtung und Verfahren zur Kalibrierung einer Testereinrichtung
JP2003043109A (ja) * 2001-07-30 2003-02-13 Nec Corp 半導体集積回路装置及びその試験装置
US7265570B2 (en) * 2001-09-28 2007-09-04 Inapac Technology, Inc. Integrated circuit testing module
US8001439B2 (en) 2001-09-28 2011-08-16 Rambus Inc. Integrated circuit testing module including signal shaping interface
US8166361B2 (en) * 2001-09-28 2012-04-24 Rambus Inc. Integrated circuit testing module configured for set-up and hold time testing
US8286046B2 (en) 2001-09-28 2012-10-09 Rambus Inc. Integrated circuit testing module including signal shaping interface
US6889334B1 (en) * 2001-10-02 2005-05-03 Advanced Micro Devices, Inc. Multimode system for calibrating a data strobe delay for a memory read operation
DE10150441B4 (de) * 2001-10-12 2004-04-08 Infineon Technologies Ag Verfahren zum Testen von Halbleiterspeichern
US6639859B2 (en) * 2001-10-25 2003-10-28 Hewlett-Packard Development Company, L.P. Test array and method for testing memory arrays
US6656751B2 (en) * 2001-11-13 2003-12-02 International Business Machines Corporation Self test method and device for dynamic voltage screen functionality improvement
KR100441684B1 (ko) * 2001-12-03 2004-07-27 삼성전자주식회사 반도체 집적 회로를 위한 테스트 장치
KR100442696B1 (ko) * 2001-12-19 2004-08-02 삼성전자주식회사 반도체 메모리 소자의 병렬 테스트 시스템
JP4215443B2 (ja) * 2002-04-05 2009-01-28 富士通株式会社 ダイナミックバーンイン装置用アダプタ・カードおよびダイナミックバーンイン装置
US6812691B2 (en) * 2002-07-12 2004-11-02 Formfactor, Inc. Compensation for test signal degradation due to DUT fault
KR100487946B1 (ko) * 2002-08-29 2005-05-06 삼성전자주식회사 반도체 테스트 시스템 및 이 시스템의 테스트 방법
KR100496861B1 (ko) * 2002-09-26 2005-06-22 삼성전자주식회사 하나의 핸들러에 2개 이상의 테스트 보드를 갖는 테스트장비 및 그 테스트 방법
JP4173726B2 (ja) * 2002-12-17 2008-10-29 株式会社ルネサステクノロジ インターフェイス回路
KR100505686B1 (ko) * 2003-05-26 2005-08-03 삼성전자주식회사 다수의 피시험 소자들을 병렬로 검사하는 테스트 시스템및 테스트 방법
JP4334285B2 (ja) * 2003-06-19 2009-09-30 株式会社アドバンテスト 半導体試験装置及びその制御方法
JP4354236B2 (ja) * 2003-09-12 2009-10-28 株式会社アドバンテスト 試験装置
JP4332392B2 (ja) * 2003-09-12 2009-09-16 株式会社アドバンテスト 試験装置
DE10350356B3 (de) * 2003-10-29 2005-02-17 Infineon Technologies Ag Integrierte Schaltung, Testsystem und Verfahren zum Auslesen eines Fehlerdatums aus der integrierten Schaltung
DE10355296B3 (de) * 2003-11-27 2005-06-09 Infineon Technologies Ag Testeinrichtung zum Wafertest von digitalen Halbleiterschaltungen
EP1721174A4 (de) * 2004-03-05 2009-01-14 Qualitau Inc Doppelkanal-source-messungseinheit für die prüfung von halbleiterbauelementen
US7913002B2 (en) * 2004-08-20 2011-03-22 Advantest Corporation Test apparatus, configuration method, and device interface
US7046027B2 (en) 2004-10-15 2006-05-16 Teradyne, Inc. Interface apparatus for semiconductor device tester
US6978408B1 (en) * 2004-12-09 2005-12-20 International Business Machines Corporation Generating array bit-fail maps without a tester using on-chip trace arrays
US7367944B2 (en) 2004-12-13 2008-05-06 Tel Hashomer Medical Research Infrastructure And Services Ltd. Method and system for monitoring ablation of tissues
US20060132119A1 (en) * 2004-12-17 2006-06-22 Arc Radar And Communication Services, Llc Configurable test interface device
KR100694413B1 (ko) 2005-04-09 2007-03-12 주식회사 메모리앤테스팅 메모리 테스트 장치 및 그 테스트 방법
US7779311B2 (en) * 2005-10-24 2010-08-17 Rambus Inc. Testing and recovery in a multilayer device
US7539912B2 (en) 2005-12-15 2009-05-26 King Tiger Technology, Inc. Method and apparatus for testing a fully buffered memory module
JP4571076B2 (ja) * 2006-01-23 2010-10-27 富士通セミコンダクター株式会社 半導体装置の検査装置
US7523007B2 (en) * 2006-06-30 2009-04-21 Teradyne, Inc. Calibration device
KR100736675B1 (ko) * 2006-08-01 2007-07-06 주식회사 유니테스트 반도체 소자 테스트 장치
US7890822B2 (en) * 2006-09-29 2011-02-15 Teradyne, Inc. Tester input/output sharing
US7561027B2 (en) * 2006-10-26 2009-07-14 Hewlett-Packard Development Company, L.P. Sensing device
KR100891328B1 (ko) * 2007-01-04 2009-03-31 삼성전자주식회사 병렬 타입 반도체 집적회로 테스트 시스템 및 병렬 타입반도체 집적회로 테스트 방법
KR100824797B1 (ko) * 2007-02-16 2008-04-23 (주) 디시티 반도체 메모리모듈 번인 테스트 장치
US7620861B2 (en) * 2007-05-31 2009-11-17 Kingtiger Technology (Canada) Inc. Method and apparatus for testing integrated circuits by employing test vector patterns that satisfy passband requirements imposed by communication channels
US7757144B2 (en) * 2007-11-01 2010-07-13 Kingtiger Technology (Canada) Inc. System and method for testing integrated circuit modules comprising a plurality of integrated circuit devices
JP2008107366A (ja) * 2008-01-09 2008-05-08 Renesas Technology Corp インターフェイス回路
US7848899B2 (en) * 2008-06-09 2010-12-07 Kingtiger Technology (Canada) Inc. Systems and methods for testing integrated circuit devices
KR101315499B1 (ko) * 2009-06-29 2013-10-07 가부시키가이샤 어드밴티스트 시험 장치, 교정 방법 및 프로그램
KR20110012882A (ko) * 2009-07-31 2011-02-09 주식회사 하이닉스반도체 온도 정보 출력 회로 및 이를 이용한 반도체 메모리 장치
KR20110071254A (ko) * 2009-12-21 2011-06-29 삼성전자주식회사 시스템온칩 테스트 장치 및 이를 포함하는 시스템온칩
US8356215B2 (en) * 2010-01-19 2013-01-15 Kingtiger Technology (Canada) Inc. Testing apparatus and method for analyzing a memory module operating within an application system
US8918686B2 (en) 2010-08-18 2014-12-23 Kingtiger Technology (Canada) Inc. Determining data valid windows in a system and method for testing an integrated circuit device
US9003256B2 (en) 2011-09-06 2015-04-07 Kingtiger Technology (Canada) Inc. System and method for testing integrated circuits by determining the solid timing window
US8724408B2 (en) 2011-11-29 2014-05-13 Kingtiger Technology (Canada) Inc. Systems and methods for testing and assembling memory modules
US9117552B2 (en) 2012-08-28 2015-08-25 Kingtiger Technology(Canada), Inc. Systems and methods for testing memory
KR101234306B1 (ko) * 2012-08-30 2013-02-22 (주)아테코 오토 스트로브를 이용한 번인 테스트 방법
KR101522292B1 (ko) * 2013-07-31 2015-05-21 주식회사 유니테스트 메모리 테스트 동시 판정 시스템
US9295169B1 (en) 2013-09-16 2016-03-22 Advanced Testing Technologies, Inc. Common chassis for instrumentation
US9488673B1 (en) 2013-09-16 2016-11-08 Advanced Testing Technologies, Inc. Multi-standard instrumentation chassis
CN114496050A (zh) * 2020-10-27 2022-05-13 长鑫存储技术有限公司 存储器、存储器测试系统以及存储器测试方法
TWI755342B (zh) * 2021-07-16 2022-02-11 陽榮科技股份有限公司 用於檢測記憶體控制器的檢測裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676777A (en) * 1970-08-10 1972-07-11 Tektronix Inc Apparatus for automatically testing integrated circuit devices
US4293950A (en) * 1978-04-03 1981-10-06 Nippon Telegraph And Telephone Public Corporation Test pattern generating apparatus
US4450560A (en) * 1981-10-09 1984-05-22 Teradyne, Inc. Tester for LSI devices and memory devices
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
US4639919A (en) * 1983-12-19 1987-01-27 International Business Machines Corporation Distributed pattern generator
US4806852A (en) * 1984-09-07 1989-02-21 Megatest Corporation Automatic test system with enhanced performance of timing generators
JP2653566B2 (ja) * 1991-03-27 1997-09-17 株式会社東芝 半導体基板評価方法及び装置
US5457400A (en) * 1992-04-10 1995-10-10 Micron Technology, Inc. Semiconductor array having built-in test circuit for wafer level testing
US5390129A (en) * 1992-07-06 1995-02-14 Motay Electronics, Inc. Universal burn-in driver system and method therefor
US5617531A (en) * 1993-11-02 1997-04-01 Motorola, Inc. Data Processor having a built-in internal self test controller for testing a plurality of memories internal to the data processor
US5682472A (en) * 1995-03-17 1997-10-28 Aehr Test Systems Method and system for testing memory programming devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19928981B4 (de) * 1998-06-24 2006-07-13 Advantest Corp. Vorrichtung und Verfahren zum Testen von Halbleiterspeichern
DE102007016622A1 (de) * 2007-04-05 2008-10-09 Qimonda Ag Halbleiter-Bauelement-Test-Verfahren und -Test-System mit reduzierter Anzahl an Test-Kanälen

Also Published As

Publication number Publication date
KR20010023804A (ko) 2001-03-26
KR100371953B1 (ko) 2003-02-14
JP4937448B2 (ja) 2012-05-23
EP1012849B1 (de) 2003-01-02
WO1999013475A1 (en) 1999-03-18
US5794175A (en) 1998-08-11
JP2001516121A (ja) 2001-09-25
DE69810489D1 (de) 2003-02-06
EP1012849A1 (de) 2000-06-28

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