DE69629287D1 - Polyimidharzzusammensetzung - Google Patents

Polyimidharzzusammensetzung

Info

Publication number
DE69629287D1
DE69629287D1 DE69629287T DE69629287T DE69629287D1 DE 69629287 D1 DE69629287 D1 DE 69629287D1 DE 69629287 T DE69629287 T DE 69629287T DE 69629287 T DE69629287 T DE 69629287T DE 69629287 D1 DE69629287 D1 DE 69629287D1
Authority
DE
Germany
Prior art keywords
polyimide resin
polyimide
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69629287T
Other languages
English (en)
Other versions
DE69629287T2 (de
Inventor
Akira Tanaka
Satoshi Tazaki
Yasuhiro Yoneda
Kishio Yokouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Fujitsu Ltd
Original Assignee
Zeon Corp
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp, Fujitsu Ltd filed Critical Zeon Corp
Publication of DE69629287D1 publication Critical patent/DE69629287D1/de
Application granted granted Critical
Publication of DE69629287T2 publication Critical patent/DE69629287T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Paints Or Removers (AREA)
DE69629287T 1995-04-18 1996-04-17 Polyimidharzzusammensetzung Expired - Fee Related DE69629287T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11633695A JP3170174B2 (ja) 1995-04-18 1995-04-18 ポリイミド系樹脂組成物
JP11633695 1995-04-18
PCT/JP1996/001045 WO1996033239A1 (fr) 1995-04-18 1996-04-17 Composition de resine polyimide

Publications (2)

Publication Number Publication Date
DE69629287D1 true DE69629287D1 (de) 2003-09-04
DE69629287T2 DE69629287T2 (de) 2004-06-17

Family

ID=14684441

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69629287T Expired - Fee Related DE69629287T2 (de) 1995-04-18 1996-04-17 Polyimidharzzusammensetzung

Country Status (6)

Country Link
US (3) US6310135B1 (de)
EP (1) EP0822229B1 (de)
JP (1) JP3170174B2 (de)
KR (1) KR100442211B1 (de)
DE (1) DE69629287T2 (de)
WO (1) WO1996033239A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170174B2 (ja) * 1995-04-18 2001-05-28 日本ゼオン株式会社 ポリイミド系樹脂組成物
CN1522387A (zh) * 2001-05-30 2004-08-18 钟渊化学工业株式会社 光敏性树脂组合物及用该组合物的光敏性干膜抗蚀剂、光敏性射线遮挡膜
US20030171812A1 (en) * 2001-12-31 2003-09-11 Ilan Grunberg Minimally invasive modular support implant device and method
JP4517640B2 (ja) * 2003-09-04 2010-08-04 日立化成デュポンマイクロシステムズ株式会社 耐熱性感光性ポリイミド前駆体組成物及びそれを用いたパターン製造方法並びに電子部品
KR100562524B1 (ko) * 2003-10-21 2006-03-23 한국화학연구원 평탄화 특성이 우수한 감광성 투명 폴리아믹산 올리고머와이를 경화하여 제조된 폴리이미드 수지
JP4701673B2 (ja) * 2004-10-22 2011-06-15 トヨタ自動車株式会社 ブレーキシステム
JP4657899B2 (ja) * 2005-11-30 2011-03-23 富士通株式会社 レジストパターン厚肉化材料、レジストパターンの形成方法、半導体装置及びその製造方法
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
JPWO2008020469A1 (ja) * 2006-08-14 2010-01-07 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
EP2157209B1 (de) * 2008-07-31 2014-10-22 Rohm and Haas Electronic Materials LLC Hemmung der Hintergrundplattierung
CN102317862B (zh) * 2009-08-28 2013-08-14 株式会社Lg化学 可低温固化的光敏树脂组合物和用该组合物制备的干膜
JP5998546B2 (ja) * 2012-03-13 2016-09-28 三菱化学株式会社 カラーフィルタ用着色樹脂組成物、カラーフィルタ、液晶表示装置及び有機ｅｌ表示装置
JP5940843B2 (ja) * 2012-03-14 2016-06-29 四国化成工業株式会社 銅または銅合金の表面処理剤およびその利用
WO2014097594A1 (ja) 2012-12-21 2014-06-26 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体樹脂組成物
KR102214856B1 (ko) * 2012-12-21 2021-02-09 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치
JP6572770B2 (ja) 2013-10-09 2019-09-11 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、及びそれを用いた硬化膜の製造方法
JP7091881B2 (ja) * 2018-06-29 2022-06-28 Ｈｄマイクロシステムズ株式会社 樹脂組成物、硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN113574091A (zh) * 2019-03-15 2021-10-29 富士胶片株式会社 固化性树脂组合物、固化膜、层叠体、固化膜的制造方法、半导体器件及聚合物前体

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1803605A1 (de) * 1968-10-17 1970-05-21 Agfa Gevaert Ag Photographisches Material
US3615617A (en) * 1968-12-03 1971-10-26 Agfa Gevaert Ag Stabilized photographic material with tetrazole thiocarbonic acid ester
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
GB1463659A (en) * 1973-06-01 1977-02-02 Agfa Gevaert Development of exposed silver halide material in the presence of polyoxyalkylenes
JPS5932319B2 (ja) * 1974-03-22 1984-08-08 富士写真フイルム株式会社 記録材料
DE2437348B2 (de) 1974-08-02 1976-10-07 Ausscheidung in: 24 62 105 Verfahren zur herstellung von reliefstrukturen
USRE30186E (en) 1974-08-02 1980-01-08 Siemens Aktiengesellschaft Method for the preparation of relief structures
JPS5952822B2 (ja) 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS5839437B2 (ja) 1978-08-24 1983-08-30 岩崎通信機株式会社 ボタン電話装置における本電話機接続方式
JPS5541422A (en) 1978-09-18 1980-03-24 Fujitsu Ltd Encipherment treatment system
JPS5952822A (ja) 1982-09-21 1984-03-27 Toshiba Corp 永久磁石の製造法
JP2516897B2 (ja) * 1983-10-21 1996-07-24 信越化学工業株式会社 感光性組成物
JPS60157286A (ja) 1984-01-27 1985-08-17 株式会社日立製作所 フレキシブルプリント基板の製造方法
JPS6182326A (ja) * 1984-09-29 1986-04-25 Sony Corp 磁気記録媒体
JP2640470B2 (ja) 1987-08-19 1997-08-13 旭化成工業株式会社 新しい感光性組成物
JPH01174439A (ja) 1987-12-28 1989-07-11 Mitsui Toatsu Chem Inc フレキシブル金属箔積層材
CA1335817C (en) * 1988-08-24 1995-06-06 Hideaki Takahashi Precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
US4985343A (en) 1989-02-09 1991-01-15 Mitsubishi Rayon Co., Ltd. Crosslinking-curable resin composition
JP2821547B2 (ja) * 1989-10-11 1998-11-05 三菱レイヨン株式会社 架橋硬化型樹脂組成物
JPH02228359A (ja) 1989-03-01 1990-09-11 Hitachi Chem Co Ltd ポリアミド酸組成物
US4991285A (en) * 1989-11-17 1991-02-12 Rockwell International Corporation Method of fabricating multi-layer board
DE69030643T2 (de) * 1989-11-30 1997-09-25 Sumitomo Bakelite Co Lichtempfindliche Harzzusammensetzung und ihre Verwendung zur Herstellung eines Halbleiterapparats
US5346927A (en) 1990-11-26 1994-09-13 Toyo Kasei Kogyo Company, Ltd. Blowing agents of the tetrazoles and their derivatives
US5310862A (en) * 1991-08-20 1994-05-10 Toray Industries, Inc. Photosensitive polyimide precursor compositions and process for preparing same
JP2693670B2 (ja) * 1991-11-06 1997-12-24 住友ベークライト株式会社 感光性樹脂組成物
JPH05198559A (ja) 1992-01-21 1993-08-06 Toray Ind Inc ポリイミド・パタ−ンの形成方法
JP3102818B2 (ja) * 1992-04-16 2000-10-23 日本ジーイープラスチックス株式会社 レーザーマーキング用樹脂組成物
US5300403A (en) * 1992-06-18 1994-04-05 International Business Machines Corporation Line width control in a radiation sensitive polyimide
NL9300126A (nl) * 1993-01-22 1994-08-16 Od & Me Bv Substraatplaat voor vervaardiging van matrijs voor produktie van optische registratiedragers en werkwijze voor het vervaardigen daarvan.
US5756260A (en) * 1993-02-16 1998-05-26 Sumitomo Bakelite Company Limited Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same
JPH06242613A (ja) 1993-02-18 1994-09-02 Toray Ind Inc ポリイミドパターンの形成方法
US5587275A (en) * 1994-07-05 1996-12-24 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition and a process for forming a patterned polyimide film using the same
JP3378375B2 (ja) 1994-09-13 2003-02-17 日本ゼオン株式会社 感光性ポリイミド樹脂組成物
JP3378379B2 (ja) 1994-09-26 2003-02-17 日本ゼオン株式会社 感光性ポリイミド樹脂組成物
JP3170174B2 (ja) * 1995-04-18 2001-05-28 日本ゼオン株式会社 ポリイミド系樹脂組成物

Also Published As

Publication number Publication date
US6743851B2 (en) 2004-06-01
EP0822229A4 (de) 1998-07-15
KR100442211B1 (ko) 2004-10-14
JP3170174B2 (ja) 2001-05-28
JPH08286374A (ja) 1996-11-01
US20020035196A1 (en) 2002-03-21
DE69629287T2 (de) 2004-06-17
KR19990007871A (ko) 1999-01-25
US6734248B2 (en) 2004-05-11
US20020032273A1 (en) 2002-03-14
US6310135B1 (en) 2001-10-30
EP0822229A1 (de) 1998-02-04
WO1996033239A1 (fr) 1996-10-24
EP0822229B1 (de) 2003-07-30

Similar Documents

Publication Publication Date Title
DE69533393D1 (de) Epoxyharzzusammensetzung
DE69704686D1 (de) Kunstharzriemenscheibe
DE69629287D1 (de) Polyimidharzzusammensetzung
DK0697439T3 (da) Epoxyharpikssystem
DE69503151T2 (de) Polyimid
DE69619903D1 (de) Polyamidharzzusammensetzung
DE69730862D1 (de) Kunstharzmasse
DE69628891D1 (de) Polyacetalharzzusammensetzung
DE69618742T2 (de) Schaltungsanordnung
DE69611199T2 (de) Polyamidharzzusammensetzung
DE59610028D1 (de) Schleuderdüngerstreuer
ID17236A (id) Senyawa resin fenolat
DE59607444D1 (de) Trampolin-Bahn
DE69406606T2 (de) Polyimidharzzusammensetzung
DE69620843D1 (de) Polyamidharz-Zusammensetzung
DE69619622D1 (de) Schaltungsanordnung
NO962736D0 (no) Modifiserte harpikser
KR970004284U (ko) 수지쑥뜸기
KR970044696U (ko) 수지제 풀리
KR970004285U (ko) 수지침 시술용 침관
KR970004287U (ko) 수지침
KR960031586U (ko) 합성수지 침목
KR970027104U (ko) 수지침용 시술장치
KR970004291U (ko) 수지용 침
KR950022787U (ko) 수지운동기

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU LTD., KAWASAKI, KANAGAWA, JP

Owner name: NIPPON ZEON CO., LTD., TOKIO/TOKYO, JP

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee