DE69622251D1 - Elektrostatische Entladungsstruktur für eine Halbleiteranordnung - Google Patents

Elektrostatische Entladungsstruktur für eine Halbleiteranordnung

Info

Publication number
DE69622251D1
DE69622251D1 DE69622251T DE69622251T DE69622251D1 DE 69622251 D1 DE69622251 D1 DE 69622251D1 DE 69622251 T DE69622251 T DE 69622251T DE 69622251 T DE69622251 T DE 69622251T DE 69622251 D1 DE69622251 D1 DE 69622251D1
Authority
DE
Germany
Prior art keywords
semiconductor device
electrostatic discharge
discharge structure
electrostatic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69622251T
Other languages
English (en)
Other versions
DE69622251T2 (de
Inventor
Hyang-Ja Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE69622251D1 publication Critical patent/DE69622251D1/de
Application granted granted Critical
Publication of DE69622251T2 publication Critical patent/DE69622251T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69622251T 1995-12-30 1996-12-13 Elektrostatische Entladungsstruktur für eine Halbleiteranordnung Expired - Lifetime DE69622251T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950069728A KR100190008B1 (ko) 1995-12-30 1995-12-30 반도체 장치의 정전하 보호 장치

Publications (2)

Publication Number Publication Date
DE69622251D1 true DE69622251D1 (de) 2002-08-14
DE69622251T2 DE69622251T2 (de) 2003-03-13

Family

ID=19448555

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622251T Expired - Lifetime DE69622251T2 (de) 1995-12-30 1996-12-13 Elektrostatische Entladungsstruktur für eine Halbleiteranordnung

Country Status (7)

Country Link
US (1) US5760446A (de)
EP (1) EP0782192B1 (de)
JP (1) JPH09191080A (de)
KR (1) KR100190008B1 (de)
CN (1) CN1135619C (de)
DE (1) DE69622251T2 (de)
TW (1) TW329556B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507074B2 (en) * 1995-11-30 2003-01-14 Micron Technology, Inc. Structure for ESD protection in semiconductor chips
EP0864176B1 (de) 1995-11-30 2002-02-13 Micron Technology, Inc. Esd-schutzstruktur für halbleiterchips
KR100486223B1 (ko) * 1997-12-17 2005-08-01 삼성전자주식회사 반도체 장치의 입/출력 패드
US5847431A (en) * 1997-12-18 1998-12-08 Intel Corporation Reduced capacitance transistor with electro-static discharge protection structure
DE69736714D1 (de) 1997-12-31 2006-11-02 St Microelectronics Srl ESD-Schutznetzwerk auf Halbleiterschaltungsstrukturen
EP0932203B1 (de) * 1997-12-31 2009-02-18 STMicroelectronics S.r.l. Methode und Schaltung zur Verbesserung der Eigenschaften eines ESD-Schutzes für integrierte Halbleiterschaltungen
JP3123984B2 (ja) 1998-07-31 2001-01-15 日本電気アイシーマイコンシステム株式会社 半導体集積回路装置
DE69939684D1 (de) * 1998-08-04 2008-11-20 Nxp Bv Mit esd-schutz ausgestatteter integrierter schaltkreis
US6049112A (en) * 1998-09-14 2000-04-11 Intel Corporation Reduced capacitance transistor with electro-static discharge protection structure and method for forming the same
US6455898B1 (en) * 1999-03-15 2002-09-24 Macronix International Co., Ltd. Electrostatic discharge input protection for reducing input resistance
US6222237B1 (en) * 1999-05-21 2001-04-24 United Microelectronics Corp. Structure of electrostatic discharge protection device
TW426973B (en) * 1999-10-16 2001-03-21 Winbond Electronics Corp Latch up protection circuit and its method suitable for use in multi power supply integrated circuit
US6455902B1 (en) 2000-12-06 2002-09-24 International Business Machines Corporation BiCMOS ESD circuit with subcollector/trench-isolated body mosfet for mixed signal analog/digital RF applications
US7106568B2 (en) * 2004-08-27 2006-09-12 United Microelectronics Corp. Substrate-triggered ESD circuit by using triple-well
US7317204B2 (en) * 2005-01-13 2008-01-08 Samsung Electronics Co., Ltd. Test structure of semiconductor device
CN101281909B (zh) * 2008-05-28 2010-04-21 浙江大学 Nmos管嵌入式双向可控硅静电防护器件
US8378422B2 (en) * 2009-02-06 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge protection device comprising a plurality of highly doped areas within a well
JP5849670B2 (ja) * 2011-12-09 2016-02-03 セイコーエプソン株式会社 半導体装置
US8853784B2 (en) * 2012-01-19 2014-10-07 Globalfoundries Singapore Pte. Ltd. ESD protection circuit
CN103378084B (zh) * 2012-04-13 2016-01-20 南亚科技股份有限公司 存储装置
US20140246725A1 (en) * 2013-03-04 2014-09-04 Samsung Electronics Co., Ltd. Integrated Circuit Memory Devices Including Parallel Patterns in Adjacent Regions
CN103812483A (zh) * 2014-01-13 2014-05-21 智坤（江苏）半导体有限公司 Cmos射频开关
JP5669119B1 (ja) * 2014-04-18 2015-02-12 株式会社パウデック 半導体素子、電気機器、双方向電界効果トランジスタおよび実装構造体
US9484977B2 (en) * 2014-05-14 2016-11-01 Dsp Group, Ltd. RF transformer based TX/RX integrated RF switch
CN106158832A (zh) * 2015-04-01 2016-11-23 联华电子股份有限公司 半导体结构
DE102016115286A1 (de) * 2016-08-17 2018-02-22 Infineon Technologies Ag Integrierte Schaltung mit Verstärker-MOSFET
US10134722B2 (en) * 2017-04-12 2018-11-20 Hong Kong Applied Science and Technology Research Institute Company Limited Embedded PMOS-trigger silicon controlled rectifier (SCR) with suppression rings for electro-static-discharge (ESD) protection
US11031462B1 (en) * 2019-12-23 2021-06-08 Nanya Technology Corporation Semiconductor structure with improved guard ring structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165369A (ja) * 1982-03-26 1983-09-30 Toshiba Corp 入力保護回路
JPS61281545A (ja) * 1985-06-06 1986-12-11 Fuji Electric Co Ltd バイポ−ラ・ｃｍｏｓ半導体装置
JPH0685422B2 (ja) * 1985-11-07 1994-10-26 三菱電機株式会社 半導体集積回路
JP2509690B2 (ja) * 1989-02-20 1996-06-26 株式会社東芝 半導体装置
JPH0744231B2 (ja) * 1989-11-10 1995-05-15 株式会社東芝 半導体集積回路およびその製造方法

Also Published As

Publication number Publication date
JPH09191080A (ja) 1997-07-22
CN1154578A (zh) 1997-07-16
KR970053883A (ko) 1997-07-31
CN1135619C (zh) 2004-01-21
TW329556B (en) 1998-04-11
DE69622251T2 (de) 2003-03-13
KR100190008B1 (ko) 1999-06-01
EP0782192A1 (de) 1997-07-02
US5760446A (en) 1998-06-02
EP0782192B1 (de) 2002-07-10

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